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  • ISO764xFM Low-Power Quad-Channel Digital Isolators

    • SLLSE89G September   2011  – January 2015 ISO7640FM , ISO7641FM

      UNLESS OTHERWISE NOTED, this document contains PRODUCTION DATA.  

  • CONTENTS
  • SEARCH
  • ISO764xFM Low-Power Quad-Channel Digital Isolators
  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics: VCC1 and VCC2 at 5 V ±10%
    6. 6.6  Electrical Characteristics: VCC1 at 5 V ±10% and VCC2 at 3.3 V ±10%
    7. 6.7  Electrical Characteristics: VCC1 at 3.3 V ±10% and VCC2 at 5 V ±10%
    8. 6.8  Electrical Characteristics: VCC1 and VCC2 at 3.3 V ±10%
    9. 6.9  Electrical Characteristics: VCC1 and VCC2 at 2.7 V
    10. 6.10 Supply Current: VCC1 and VCC2 at 5 V ±10%
    11. 6.11 Supply Current: VCC1 at 5 V ±10% and VCC2 at 3.3 V ±10%
    12. 6.12 Supply Current: VCC1 at 3.3 V ±10% and VCC2 at 5 V ±10%
    13. 6.13 Supply Current: VCC1 and VCC2 at 3.3 V ±10%
    14. 6.14 Supply Current: VCC1 and VCC2 at 2.7 V
    15. 6.15 Switching Characteristics: VCC1 and VCC2 at 5 V ±10%
    16. 6.16 Switching Characteristics: VCC1 at 5 V ±10% and VCC2 at 3.3 V ±10%
    17. 6.17 Switching Characteristics: VCC1 at 3.3 V ±10% and VCC2 at 5 V ±10%
    18. 6.18 Switching Characteristics: VCC1 and VCC2 at 3.3 V ±10%
    19. 6.19 Switching Characteristics: VCC1 and VCC2 at 2.7 V
    20. 6.20 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 IEC Insulation and Safety-Related Specifications for DW-16 Package
      2. 8.3.2 DIN V VDE V 0884-10 (VDE V 0884-10) Insulation Characteristics
      3. 8.3.3 Safety Limiting Values
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Typical Supply Current Equations
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Related Links
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information
  14. IMPORTANT NOTICE

Package Options

Mechanical Data (Package|Pins)
  • DW|16
    • MSOI003I
Thermal pad, mechanical data (Package|Pins)
  • DW|16
    • QFND505A
Orderable Information
  • sllse89g_oa
  • sllse89g_pm
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DATA SHEET

ISO764xFM Low-Power Quad-Channel Digital Isolators

1 Features

  • Signaling Rate: 150 Mbps
  • Low Power Consumption, Typical ICC per Channel (3.3-V Supplies):
    • ISO7640FM: 2 mA at 25 Mbps
    • ISO7641FM: 2.4 mA at 25 Mbps
  • Low Propagation Delay: 7-ns Typical
  • Output Defaults to Low-State in Fail-Safe Mode
  • Wide Temperature Range: –40°C to 125°C
  • 50-KV/µs Transient Immunity, Typical
  • Long Life With SiO2 Isolation Barrier
  • Operates From 2.7-V, 3.3-V, and 5-V Supply and Logic Levels
  • Wide Body SOIC-16 Package
  • Safety and Regulatory Approvals
    • 6000 VPK / 4243 VRMS for 1 Minute per UL 1577
    • VDE 6000 VPK Transient Overvoltage, 1414 VPK Working Voltage per DIN V VDE V 0884-10 (VDE V 0884-10):2006-12
    • CSA Component Acceptance Notice 5A, IEC 60950-1, IEC 61010-1, and IEC 60601-1 End Equipment Standards
    • TUV 5 KVRMS Reinforced Insulation per EN/UL/CSA 60950-1 and EN/UL/CSA 61010-1
    • CQC Reinforced Insulation per GB4943.1-2011

2 Applications

  • Optocoupler Replacement in:
    • Industrial Fieldbus
      • Profibus
      • Modbus
      • DeviceNet™ Data Buses
    • Servo Control Interface
    • Motor Control
    • Power Supplies
    • Battery Packs

3 Description

ISO7640FM and ISO7641FM provide galvanic isolation up to 6 KVPK for 1 minute per UL and VDE. These devices are also certified up to 5-KVRMS Reinforced isolation at a working voltage of 400 VRMS per end equipment standards EN/UL/CSA 60950-1 and 61010-1. ISO7640F and ISO7641F are quad-channel isolators; ISO7640F has four forward and ISO7641F has three forward and one reverse-direction channels. Suffix F indicates that output defaults to Low-state in fail-safe conditions (see Table 4). M-Grade devices are high-speed isolators capable of 150-Mbps data rate with fast propagation delays.

Each isolation channel has a logic input and output buffer separated by a silicon dioxide (SiO2) insulation barrier. Used in conjunction with isolated power supplies, these devices prevent noise currents on a data bus or other circuits from entering the local ground and interfering with or damaging sensitive circuitry. The devices have TTL input thresholds and can operate from 2.7-V, 3.3-V, and 5-V supplies. All inputs are 5-V tolerant when supplied from 3.3-V or 2.7-V supplies.

Device Information(1)

PART NUMBER PACKAGE BODY SIZE (NOM)
ISO7640FM SOIC (16) 10.30 mm × 7.50 mm
ISO7641FM
  1. For all available packages, see the orderable addendum at the end of the data sheet.

Simplified Schematic

ISO7640FM ISO7641FM Simplified_Schematic_sllsei6.gif

4 Revision History

Changes from F Revision (September 2013) to G Revision

  • Added Pin Configuration and Functions section, ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section Go
  • VDE standard changed to DIN V VDE V 0884-10 (VDE V 0884-10):2006-12. Go

Changes from E Revision (January 2013) to F Revision

  • Changed the REGULATORY INFORMATION table, TUV column From: Certificate Number: U8V 13 07 77311 009 To: Certificate Number: U8V 13 09 77311 010Go

Changes from D Revision (July 2012) to E Revision

  • Changed Z to Undetermined in the OUTPUT (OUTx) column of the FUNCTION TABLEGo

Changes from C Revision (January 2012) to D Revision

  • Deleted devices: ISO7631FM, ISO7631FC, ISO7640FC, ISO7641FC from the data sheetGo
  • Changed the Title From: Low Power Triple and Quad Channels Digital Isolators To: Low Power Quad Channels Digital IsolatorsGo
  • Deleted devices from the Features ListGo
  • Changed the DESCRIPTION Go
  • Changed EN1 and EN2 Pin DescriptionsGo
  • Changed the ELECTRICAL, SWITCHING, and SUPPLY CURRENT CHARACTERISTICS tablesGo
  • Changed the ELECTRICAL, SWITCHING, and SUPPLY CURRENT CHARACTERISTICS tablesGo
  • Changed the ELECTRICAL, SWITCHING, and SUPPLY CURRENT CHARACTERISTICS tablesGo
  • Changed the ELECTRICAL, SWITCHING, and SUPPLY CURRENT CHARACTERISTICS tablesGo
  • Changed the ELECTRICAL, SWITCHING, and SUPPLY CURRENT CHARACTERISTICS tablesGo
  • Changed the TYPICAL CHARACTERISTICS sectionGo
  • Deleted device from the Available Options TableGo
  • Deleted devices from the TYPICAL SUPPLY CURRENT EQUATIONS sectionGo

Changes from B Revision (December 2011) to C Revision

  • Changed Safety and Regulatory Approvals bullet From: 6000 VPK / 4243 VRMS for 1 Minute per UL1577 (pending) To: 6000 VPK / 4243 VRMS for 1 Minute per UL 1577 (approved)Go
  • Changed Description text From: The devices have TTL input thresholds and can operate from 2.7 V, 3.3 V and 5 V supplies. To: The devices have TTL input thresholds and can operate from 2.7 V (M-Grade), 3.3 V and 5 V supplies.Go
  • Changed the ESD standardsGo
  • Changed the typical characteristics sectionGo
  • Deleted the Product Preview Note From the Available Options TableGo

Changes from A Revision (October 2011) to B Revision

  • Changed feature bullet From: ISO7641FC: 1.2 mA at 10 Mbps To: ISO7641FC: 1.3 mA at 10 MbpsGo
  • Changed Safety and Regulatory Approvals bullet From: 6 KVPK for 1 Minute per UL1577 and VDE (Pending) To: 6000 VPK / 4243 VRMS for 1 Minute per UL 1577 (pending) Go
  • Changed Safety and Regulatory Approvals bullet From: To: 6000 VPK / 4243 VRMS for 1 Minute per UL 1577 (approved)Go
  • Changed Safety and Regulatory Approvals bullet From: CSA Component Acceptance Notice 5A, IEC 60601-1 Medical Standard (pending) To: CSA Component Acceptance Notice 5A, IEC 60601-1 Medical Standard (approved) Go
  • Changed all the ELECTRICAL CHARACTERISTICS tablesGo
  • Changed the SWITCHING CHARACTERISTICS table ISO7640F and ISO7641F C-Grade valuesGo
  • Changed the SWITCHING CHARACTERISTICS table ISO7640F and ISO7641F C-Grade valuesGo
  • Changed the SWITCHING CHARACTERISTICS table ISO7640F and ISO7641F C-Grade valuesGo
  • Changed the SWITCHING CHARACTERISTICS table ISO7640F and ISO7641F C-Grade valuesGo
  • Changed the SWITCHING CHARACTERISTICS table ISO7640F and ISO7641F C-Grade valuesGo
  • Changed all the SWITCHING CHARACTERISTICS tablesGo
  • Changed the IEC 60664-1 Ratings TableGo

Changes from * Revision (September 2011) to A Revision

  • Changed Figure 11 - From: 0 V or VCC To: IN = VCCGo
  • Added Note (1) "Per JEDEC package dimensions" to the IEC INSULATION AND SAFETY-RELATED SPECIFICATIONS FOR DW-16 PACKAGE tableGo
  • Changed L(I01) Min Value From: 8 mm To: 8.3 mmGo
  • Changed L(I02) Min Value From: 7.8 mm To: 8.1 mmGo
  • Added pinout for ISO7641 and ISO7631Go

5 Pin Configuration and Functions

DW Package
16-Pin SOIC
Top View
ISO7640FM ISO7641FM pos_llse89.gif

Pin Functions

PIN I/O DESCRIPTION
NAME ISO7640 ISO7641
EN 10 - I Enables (when High or Open) or Disables (when Low) OUTA, OUTB, OUTC and OUTD of ISO7640
EN1 - 7 I Enables (whenHigh or Open) or Disables (when Low) OUTD of ISO7641
EN2 - 10 I Enables (when High or Open) or Disables (when Low) OUTA, OUTB, and OUTC of ISO7641
GND1 2 2 – Ground connection for VCC1
8 8
GND2 9 9 – Ground connection for VCC2
15 15
INA 3 3 I Input, channel A
INB 4 4 I Input, channel B
INC 5 5 I Input, channel C
IND 6 11 I Input, channel D
NC 7 - - No Connect pins are floating with no internal connection
OUTA 14 14 O Output, channel A
OUTB 13 13 O Output, channel B
OUTC 12 12 O Output, channel C
OUTD 11 6 O Output, channel D
VCC1 1 1 – Power supply, VCC1
VCC2 16 16 – Power supply, VCC2

6 Specifications

6.1 Absolute Maximum Ratings(1)

MIN MAX UNIT
Supply voltage(2) VCC1, VCC2 –0.5 6 V
Voltage INx, OUTx, ENx –0.5 VCC + 0.5(3) V
Output Current, IO –15 15 mA
Maximum junction temperature, TJ 150 °C
Storage temperature, Tstg –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values except differential I/O bus voltages are with respect to the local ground terminal (GND1 or GND2) and are peak voltage values.
(3) Maximum voltage must not exceed 6 V.

6.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1) ±4000 V
Charged device model (CDM), per JEDEC specification JESD22-C101, all pins(2) ±1500
Machine model, per JEDEC JESD22-A115-A ±200
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

MIN NOM MAX UNIT
VCC1, VCC2 Supply voltage 2.7 5.5 V
IOH High-level output current –4 mA
IOL Low-level output current 4 mA
VIH High-level input voltage 2 5.5 V
VIL Low-level input voltage 0 0.8 V
tui Input pulse duration ≥3-V Operation 6.67 ns
<3-V Operation 10
1 / tui Signaling rate ≥3-V Operation 0 150 Mbps
<3-V Operation 0 100
TJ Junction temperature –40 136 °C
TA Ambient temperature –40 25 125 °C

6.4 Thermal Information

THERMAL METRIC(1) ISO76xx UNIT
DW (SOIC)
16 PINS
RθJA Junction-to-ambient thermal resistance 72 °C/W
RθJC(top) Junction-to-case(top) thermal resistance 38
RθJB Junction-to-board thermal resistance 39
ψJT Junction-to-top characterization parameter 9.4
PD Maximum Device Power Dissipation VCC1 = VCC2 = 5.5V, TJ = 150°C, CL = 15 pF
Input a 75-MHz 50% duty cycle square wave		 399 mW
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

6.5 Electrical Characteristics: VCC1 and VCC2 at 5 V ±10%

VCC1 and VCC2 at 5 V ±10% (over recommended operating conditions unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VOH High-level output voltage IOH = –4 mA; see Figure 9 VCCO(1) –0.8 4.8 V
IOH = –20 μA; see Figure 9 VCCO(1) –0.1 5
VOL Low-level output voltage IOL = 4 mA; see Figure 9 0.2 0.4 V
IOL = 20 μA; see Figure 9 0 0.1
VI(HYS) Input threshold voltage hysteresis 450 mV
IIH High-level input current VIH = VCC at INx or ENx 10 μA
IIL Low-level input current VIL = 0 V at INx or ENx –10
CMTI Common-mode transient immunity VI = VCC or 0 V; see Figure 12 25 75 kV/μs
(1) VCCO is the supply voltage, VCC1 or VCC2, for the output channel that is being measured.

6.6 Electrical Characteristics: VCC1 at 5 V ±10% and VCC2 at 3.3 V ±10%

VCC1 at 5 V ±10% and VCC2 at 3.3 V ±10% (over recommended operating conditions unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VOH High-level output voltage IOH = –4 mA; see Figure 9 OUTx on VCC1 (5V) side VCC1 – 0.8 4.8 V
OUTx on VCC2 (3.3V) side VCC2 – 0.4 3
IOH = –20 μA; see Figure 9 OUTx on VCC1 (5V) side VCC1 – 0.1 5
OUTx on VCC2 (3.3V) side VCC2 – 0.1 3.3
VOL Low-level output voltage IOL = 4 mA; see Figure 9 0.2 0.4 V
IOL = 20 μA; see Figure 9 0 0.1
VI(HYS) Input threshold voltage hysteresis 430 mV
IIH High-level input current VIH = VCC at INx or ENx 10 μA
IIL Low-level input current VIL = 0 V at INx or ENx –10
CMTI Common-mode transient immunity VI = VCC or 0 V; see Figure 12 25 50 kV/μs

6.7 Electrical Characteristics: VCC1 at 3.3 V ±10% and VCC2 at 5 V ±10%

VCC1 at 3.3 V ±10% and VCC2 at 5 V ±10% (over recommended operating conditions unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VOH High-level output voltage IOH = –4 mA; see Figure 9 OUTx on VCC1 (3.3 V) side VCC1–0.4 3 V
OUTx on VCC2 (5 V) side VCC2–0.8 4.8
IOH = –20 μA; see Figure 9 OUTx on VCC1 (3.3 V) side VCC1–0.1 3.3
OUTx on VCC2 (5 V) side VCC2–0.1 5
VOL Low-level output voltage IOL = 4 mA; see Figure 9 0.2 0.4 V
IOL = 20 μA; see Figure 9 0 0.1
VI(HYS) Input threshold voltage hysteresis 430 mV
IIH High-level input current VIH = VCC at INx or ENx 10 μA
IIL Low-level input current VIL = 0 V at INx or ENx –10
CMTI Common-mode transient immunity VI = VCC or 0 V; see Figure 12 25 50 kV/μs

6.8 Electrical Characteristics: VCC1 and VCC2 at 3.3 V ±10%

VCC1 and VCC2 at 3.3 V ± 10% (over recommended operating conditions unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VOH High-level output voltage IOH = –4 mA; see Figure 9 VCCO(1) – 0.4 3 V
IOH = –20 μA; see Figure 9 VCCO(1) – 0.1 3.3
VOL Low-level output voltage IOL = 4 mA; see Figure 9 0.2 0.4 V
IOL = 20 μA; see Figure 9 0 0.1
VI(HYS) Input threshold voltage hysteresis 425 mV
IIH High-level input current VIH = VCC at INx or ENx 10 μA
IIL Low-level input current VIL = 0 V at INx or ENx –10
CMTI Common-mode transient immunity VI = VCC or 0 V; see Figure 12 25 50 kV/μs
(1) VCCO is the supply voltage, VCC1 or VCC2, for the output channel that is being measured.

6.9 Electrical Characteristics: VCC1 and VCC2 at 2.7 V

VCC1 and VCC2 at 2.7 V(1) (over recommended operating conditions unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VOH High-level output voltage IOH = –4 mA; see Figure 9 VCCO(2) – 0.5 2.4 V
IOH = –20 μA; see Figure 9 VCCO(2) – 0.1 2.7
VOL Low-level output voltage IOL = 4 mA; see Figure 9 0.2 0.4 V
IOL = 20 μA; see Figure 9 0 0.1
VI(HYS) Input threshold voltage hysteresis 350 mV
IIH High-level input current VIH = VCC at INx or ENx 10 μA
IIL Low-level input current VIL = 0 V at INx or ENx –10
CMTI Common-mode transient immunity VI = VCC or 0 V; see Figure 12 25 50 kV/μs
(1) For 2.7-V operation, max data rate is 100 Mbps.
(2) VCCO is the supply voltage, VCC1 or VCC2, for the output channel that is being measured.

6.10 Supply Current: VCC1 and VCC2 at 5 V ±10%

VCC1 and VCC2 at 5 V ±10% (over recommended operating conditions unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
ISO7640FM
ICC1 Disable EN = 0 V 0.6 1.2 mA
ICC2 4.5 6.6
ICC1 DC to 1 Mbps DC Signal: VI = VCC or 0 V,
AC Signal: All channels switching with square wave clock input; CL = 15 pF		 0.7 1.3
ICC2 4.6 6.7
ICC1 10 Mbps 1.1 2
ICC2 6.6 10.5
ICC1 25 Mbps 1.9 3
ICC2 9.7 14.7
ICC1 150 Mbps 8.2 14.5
ICC2 35 58
ISO7641FM
ICC1 Disable EN1 = EN2 = 0 V 2.6 4.2 mA
ICC2 4.2 6.8
ICC1 DC to 1 Mbps DC Signal: VI = VCC or 0 V,
AC Signal: All channels switching with square wave clock input; CL = 15 pF		 2.7 4.3
ICC2 4.3 6.9
ICC1 10 Mbps 3.6 4.9
ICC2 6 8.2
ICC1 25 Mbps 5.1 6.6
ICC2 8.8 11.4
ICC1 150 Mbps 17 22
ICC2 31 42

6.11 Supply Current: VCC1 at 5 V ±10% and VCC2 at 3.3 V ±10%

VCC1 at 5 V ±10% and VCC2 at 3.3 V ±10% (over recommended operating conditions unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
ISO7640FM
ICC1 Disable EN = 0 V 0.6 1.2 mA
ICC2 3.6 5.1
ICC1 DC to 1 Mbps DC Signal: VI = VCC or 0 V,
AC Signal: All channels switching with square wave clock input; CL = 15 pF		 0.7 1.3
ICC2 3.7 5.2
ICC1 10 Mbps 1.1 2
ICC2 5 7.1
ICC1 25 Mbps 1.9 3
ICC2 6.9 11
ICC1 150 Mbps 8.2 14.5
ICC2 24 40
ISO7641FM
ICC1 Disable EN1 = EN2 = 0 V 2.6 4.2 mA
ICC2 3.2 4.9
ICC1 DC to 1 Mbps DC Signal: VI = VCC or 0 V,
AC Signal: All channels switching with square wave clock input; CL = 15 pF		 2.7 4.3
ICC2 3.3 5
ICC1 10 Mbps 3.6 4.9
ICC2 4.4 5.8
ICC1 25 Mbps 5.1 6.6
ICC2 6.1 7.6
ICC1 150 Mbps 17 22
ICC2 20.6 26.5

6.12 Supply Current: VCC1 at 3.3 V ±10% and VCC2 at 5 V ±10%

VCC1 at 3.3 V ±10% and VCC2 at 5 V ±10% (over recommended operating conditions unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
ISO7640FM
ICC1 Disable EN = 0 V 0.35 0.7 mA
ICC2 4.5 6.6
ICC1 DC to 1 Mbps DC Signal: VI = VCC or 0 V,
AC Signal: All channels switching with square wave clock input; CL = 15 pF		 0.4 0.8
ICC2 4.6 6.7
ICC1 10 Mbps 0.7 1.2
ICC2 6.6 10.5
ICC1 25 Mbps 1.1 2
ICC2 9.7 14.7
ICC1 150 Mbps 5 8.5
ICC2 35 58
ISO7641FM
ICC1 Disable EN1 = EN2 = 0 V 1.9 2.9 mA
ICC2 4.2 6.8
ICC1 DC to 1 Mbps DC Signal: VI = VCC or 0 V,
AC Signal: All channels switching with square wave clock input; CL = 15 pF		 2 3
ICC2 4.3 6.9
ICC1 10 Mbps 2.5 3.5
ICC2 6 8.2
ICC1 25 Mbps 3.4 4.5
ICC2 8.8 11.4
ICC1 150 Mbps 10.5 14.5
ICC2 31 42

6.13 Supply Current: VCC1 and VCC2 at 3.3 V ±10%

VCC1 and VCC2 at 3.3 V ±10% (over recommended operating conditions unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
ISO7640FM
ICC1 Disable EN = 0 V 0.35 0.7 mA
ICC2 3.6 5.1
ICC1 DC to 1 Mbps DC Signal: VI = VCC or 0 V,
AC Signal: All channels switching with square wave clock input; CL = 15 pF		 0.4 0.8
ICC2 3.7 5.2
ICC1 10 Mbps 0.7 1.2
ICC2 5 7.1
ICC1 25 Mbps 1.1 2
ICC2 6.9 11
ICC1 150 Mbps 5 8.5
ICC2 24 40
ISO7641FM
ICC1 Disable EN1 = EN2 = 0 V 1.9 2.9 mA
ICC2 3.2 4.9
ICC1 DC to 1 Mbps DC Signal: VI = VCC or 0 V,
AC Signal: All channels switching with square wave clock input; CL = 15 pF		 2 3
ICC2 3.3 5
ICC1 10 Mbps 2.5 3.5
ICC2 4.4 5.8
ICC1 25 Mbps 3.4 4.5
ICC2 6.1 7.6
ICC1 150 Mbps 10.5 14.5
ICC2 20.6 26.5

6.14 Supply Current: VCC1 and VCC2 at 2.7 V

VCC1 and VCC2 at 2.7 V (over recommended operating conditions unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
ISO7640FM
ICC1 Disable EN = 0 V 0.2 0.6 mA
ICC2 3.3 5
ICC1 DC to 1 Mbps DC Signal: VI = VCC or 0 V,
AC Signal: All channels switching with square wave clock input; CL = 15 pF		 0.2 0.7
ICC2 3.4 5.1
ICC1 10 Mbps 0.4 1.1
ICC2 4.4 6.8
ICC1 25 Mbps 0.8 1.8
ICC2 6 9.5
ICC1 100 Mbps 2.7 5
ICC2 14.2 21
ISO7641FM
ICC1 Disable EN1 = EN2 = 0 V 1.6 2.4 mA
ICC2 2.8 4.1
ICC1 DC to 1 Mbps DC Signal: VI = VCC or 0 V,
AC Signal: All channels switching with square wave clock input; CL = 15 pF		 1.7 2.5
ICC2 2.9 4.2
ICC1 10 Mbps 2.1 3
ICC2 3.8 5
ICC1 25 Mbps 2.8 3.8
ICC2 5.2 6.7
ICC1 100 Mbps 6.4 7.5
ICC2 11.8 15.5

6.15 Switching Characteristics: VCC1 and VCC2 at 5 V ±10%

VCC1 and VCC2 at 5 V ±10% (over recommended operating conditions unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
tPLH, tPHL Propagation delay time See Figure 9 3.5 7 10.5 ns
PWD(1) Pulse width distortion |tPHL – tPLH| 2
tsk(o)(2) Channel-to-channel output skew time Same-direction Channels 2
Opposite-direction Channels 3
tsk(pp)(3) Part-to-part skew time 4.5
tr Output signal rise time See Figure 9 1.6 ns
tf Output signal fall time 1
tPHZ Disable Propagation Delay, high-to-high impedance output See Figure 10 5 16 ns
tPLZ Disable Propagation Delay, low-to-high impedance output 5 16
tPZH Enable Propagation Delay, high impedance-to-high output 4 16
tPZL Enable Propagation Delay, high impedance-to-low output 4 16
tfs Fail-safe output delay time from input data or power loss See Figure 11 9.5 μs
(1) Also known as Pulse Skew.
(2) tsk(o) is the skew between outputs of a single device with all driving inputs connected together and the outputs switching in the same direction while driving identical loads.
(3) tsk(pp) is the magnitude of the difference in propagation delay times between any terminals of different devices switching in the same direction while operating at identical supply voltages, temperature, input signals and loads.

6.16 Switching Characteristics: VCC1 at 5 V ±10% and VCC2 at 3.3 V ±10%

VCC1 at 5 V ±10% and VCC2 at 3.3 V ±10% (over recommended operating conditions unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
tPLH, tPHL Propagation delay time See Figure 9 4 8 13 ns
PWD(1) Pulse width distortion |tPHL – tPLH| 2
tsk(o)(2) Channel-to-channel output skew time Same-direction Channels 2.5
Opposite-direction Channels 3.5
tsk(pp)(3) Part-to-part skew time 6
tr Output signal rise time See Figure 9 2 ns
tf Output signal fall time 1.2
tPHZ Disable Propagation Delay, high-to-high impedance output See Figure 10 6.5 17 ns
tPLZ Disable Propagation Delay, low-to-high impedance output 6.5 17
tPZH Enable Propagation Delay, high impedance-to-high output 5.5 17
tPZL Enable Propagation Delay, high impedance-to-low output 5.5 17
tfs Fail-safe output delay time from input data or power loss See Figure 11 9.5 μs
(1) Also known as Pulse Skew.
(2) tsk(o) is the skew between outputs of a single device with all driving inputs connected together and the outputs switching in the same direction while driving identical loads.
(3) tsk(pp) is the magnitude of the difference in propagation delay times between any terminals of different devices switching in the same direction while operating at identical supply voltages, temperature, input signals and loads.

6.17 Switching Characteristics: VCC1 at 3.3 V ±10% and VCC2 at 5 V ±10%

VCC1 at 3.3 V ±10% and VCC2 at 5 V ±10% (over recommended operating conditions unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
tPLH, tPHL Propagation delay time See Figure 9 4 7.5 12.5 ns
PWD(1) Pulse width distortion |tPHL – tPLH| 2
tsk(o)(2) Channel-to-channel output skew time Same-direction Channels 2.5
Opposite-direction Channels 3.5
tsk(pp)(3) Part-to-part skew time 6
tr Output signal rise time See Figure 9 1.7 ns
tf Output signal fall time 1.1
tPHZ Disable Propagation Delay, high-to-high impedance output See Figure 10 5.5 17 ns
tPLZ Disable Propagation Delay, low-to-high impedance output 5.5 17
tPZH Enable Propagation Delay, high impedance-to-high output 4.5 17
tPZL Enable Propagation Delay, high impedance-to-low output 4.5 17
tfs Fail-safe output delay time from input data or power loss See Figure 11 9.5 μs
(1) Also known as Pulse Skew.
(2) tsk(o) is the skew between outputs of a single device with all driving inputs connected together and the outputs switching in the same direction while driving identical loads.
(3) tsk(pp) is the magnitude of the difference in propagation delay times between any terminals of different devices switching in the same direction while operating at identical supply voltages, temperature, input signals and loads.

6.18 Switching Characteristics: VCC1 and VCC2 at 3.3 V ±10%

VCC1 and VCC2 at 3.3 V ±10% (over recommended operating conditions unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
tPLH, tPHL Propagation delay time See Figure 9 4 8.5 14 ns
PWD(1) Pulse width distortion |tPHL – tPLH| 2
tsk(o)(2) Channel-to-channel output skew time Same-direction Channels 3
Opposite-direction Channels 4
tsk(pp)(3) Part-to-part skew time 6.5
tr Output signal rise time See Figure 9 2 ns
tf Output signal fall time 1.3
tPHZ Disable Propagation Delay, high-to-high impedance output See Figure 10 6.5 17 ns
tPLZ Disable Propagation Delay, low-to-high impedance output 6.5 17
tPZH Enable Propagation Delay, high impedance-to-high output 5.5 17
tPZL Enable Propagation Delay, high impedance-to-low output 5.5 17
tfs Fail-safe output delay time from input data or power loss See Figure 11 9.2 μs
(1) Also known as Pulse Skew.
(2) tsk(o) is the skew between outputs of a single device with all driving inputs connected together and the outputs switching in the same direction while driving identical loads.
(3) tsk(pp) is the magnitude of the difference in propagation delay times between any terminals of different devices switching in the same direction while operating at identical supply voltages, temperature, input signals and loads.

6.19 Switching Characteristics: VCC1 and VCC2 at 2.7 V

VCC1 and VCC2 at 2.7 V (over recommended operating conditions unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
tPLH, tPHL Propagation delay time See Figure 9 5 8 16 ns
PWD(1) Pulse width distortion |tPHL – tPLH| 2.5
tsk(o)(2) Channel-to-channel output skew time Same-direction Channels 4
Opposite-direction Channels 5
tsk(pp)(3) Part-to-part skew time 8
tr Output signal rise time See Figure 9 2.3 ns
tf Output signal fall time 1.8
tPHZ Disable Propagation Delay, high-to-high impedance output See Figure 10 8 18 ns
tPLZ Disable Propagation Delay, low-to-high impedance output 8 18
tPZH Enable Propagation Delay, high impedance-to-high output 7 18
tPZL Enable Propagation Delay, high impedance-to-low output 7 18
tfs Fail-safe output delay time from input data or power loss See Figure 11 8.5 μs
(1) Also known as Pulse Skew.
(2) tsk(o) is the skew between outputs of a single device with all driving inputs connected together and the outputs switching in the same direction while driving identical loads.
(3) tsk(pp) is the magnitude of the difference in propagation delay times between any terminals of different devices switching in the same direction while operating at identical supply voltages, temperature, input signals and loads.

6.20 Typical Characteristics

ISO7640FM ISO7641FM G001_SLLSE89.gifFigure 1. ISO7640FM Supply Current per Channel
vs Data Rate
ISO7640FM ISO7641FM G003_SLLSE89.gifFigure 3. ISO7641FM Supply Current per Channel
vs Data Rate
ISO7640FM ISO7641FM G006_SLLSE89.pngFigure 5. Low-Level Output Voltage
vs Low-Level Output Current
ISO7640FM ISO7641FM G008_SLLSE89.pngFigure 7. Propagation Delay Time
vs Free Air Temperature
ISO7640FM ISO7641FM G002_SLLSE89.gifFigure 2. ISO7640FM Supply Current for All Channels
vs Data Rate
ISO7640FM ISO7641FM G005_SLLSE89.pngFigure 4. High-Level Output Voltage
vs High-Level Output Current
ISO7640FM ISO7641FM G007_SLLSE89.pngFigure 6. VCC Undervoltage Threshold
vs Free Air Temperature
ISO7640FM ISO7641FM G009_SLLSE89.gifFigure 8. Output Jitter vs Data Rate

 
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