SLLSEO2B July   2015  – June 2016 ISO7830

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Power Rating
    6. 6.6  Insulation Characteristics
    7. 6.7  Regulatory Information
    8. 6.8  Safety Limiting Values
    9. 6.9  Electrical Characteristics—5-V Supply
    10. 6.10 Supply Current Characteristics—5-V Supply
    11. 6.11 Electrical Characteristics—3.3-V Supply
    12. 6.12 Supply Current Characteristics—3.3-V Supply
    13. 6.13 Electrical Characteristics—2.5-V Supply
    14. 6.14 Supply Current Characteristics—2.5-V Supply
    15. 6.15 Switching Characteristics—5-V Supply
    16. 6.16 Switching Characteristics—3.3-V Supply
    17. 6.17 Switching Characteristics—2.5-V Supply
    18. 6.18 Insulation Characteristics Curves
    19. 6.19 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Electromagnetic Compatibility (EMC) Considerations
    4. 8.4 Device Functional Modes
      1. 8.4.1 Device I/O Schematics
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 PCB Material
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Related Links
    3. 12.3 Receiving Notification of Documentation Updates
    4. 12.4 Community Resources
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DWW|16
  • DW|16
Thermal pad, mechanical data (Package|Pins)
Orderable Information

1 Features

  • Signaling Rate: Up to 100 Mbps
  • Wide Supply Range: 2.25 V to 5.5 V
  • 2.25 V to 5.5 V Level Translation
  • Wide Temperature Range: –55°C to 125°C
  • Low Power Consumption, Typical 1.6 mA per Channel at 1 Mbps
  • Low Propagation Delay: 11 ns Typical
    (5-V Supplies)
  • Industry leading CMTI (min): ±100 kV/μs
  • Robust Electromagnetic Compatibility (EMC)
  • System-Level ESD, EFT, and Surge Immunity
  • Low Emissions
  • Isolation Barrier Life: > 40 Years
  • SOIC-16 Wide Body (DW) and Extra-Wide Body (DWW) Package Options
  • Safety-Related Certifications:
    • 8000 VPK Reinforced Isolation per DIN V VDE V 0884-10 (VDE V 0884-10):2006-12
    • 5.7 kVRMS Isolation for 1 Minute per UL 1577
    • CSA Component Acceptance Notice 5A, IEC 60950-1 and IEC 60601-1 End Equipment Standards
    • CQC Certification per GB4943.1-2011
    • TUV Certification per EN 61010-1 and EN 60950-1
    • All DW Package Certifications Complete; DWW Package Certifications Complete per UL, VDE, TUV and Planned for CSA and CQC

2 Applications

  • Industrial Automation
  • Motor Control
  • Power Supplies
  • Solar Inverters
  • Medical Equipment
  • Hybrid Electric Vehicles

3 Description

The ISO7830x device is a high-performance, 3-channel digital isolator with 8000-VPK isolation voltage. This device has reinforced isolation certifications according to VDE, CSA, TUV and CQC. The isolator provides high electromagnetic immunity and low emissions at low power consumption, while isolating CMOS or LVCMOS digital I/Os.

Each isolation channel has a logic input and output buffer separated by silicon dioxide (SiO2) insulation barrier. This device comes with enable pins which can be used to put the respective outputs in high impedance for multi-master driving applications and to reduce power consumption. The ISO7830x device has three forward and no reverse-direction channels. If the input power or signal is lost, the default output is high for the ISO7830 device and low for the ISO7830F device. See Device Functional Modes for further details.

Used in conjunction with isolated power supplies, this device helps prevent noise currents on a data bus or other circuits from entering the local ground and interfering with or damaging sensitive circuitry. Through innovative chip design and layout techniques, electromagnetic compatibility of ISO7830x has been significantly enhanced to ease system-level ESD, EFT, surge, and emissions compliance. ISO7830x is available in a 16-pin SOIC wide-body (DW) and extra-wide body (DWW) packages.

Device Information(1)

PART NUMBER PACKAGE BODY SIZE (NOM)
ISO7830
ISO7830F		 DW (16) 10.30 mm × 7.50 mm
DWW (16) 10.30 mm × 14.0 mm
  1. For all available packages, see the orderable addendum at the end of the data sheet.

Simplified Schematic

ISO7830 ISO7830F Simplified_Schematic_sllseo2.gif
VCCI and GNDI are supply and ground connections respectively for the input channels.
VCCO and GNDO are supply and ground connections respectively for the output channels.

4 Revision History

Changes from A Revision (September 2015) to B Revision

  • Changed Features From: Low Power Consumption, Typical 2.4 mA per Channel at 1 Mbps To: Low Power Consumption, Typical 1.6 mA per Channel at 1 Mbps Go
  • Changed the isolation barrier life from > 25 years to > 40 years in the Features sectionGo
  • Changed Features From: Safety and Regulatory Approvals To: Safety-Related Certifications Go
  • Updated the status of the certifications throughout the document Go
  • Added the extra-wide body package (16 pin SOIC [DWW]) optionGo
  • Deleted EN1 from the pin out drawing in the Pin Configuration and Functions section. Replaced references of ENx with EN2Go
  • Changed pin VCC1 description From: Power supply, VCC1 To: Power supply, side 1 in the PIN Functions tableGo
  • Changed pin VCC2 description From: Power supply, VCC2 To: Power supply, side 2 in the PIN Functions tableGo
  • Moved Junction temperature From Recommended Operating Conditions To Absolute Maximum RatingsGo
  • Changed the values for the DW package in the Thermal Information table Go
  • Changed the maximum power dissipation values for side 1 (40 to 25) and side 2 (110 to 125) in the Power Rating tableGo
  • Moved Insulation Characteristics to the Specifications sectionGo
  • Changed CIO Specification From: 2 pF To: ~1 pF Go
  • Added the climatic category parameter to the Insulation Characteristics table Go
  • Moved Regulatory Information to the Specifications sectionGo
  • Moved Safety Limiting Values to the Specifications sectionGo
  • Changed the test conditions and values for the DW package in the Safety Limiting Values tableGo
  • Changed VCCO to VCCI in the minimum value for the input threshold voltage hysteresis parameter in the electrical characteristics tablesGo
  • Added the VCM test condition to the CMTI parameter in the electrical characteristics tables. Also updated the minimum value from 70 to 100 and deleted the maximum value of 100Go
  • Changed tfs To: tDO in Switching Characteristics—5-V SupplyGo
  • Changed tfs To: tDO in Switching Characteristics—3.3-V SupplyGo
  • Changed tfs To: tDO in Switching Characteristics—2.5-V SupplyGo
  • Added the lifetime projection graphs for DW and DWW packages to the Insulation Characteristics Curves section Go
  • Changed the thermal derating curves in the Safety Limiting Values sectionGo
  • Changed 2.7 V To: 1.7 V, fs high To: default high, and fs low To: default low in Figure 15 Go
  • Changed Figure 20 Go

Changes from * Revision (July 2015) to A Revision

  • Changed From: 1-page Product Preview To: Production datasheetGo