JAJSQS5 july   2023 AFE7955

PRODUCTION DATA  

  1.   1
  2. 1特長
  3. 2アプリケーション
  4. 3概要
  5. 4Revision History
  6. 5Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information AFE79xx
    5. 5.5  Transmitter Electrical Characteristics
    6. 5.6  RF ADC Electrical Characteristics
    7. 5.7  PLL/VCO/Clock Electrical Characteristics
    8. 5.8  Digital Electrical Characteristics
    9. 5.9  Power Supply Electrical Characteristics
    10. 5.10 Timing Requirements
    11. 5.11 Switching Characteristics
    12. 5.12 Typical Characteristics
      1. 5.12.1  TX Typical Characteristics 800 MHz
      2. 5.12.2  TX Typical Characteristics at 1.8 GHz
      3. 5.12.3  TX Typical Characteristics at 2.6 GHz
      4. 5.12.4  TX Typical Characteristics at 3.5 GHz
      5. 5.12.5  TX Typical Characteristics at 4.9 GHz
      6. 5.12.6  TX Typical Characteristics at 8.1 GHz
      7. 5.12.7  TX Typical Characteristics at 9.6 GHz
      8. 5.12.8  RX Typical Characteristics at 800 MHz
      9. 5.12.9  RX Typical Characteristics at 1.75-1.9 GHz
      10. 5.12.10 RX Typical Characteristics at 2.6 GHz
      11. 5.12.11 RX Typical Characteristics at 3.5 GHz
      12. 5.12.12 RX Typical Characteristics at 4.9 GHz
      13. 5.12.13 RX Typical Characteristics at 8.1GHz
      14. 5.12.14 RX Typical Characteristics at 9.6 GHz
      15. 5.12.15 PLL and Clock Typical Characteristics
  7. 6Device and Documentation Support
    1. 6.1 ドキュメントの更新通知を受け取る方法
    2. 6.2 サポート・リソース
    3. 6.3 Trademarks
    4. 6.4 静電気放電に関する注意事項
    5. 6.5 用語集
  8. 7Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

5.4 Thermal Information AFE79xx

THERMAL METRIC(1) 17mmx17mm FC-BGA UNIT
400 PINS
RθJA Junction-to-ambient thermal resistance 16.2 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 0.42 °C/W
RθJB Junction-to-board thermal resistance 4.85 °C/W
ΨJT Junction-to-top characterization parameter 0.12 °C/W
ΨJB Junction-to-board characterization parameter 4.6 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.