The device evaluation module (EVM) layout can be used as a reference layout to obtain the best performance. A layout diagram of the EVM top layer is provided in Figure 8-10. A complete layout of the EVM is available at the ADS54J66 EVM folder. Some important points to remember during board layout are:
- Analog inputs are located on opposite sides of the device pinout for minimum crosstalk on the package level. To minimize crosstalk onboard, the analog inputs must exit the pinout in opposite directions, as shown in the reference layout of Figure 8-10 as much as possible.
Connect INP of all unused analog inputs to AVDD and the INM to GND or vice versa.
- In the device pinout, the sampling clock is located on a side perpendicular to the analog inputs in order to minimize coupling between them. This configuration is also maintained on the reference layout of Figure 8-10 as much as possible.
- Keep digital outputs away from the analog inputs. When these digital outputs exit the pinout, the digital output traces must not be kept parallel to the analog input traces because this configuration can result in coupling from the digital outputs to the analog inputs and degrade performance. All digital output traces to the receiver [such as a field-programmable gate array (FPGA) or an application-specific integrated circuit (ASIC)] must be matched in length to avoid skew among outputs.
Connect a 100 Ohm differential resistor across unused SERDES outputs to limit the swing which will occur if unterminated.
- At each power-supply pin (AVDD, DVDD, or AVDDD3V), keep a 0.1-µF decoupling capacitor close to the device. A separate decoupling capacitor group consisting of a parallel combination of 10-µF, 1-µF, and 0.1-µF capacitors can be kept close to the supply source.