JAJSIN5C February   2020  – September 2023 ADS7066

PRODUCTION DATA  

  1.   1
  2. 1 特長
  3. 2 アプリケーション
  4. 3 概要
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Switching Characteristics
    8. 6.8 Timing Diagrams
    9. 6.9 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Analog Input and Multiplexer
      2. 7.3.2  Reference
        1. 7.3.2.1 External Reference
        2. 7.3.2.2 Internal Reference
      3. 7.3.3  ADC Transfer Function
      4. 7.3.4  ADC Offset Calibration
      5. 7.3.5  Programmable Averaging Filters
      6. 7.3.6  CRC on Data Interface
      7. 7.3.7  Oscillator and Timing Control
      8. 7.3.8  Diagnostic Modes
        1. 7.3.8.1 Bit-Walk Test Mode
        2. 7.3.8.2 Fixed Voltage Test Mode
      9. 7.3.9  Output Data Format
        1. 7.3.9.1 Status Flags
        2. 7.3.9.2 Output CRC (Device to Host)
        3. 7.3.9.3 Input CRC (Host to Device)
      10. 7.3.10 Device Programming
        1. 7.3.10.1 Enhanced-SPI Interface
        2. 7.3.10.2 Daisy-Chain Mode
        3. 7.3.10.3 Register Read/Write Operation
          1. 7.3.10.3.1 Register Write
          2. 7.3.10.3.2 Register Read
            1. 7.3.10.3.2.1 Register Read With CRC
    4. 7.4 Device Functional Modes
      1. 7.4.1 Device Power-Up and Reset
      2. 7.4.2 Manual Mode
      3. 7.4.3 On-the-Fly Mode
      4. 7.4.4 Auto-Sequence Mode
    5. 7.5 ADS7066 Registers
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Charge-Kickback Filter and ADC Amplifier
      3. 8.2.3 Application Curve
    3. 8.3 Power Supply Recommendations
      1. 8.3.1 AVDD and DVDD Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Development Support
    2. 9.2 Documentation Support
      1. 9.2.1 Related Documentation
    3. 9.3 ドキュメントの更新通知を受け取る方法
    4. 9.4 サポート・リソース
    5. 9.5 Trademarks
    6. 9.6 静電気放電に関する注意事項
    7. 9.7 用語集
  11. 10Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

6.4 Thermal Information

THERMAL METRIC(1) ADS7066 UNIT
YBH (WCSP)
16 PINS
RθJA Junction-to-ambient thermal resistance 80.2 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 0.4 °C/W
RθJB Junction-to-board thermal resistance 18.8 °C/W
ΨJT Junction-to-top characterization parameter 0.2 °C/W
ΨJB Junction-to-board characterization parameter 18.8 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.