JAJSH03B May   2013  – February 2019 ADS8860

PRODUCTION DATA.  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 概要
    1.     Device Images
      1.      ADC 電源用に別個の LDO が不要
  4. 4 改訂履歴
  5. 5 概要（続き）
  6. 6 Device Comparison Table
  7. 7 Pin Configuration and Functions
    1.     Pin Functions
  8. 8 Specifications
    1. 8.1 Absolute Maximum Ratings
    2. 8.2 ESD Ratings
    3. 8.3 Recommended Operating Conditions
    4. 8.4 Thermal Information
    5. 8.5 Electrical Characteristics
    6. 8.6 Timing Requirements: 3-Wire Operation
    7. 8.7 Timing Requirements: 4-Wire Operation
    8. 8.8 Timing Requirements: Daisy-Chain
    9. 8.9 Typical Characteristics
  9. 9 Parameter Measurement Information
    1. 9.1 Equivalent Circuits
  10. 10Detailed Description
    1. 10.1 Overview
    2. 10.2 Functional Block Diagram
    3. 10.3 Feature Description
      1. 10.3.1 Analog Input
      2. 10.3.2 Reference
      3. 10.3.3 Clock
      4. 10.3.4 ADC Transfer Function
    4. 10.4 Device Functional Modes
      1. 10.4.1 CS Mode
        1. 10.4.1.1 3-Wire CS Mode Without a Busy Indicator
        2. 10.4.1.2 3-Wire CS Mode With a Busy Indicator
        3. 10.4.1.3 4-Wire CS Mode Without a Busy Indicator
        4. 10.4.1.4 4-Wire CS Mode With a Busy Indicator
      2. 10.4.2 Daisy-Chain Mode
        1. 10.4.2.1 Daisy-Chain Mode Without a Busy Indicator
        2. 10.4.2.2 Daisy-Chain Mode With a Busy Indicator
  11. 11Application and Implementation
    1. 11.1 Application Information
      1. 11.1.1 ADC Reference Driver
      2. 11.1.2 ADC Input Driver
        1. 11.1.2.1 Input Amplifier Selection
        2. 11.1.2.2 Charge-Kickback Filter
    2. 11.2 Typical Applications
      1. 11.2.1 DAQ Circuit for a 1-µs, Full-Scale Step Response
        1. 11.2.1.1 Design Requirements
        2. 11.2.1.2 Detailed Design Procedure
      2. 11.2.2 DAQ Circuit for Lowest Distortion and Noise Performance at 1 MSPS
        1. 11.2.2.1 Design Requirements
        2. 11.2.2.2 Detailed Design Procedure
      3. 11.2.3 Ultralow-Power DAQ Circuit at 10 kSPS
        1. 11.2.3.1 Design Requirements
        2. 11.2.3.2 Detailed Design Procedure
  12. 12Power Supply Recommendations
    1. 12.1 Power-Supply Decoupling
    2. 12.2 Power Saving
  13. 13Layout
    1. 13.1 Layout Guidelines
    2. 13.2 Layout Example
  14. 14デバイスおよびドキュメントのサポート
    1. 14.1 ドキュメントのサポート
      1. 14.1.1 関連資料
    2. 14.2 ドキュメントの更新通知を受け取る方法
    3. 14.3 コミュニティ・リソース
    4. 14.4 商標
    5. 14.5 静電気放電に関する注意事項
    6. 14.6 Glossary
  15. 15メカニカル、パッケージ、および注文情報

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

8.4 Thermal Information

THERMAL METRIC(1) ADS8860 UNIT
DGS (VSSOP) DRC (VSON)
10 PINS 10 PINS
RθJA Junction-to-ambient thermal resistance 151.9 111.1 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 45.4 46.4 °C/W
RθJB Junction-to-board thermal resistance 72.2 45.9 °C/W
ψJT Junction-to-top characterization parameter 3.3 3.5 °C/W
ψJB Junction-to-board characterization parameter 70.9 45.5 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A N/A °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.