JAJSNC3A March   2024  – August 2024 AFE7950-SP

PRODMIX  

  1.   1
  2. 1特長
  3. 2アプリケーション
  4. 3概要
  5. 4Specifications
    1. 4.1  Absolute Maximum Ratings
    2. 4.2  ESD Ratings
    3. 4.3  Recommended Operating Conditions
    4. 4.4  Thermal Information
    5. 4.5  Transmitter Electrical Characteristics
    6. 4.6  RF ADC Electrical Characteristics
    7. 4.7  PLL/VCO/Clock Electrical Characteristics
    8. 4.8  Digital Electrical Characteristics
    9. 4.9  Power Supply Electrical Characteristics
    10. 4.10 Timing Requirements
    11. 4.11 Switching Characteristics
    12. 4.12 Typical Characteristics
      1. 4.12.1  TX Typical Characteristics 800MHz
      2. 4.12.2  TX Typical Characteristics at 1.8GHz
      3. 4.12.3  TX Typical Characteristics at 2.6GHz
      4. 4.12.4  TX Typical Characteristics at 3.5GHz
      5. 4.12.5  TX Typical Characteristics at 4.9GHz
      6. 4.12.6  TX Typical Characteristics at 8.1GHz
      7. 4.12.7  TX Typical Characteristics at 9.6GHz
      8. 4.12.8  RX Typical Characteristics at 800MHz
      9. 4.12.9  RX Typical Characteristics at 1.75-1.9GHz
      10. 4.12.10 RX Typical Characteristics at 2.6GHz
      11. 4.12.11 RX Typical Characteristics at 3.5GHz
      12. 4.12.12 RX Typical Characteristics at 4.9GHz
      13. 4.12.13 RX Typical Characteristics at 8.1GHz
      14. 4.12.14 RX Typical Characteristics at 9.6GHz
  6. 5Device and Documentation Support
    1. 5.1 ドキュメントの更新通知を受け取る方法
    2. 5.2 サポート・リソース
    3. 5.3 Trademarks
    4. 5.4 静電気放電に関する注意事項
    5. 5.5 用語集
  7. 6Revision History
  8. 7Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

4.4 Thermal Information

THERMAL METRIC(1) FC-BGA UNIT
400 PINS
RθJA Junction-to-ambient thermal resistance 15.3 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 0.44 °C/W
RθJB Junction-to-board thermal resistance 4.8 °C/W
ΨJB Junction-to-board characterization parameter 4.5 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.