JAJSLP2A august   2021  – july 2023 AFE439A2 , AFE539A4 , AFE639D2

PRODUCTION DATA  

  1.   1
  2. 1 特長
  3. 2 アプリケーション
  4. 3 概要
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  熱に関する情報
    5. 6.5  Electrical Characteristics: Voltage Output
    6. 6.6  Electrical Characteristics: Comparator Mode
    7. 6.7  Electrical Characteristics: ADC Input
    8. 6.8  Electrical Characteristics: General
    9. 6.9  Timing Requirements: I2C Standard Mode
    10. 6.10 Timing Requirements: I2C Fast Mode
    11. 6.11 Timing Requirements: I2C Fast Mode Plus
    12. 6.12 Timing Requirements: SPI Write Operation
    13. 6.13 Timing Requirements: SPI Read and Daisy Chain Operation (FSDO = 0)
    14. 6.14 Timing Requirements: SPI Read and Daisy Chain Operation (FSDO = 1)
    15. 6.15 Timing Requirements: PWM Output
    16. 6.16 Timing Requirements: I2C Controller
    17. 6.17 Timing Diagrams
    18. 6.18 Typical Characteristics: Voltage Output
    19. 6.19 Typical Characteristics: ADC
    20. 6.20 Typical Characteristics: Comparator
    21. 6.21 Typical Characteristics: General
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagrams
    3. 7.3 Feature Description
      1. 7.3.1 Smart Analog Front End (AFE) Architecture
      2. 7.3.2 Programming Interface
      3. 7.3.3 Nonvolatile Memory (NVM)
        1. 7.3.3.1 NVM Cyclic Redundancy Check (CRC)
          1. 7.3.3.1.1 NVM-CRC-FAIL-USER Bit
          2. 7.3.3.1.2 NVM-CRC-FAIL-INT Bit
      4. 7.3.4 Power-On Reset (POR)
      5. 7.3.5 External Reset
      6. 7.3.6 Register-Map Lock
    4. 7.4 Device Functional Modes
      1. 7.4.1 Voltage-Output Mode
      2. 7.4.2 Voltage Reference and DAC Transfer Function
        1. 7.4.2.1 Power-Supply as Reference
        2. 7.4.2.2 Internal Reference
        3. 7.4.2.3 External Reference
      3. 7.4.3 Comparator Mode
      4. 7.4.4 Analog-to-Digital Converter (ADC) Mode
      5. 7.4.5 Pulse-Width Modulation (PWM)
      6. 7.4.6 Proportional-Integral (PI) Control
        1. 7.4.6.1 AFE439A2 PI Control
        2. 7.4.6.2 AFE539A4 PI Control
        3. 7.4.6.3 AFE639D2 PI Control
    5. 7.5 Programming
      1. 7.5.1 SPI Programming Mode
      2. 7.5.2 I2C Programming Mode
        1. 7.5.2.1 F/S Mode Protocol
        2. 7.5.2.2 I2C Update Sequence
          1. 7.5.2.2.1 Address Byte
          2. 7.5.2.2.2 Command Byte
        3. 7.5.2.3 I2C Read Sequence
    6. 7.6 Register Maps
      1. 7.6.1  NOP Register (address = 00h) [reset = 0000h]
      2. 7.6.2  DAC-x-VOUT-CMP-CONFIG Register (address = 03h, 09h, 0Fh, 15h)
      3. 7.6.3  COMMON-CONFIG Register (address = 1Fh)
      4. 7.6.4  COMMON-TRIGGER Register (address = 20h) [reset = 0000h]
      5. 7.6.5  COMMON-PWM-TRIG Register (address = 21h) [reset = 0000h]
      6. 7.6.6  GENERAL-STATUS Register (address = 22h) [reset = 00h, DEVICE-ID, VERSION-ID]
      7. 7.6.7  INTERFACE-CONFIG Register (address = 26h) [reset = 0000h]
      8. 7.6.8  STATE-MACHINE-CONFIG0 Register (address = 27h) [reset = 0003h]
      9. 7.6.9  STATE-MACHINE-CONFIG1 Register (address = 29h) [reset = C800h]
      10. 7.6.10 SRAM-CONFIG Register (address = 2Bh) [reset = 0000h]
      11. 7.6.11 SRAM-DATA Register (address = 2Ch) [reset = 0000h]
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 ドキュメントの更新通知を受け取る方法
    3. 9.3 サポート・リソース
    4. 9.4 Trademarks
    5. 9.5 静電気放電に関する注意事項
    6. 9.6 用語集
  11. 10Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

6.4 熱に関する情報

熱評価基準(1) AFE439A2、AFE539A4、AFE639D2 単位
RTE (WQFN)
16 ピン
RθJA 接合部から周囲への熱抵抗 49 ℃/W
RθJC(top) 接合部からケース (上面) への熱抵抗 50 ℃/W
RθJB 接合部から基板への熱抵抗 24.1 ℃/W
ΨJT 接合部から上面への特性パラメータ 1.1 ℃/W
ΨJB 接合部から基板への特性パラメータ 24.1 ℃/W
RθJC(bot) 接合部からケース (底面) への熱抵抗 8.7 ℃/W
(1) 従来および最新の熱評価基準の詳細については、『半導体および IC パッケージの熱評価基準』アプリケーション・レポートを参照してください。