JAJSHC9B May   2019  – October 2021 ALM2402F-Q1

PRODUCTION DATA  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 概要
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics: VS = 12 V
    6. 6.6 Electrical Characteristics: VS = 5 V
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 OTF/SH_DN
      2. 7.3.2 Output Stage Supply Voltage
      3. 7.3.3 Current-Limit and Short-Circuit Protection
      4. 7.3.4 Input Common-Mode Overvoltage Clamps
      5. 7.3.5 Thermal Shutdown
      6. 7.3.6 Output Stage
      7. 7.3.7 EMI Susceptibility and Input Filtering
    4. 7.4 Device Functional Modes
      1. 7.4.1 Open-Loop and Closed-Loop Operation
      2. 7.4.2 Shutdown
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Capacitive Load and Stability
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Resolver Excitation Input (Op Amp Output)
          1. 8.2.2.1.1 Excitation Voltage
          2. 8.2.2.1.2 Excitation Frequency
          3. 8.2.2.1.3 Excitation Impedance
        2. 8.2.2.2 Resolver Output
        3. 8.2.2.3 Power Dissipation and Thermal Reliability
          1. 8.2.2.3.1 Improving Package Thermal Performance
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 サポート・リソース
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報
8.2.2.3.1 Improving Package Thermal Performance

The value of RθJA depends on the PCB layout. An external heat sink, a cooling mechanism such as a cold air fan, or both, can help reduce RθJA and thus improve device thermal capabilities. See TI’s design support web page at www.ti.com/thermal for general guidance on improving device thermal performance.