JAJSHV5B June   2017  – August 2019 ADS1287

PRODUCTION DATA.  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 概要
    1.     Device Images
      1.      機能ブロック図
  4. 4 改訂履歴
  5. 5 概要（続き）
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 Switching Characteristics
    8. 7.8 Typical Characteristics
  8. 8 Parameter Measurement Information
    1. 8.1 Noise Performance
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Analog Input and Multiplexer
      2. 9.3.2 Programmable Gain Amplifier (PGA)
      3. 9.3.3 Modulator
        1. 9.3.3.1 Modulator Overrange
      4. 9.3.4 Voltage Reference Inputs (REFP, REFN)
      5. 9.3.5 Digital Filter
        1. 9.3.5.1 Sinc Filter Stage
        2. 9.3.5.2 FIR Filter Stage
        3. 9.3.5.3 Group Delay and Step Response
          1. 9.3.5.3.1 Linear Phase Response
          2. 9.3.5.3.2 Minimum Phase Response
        4. 9.3.5.4 HPF Stage
      6. 9.3.6 Reset (RESET Pin and Reset Command)
      7. 9.3.7 Master Clock Input (CLK)
    4. 9.4 Device Functional Modes
      1. 9.4.1  Operational Mode
      2. 9.4.2  Chop Mode
      3. 9.4.3  Offset
      4. 9.4.4  Power-Down Mode
      5. 9.4.5  Standby Mode
      6. 9.4.6  Synchronization
        1. 9.4.6.1 Pulse-Sync Mode
        2. 9.4.6.2 Continuous-Sync Mode
      7. 9.4.7  Reading Data
        1. 9.4.7.1 Read-Data-Continuous Mode (RDATAC)
        2. 9.4.7.2 Stop-Read-Data-Continuous-Mode (SDATAC)
      8. 9.4.8  Conversion Data Format
      9. 9.4.9  Offset and Full-Scale Calibration Registers
        1. 9.4.9.1 OFC[2:0] Registers
        2. 9.4.9.2 FSC[2:0] Registers
      10. 9.4.10 Calibration Command
        1. 9.4.10.1 OFSCAL Command
        2. 9.4.10.2 GANCAL Command
      11. 9.4.11 User Calibration
    5. 9.5 Programming
      1. 9.5.1 Serial Interface
        1. 9.5.1.1 Chip Select (CS)
        2. 9.5.1.2 Serial Clock (SCLK)
        3. 9.5.1.3 Data Input (DIN)
        4. 9.5.1.4 Data Output (DOUT)
        5. 9.5.1.5 Serial Interface Timeout
        6. 9.5.1.6 Data Ready (DRDY)
      2. 9.5.2 Commands
        1. 9.5.2.1  WAKEUP: Wake Up Command
        2. 9.5.2.2  STANDBY: Standby Mode Command
        3. 9.5.2.3  SYNC: Synchronize ADC Conversions
        4. 9.5.2.4  RESET: Reset Command
        5. 9.5.2.5  RDATAC: Read Data Continuous Mode Command
        6. 9.5.2.6  SDATAC: Stop Read Data Continuous Mode Command
        7. 9.5.2.7  RDATA: Read Data Command
        8. 9.5.2.8  RREG: Read Register Data Command
        9. 9.5.2.9  WREG: Write Register Data Command
        10. 9.5.2.10 OFSCAL: Offset Calibration Command
        11. 9.5.2.11 GANCAL: Gain Calibration Command
    6. 9.6 Register Map
      1. 9.6.1 Register Descriptions
        1. 9.6.1.1 ID/CFG: ID, Configuration Register (address = 00h) [reset = x0h]
          1. Table 22. ID/CFG Register Field Descriptions
        2. 9.6.1.2 CONFIG0: Configuration Register 0 (address = 01h) [reset = 52h]
          1. Table 23. CONFIG0 Register Field Descriptions
        3. 9.6.1.3 CONFIG1: Configuration Register 1 (address = 02h) [reset = 08h]
          1. Table 24. CONFIG1 Register Field Descriptions
        4. 9.6.1.4 High-Pass Filter Corner Frequency (HPFx) Registers (address = 03h, 04h) [reset = 32h, 03h]
          1. Table 25. HPF0, HPF1 Registers Field Description
        5. 9.6.1.5 Offset Calibration (OFCx) Registers (address = 05h, 06h, 07h) [reset = 00h, 00h, 00h]
          1. Table 26. OFC0, OFC1, OFC2 Registers Field Description
        6. 9.6.1.6 Full-Scale Calibration (FSCx) Registers (address = 08h, 09h, 0Ah) [reset = 00h, 00h, 40h]
          1. Table 27. FSC0, FSC1, FSC2 Registers Field Description
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Applications
      1. 10.2.1 Geophone Application
      2. 10.2.2 Digital Interface
    3. 10.3 Initialization Set Up
  11. 11Power Supply Recommendations
    1. 11.1 Analog Power Supplies
    2. 11.2 Digital Power Supply
    3. 11.3 Power-Supply Sequence
  12. 12Layout
    1. 12.1 Layout Guidelines
  13. 13デバイスおよびドキュメントのサポート
    1. 13.1 ドキュメントの更新通知を受け取る方法
    2. 13.2 コミュニティ・リソース
    3. 13.3 商標
    4. 13.4 静電気放電に関する注意事項
    5. 13.5 Glossary
  14. 14メカニカル、パッケージ、および注文情報

パッケージ・オプション

デバイスごとのパッケージ図は、PDF版データシートをご参照ください。

メカニカル・データ（パッケージ｜ピン）
  • RHF|24
サーマルパッド・メカニカル・データ
発注情報

6 Pin Configuration and Functions

RHF Package
5-mm × 4-mm, 24-Pin VQFN
Top View

Pin Functions

PIN FUNCTION DESCRIPTION
NO. NAME
1 DRDY Digital output Data ready, active low
2 DOUT Digital output Serial data output
3 DIN Digital input Serial data input
4 CS Digital input Serial interface select, active low
5 SYNC Digital input Synchronize, active high
6 NC — No connection
7 DGND Ground Digital ground
8 CAPN Analog output PGA negative output; connect a 10-nF C0G capacitor from CAPP to CAPN
9 CAPP Analog output PGA positive output; connect a 10-nF C0G capacitor from CAPP to CAPN
10 NC — No connection
11 NC — No connection
12 AINP Analog input Positive analog input
13 AINN Analog input Negative analog input
14 AVDD Analog Positive analog power supply
15 AVSS Analog Negative analog power supply
16 REFN Analog input Negative reference input
17 REFP Analog input Positive reference input
18 PWDN Digital input Power-down, active low
19 RESET Digital input Reset, active low
20 DVDD Digital Digital power supply
21 DGND Ground Digital ground (tie to digital ground plane)
22 BYPAS Analog output Sub-regulator bypass; connect a 1-µF capacitor to DGND
23 CLK Digital input Master clock input (1.024 MHz)
24 SCLK Digital input Serial interface clock input
Thermal pad — Electrically float the thermal pad. The thermal pad must be soldered to the PCB for optimum mechanical strength. PCB layout vias are optional.