SBAS499C July   2012  – January 2017 ADS1299 , ADS1299-4 , ADS1299-6

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements: Serial Interface
    7. 7.7 Switching Characteristics: Serial Interface
    8. 7.8 Typical Characteristics
  8. 8 Parametric Measurement Information
    1. 8.1 Noise Measurements
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Analog Functionality
        1. 9.3.1.1 Input Multiplexer
          1. 9.3.1.1.1 Device Noise Measurements
          2. 9.3.1.1.2 Test Signals (TestP and TestN)
          3. 9.3.1.1.3 Temperature Sensor (TempP, TempN)
          4. 9.3.1.1.4 Supply Measurements (MVDDP, MVDDN)
          5. 9.3.1.1.5 Lead-Off Excitation Signals (LoffP, LoffN)
          6. 9.3.1.1.6 Auxiliary Single-Ended Input
        2. 9.3.1.2 Analog Input
        3. 9.3.1.3 PGA Settings and Input Range
          1. 9.3.1.3.1 Input Common-Mode Range
          2. 9.3.1.3.2 Input Differential Dynamic Range
          3. 9.3.1.3.3 ADC ΔΣ Modulator
          4. 9.3.1.3.4 Reference
      2. 9.3.2 Digital Functionality
        1. 9.3.2.1 Digital Decimation Filter
          1. 9.3.2.1.1 Sinc Filter Stage (sinx / x)
        2. 9.3.2.2 Clock
        3. 9.3.2.3 GPIO
        4. 9.3.2.4 ECG and EEG Specific Features
          1. 9.3.2.4.1 Input Multiplexer (Rerouting the BIAS Drive Signal)
          2. 9.3.2.4.2 Input Multiplexer (Measuring the BIAS Drive Signal)
          3. 9.3.2.4.3 Lead-Off Detection
            1. 9.3.2.4.3.1 DC Lead-Off
            2. 9.3.2.4.3.2 AC Lead-Off (One Time or Periodic)
          4. 9.3.2.4.4 Bias Lead-Off
          5. 9.3.2.4.5 Bias Drive (DC Bias Circuit)
            1. 9.3.2.4.5.1 Bias Configuration with Multiple Devices
    4. 9.4 Device Functional Modes
      1. 9.4.1 Start
        1. 9.4.1.1 Settling Time
      2. 9.4.2 Reset (RESET)
      3. 9.4.3 Power-Down (PWDN)
      4. 9.4.4 Data Retrieval
        1. 9.4.4.1 Data Ready (DRDY)
        2. 9.4.4.2 Reading Back Data
      5. 9.4.5 Continuous Conversion Mode
      6. 9.4.6 Single-Shot Mode
    5. 9.5 Programming
      1. 9.5.1 Data Format
      2. 9.5.2 SPI Interface
        1. 9.5.2.1 Chip Select (CS)
        2. 9.5.2.2 Serial Clock (SCLK)
        3. 9.5.2.3 Data Input (DIN)
        4. 9.5.2.4 Data Output (DOUT)
      3. 9.5.3 SPI Command Definitions
        1. 9.5.3.1  Sending Multi-Byte Commands
        2. 9.5.3.2  WAKEUP: Exit STANDBY Mode
        3. 9.5.3.3  STANDBY: Enter STANDBY Mode
        4. 9.5.3.4  RESET: Reset Registers to Default Values
        5. 9.5.3.5  START: Start Conversions
        6. 9.5.3.6  STOP: Stop Conversions
        7. 9.5.3.7  RDATAC: Read Data Continuous
        8. 9.5.3.8  SDATAC: Stop Read Data Continuous
        9. 9.5.3.9  RDATA: Read Data
        10. 9.5.3.10 RREG: Read From Register
        11. 9.5.3.11 WREG: Write to Register
    6. 9.6 Register Maps
      1. 9.6.1 User Register Description
        1. 9.6.1.1  ID: ID Control Register (address = 00h) (reset = xxh)
        2. 9.6.1.2  CONFIG1: Configuration Register 1 (address = 01h) (reset = 96h)
        3. 9.6.1.3  CONFIG2: Configuration Register 2 (address = 02h) (reset = C0h)
        4. 9.6.1.4  CONFIG3: Configuration Register 3 (address = 03h) (reset = 60h)
        5. 9.6.1.5  LOFF: Lead-Off Control Register (address = 04h) (reset = 00h)
        6. 9.6.1.6  CHnSET: Individual Channel Settings (n = 1 to 8) (address = 05h to 0Ch) (reset = 61h)
        7. 9.6.1.7  BIAS_SENSP: Bias Drive Positive Derivation Register (address = 0Dh) (reset = 00h)
        8. 9.6.1.8  BIAS_SENSN: Bias Drive Negative Derivation Register (address = 0Eh) (reset = 00h)
        9. 9.6.1.9  LOFF_SENSP: Positive Signal Lead-Off Detection Register (address = 0Fh) (reset = 00h)
        10. 9.6.1.10 LOFF_SENSN: Negative Signal Lead-Off Detection Register (address = 10h) (reset = 00h)
        11. 9.6.1.11 LOFF_FLIP: Lead-Off Flip Register (address = 11h) (reset = 00h)
        12. 9.6.1.12 LOFF_STATP: Lead-Off Positive Signal Status Register (address = 12h) (reset = 00h)
        13. 9.6.1.13 LOFF_STATN: Lead-Off Negative Signal Status Register (address = 13h) (reset = 00h)
        14. 9.6.1.14 GPIO: General-Purpose I/O Register (address = 14h) (reset = 0Fh)
        15. 9.6.1.15 MISC1: Miscellaneous 1 Register (address = 15h) (reset = 00h)
        16. 9.6.1.16 MISC2: Miscellaneous 2 (address = 16h) (reset = 00h)
        17. 9.6.1.17 CONFIG4: Configuration Register 4 (address = 17h) (reset = 00h)
  10. 10Applications and Implementation
    1. 10.1 Application Information
      1. 10.1.1 Unused Inputs and Outputs
      2. 10.1.2 Setting the Device for Basic Data Capture
        1. 10.1.2.1 Lead-Off
        2. 10.1.2.2 Bias Drive
      3. 10.1.3 Establishing the Input Common-Mode
      4. 10.1.4 Multiple Device Configuration
        1. 10.1.4.1 Cascaded Mode
        2. 10.1.4.2 Daisy-Chain Mode
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
      3. 10.2.3 Application Curves
  11. 11Power Supply Recommendations
    1. 11.1 Power-Up Sequencing
    2. 11.2 Connecting the Device to Unipolar (5 V and 3.3 V) Supplies
    3. 11.3 Connecting the Device to Bipolar (±2.5 V and 3.3 V) Supplies
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Documentation Support
      1. 13.1.1 Related Documentation
    2. 13.2 Related Links
    3. 13.3 Receiving Notification of Documentation Updates
    4. 13.4 Community Resources
    5. 13.5 Trademarks
    6. 13.6 Electrostatic Discharge Caution
    7. 13.7 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

14 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.