SPRS710E November   2010  – March 2014 AM1802

PRODUCTION DATA.  

  1. 1AM1802 ARM Microprocessor
    1. 1.1 Features
    2. 1.2 Applications
    3. 1.3 Description
    4. 1.4 Functional Block Diagram
  2. 2Revision History
  3. 3Device Overview
    1. 3.1 Device Characteristics
    2. 3.2 Device Compatibility
    3. 3.3 ARM Subsystem
      1. 3.3.1 ARM926EJ-S RISC CPU
      2. 3.3.2 CP15
      3. 3.3.3 MMU
      4. 3.3.4 Caches and Write Buffer
      5. 3.3.5 Advanced High-Performance Bus (AHB)
      6. 3.3.6 Embedded Trace Macrocell (ETM) and Embedded Trace Buffer (ETB)
      7. 3.3.7 ARM Memory Mapping
    4. 3.4 Memory Map Summary
    5. 3.5 Pin Assignments
      1. 3.5.1 Pin Map (Bottom View)
    6. 3.6 Pin Multiplexing Control
    7. 3.7 Terminal Functions
      1. 3.7.1  Device Reset and JTAG
      2. 3.7.2  High-Frequency Oscillator and PLL
      3. 3.7.3  Real-Time Clock and 32-kHz Oscillator
      4. 3.7.4  DEEPSLEEP Power Control
      5. 3.7.5  External Memory Interface A (EMIFA)
      6. 3.7.6  DDR2/mDDR Memory Controller
      7. 3.7.7  Serial Peripheral Interface Modules (SPI)
      8. 3.7.8  Boot
      9. 3.7.9  Universal Asynchronous Receiver/Transmitters (UART0, UART1, UART2)
      10. 3.7.10 Inter-Integrated Circuit Modules (I2C0)
      11. 3.7.11 Timers
      12. 3.7.12 Multichannel Audio Serial Ports (McASP)
      13. 3.7.13 Universal Serial Bus Modules (USB0)
      14. 3.7.14 Ethernet Media Access Controller (EMAC)
      15. 3.7.15 Multimedia Card/Secure Digital (MMC/SD)
      16. 3.7.16 General Purpose Input Output
      17. 3.7.17 Reserved and No Connect
      18. 3.7.18 Supply and Ground
    8. 3.8 Unused Pin Configurations
  4. 4Device Configuration
    1. 4.1 Boot Modes
    2. 4.2 SYSCFG Module
    3. 4.3 Pullup/Pulldown Resistors
  5. 5Specifications
    1. 5.1 Absolute Maximum Ratings Over Operating Junction Temperature Range (Unless Otherwise Noted)
    2. 5.2 Handling Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Notes on Recommended Power-On Hours (POH)
    5. 5.5 Electrical Characteristics Over Recommended Ranges of Supply Voltage and Operating Junction Temperature (Unless Otherwise Noted)
  6. 6Peripheral Information and Electrical Specifications
    1. 6.1  Parameter Information
      1. 6.1.1 Parameter Information Device-Specific Information
        1. 6.1.1.1 Signal Transition Levels
    2. 6.2  Recommended Clock and Control Signal Transition Behavior
    3. 6.3  Power Supplies
      1. 6.3.1 Power-On Sequence
      2. 6.3.2 Power-Off Sequence
    4. 6.4  Reset
      1. 6.4.1 Power-On Reset (POR)
      2. 6.4.2 Warm Reset
      3. 6.4.3 Reset Electrical Data Timings
    5. 6.5  Crystal Oscillator or External Clock Input
    6. 6.6  Clock PLLs
      1. 6.6.1 PLL Device-Specific Information
      2. 6.6.2 Device Clock Generation
      3. 6.6.3 Dynamic Voltage and Frequency Scaling (DVFS)
    7. 6.7  Interrupts
      1. 6.7.1 ARM CPU Interrupts
        1. 6.7.1.1 ARM Interrupt Controller (AINTC) Interrupt Signal Hierarchy
        2. 6.7.1.2 AINTC Hardware Vector Generation
        3. 6.7.1.3 AINTC Hardware Interrupt Nesting Support
        4. 6.7.1.4 AINTC System Interrupt Assignments
        5. 6.7.1.5 AINTC Memory Map
    8. 6.8  Power and Sleep Controller (PSC)
      1. 6.8.1 Power Domain and Module Topology
        1. 6.8.1.1 Module States
    9. 6.9  EDMA
      1. 6.9.1 EDMA3 Channel Synchronization Events
      2. 6.9.2 EDMA Peripheral Register Descriptions
    10. 6.10 External Memory Interface A (EMIFA)
      1. 6.10.1 EMIFA Asynchronous Memory Support
      2. 6.10.2 EMIFA Synchronous DRAM Memory Support
      3. 6.10.3 EMIFA SDRAM Loading Limitations
      4. 6.10.4 External Memory Interface Register Descriptions
      5. 6.10.5 EMIFA Electrical Data/Timing
    11. 6.11 DDR2/mDDR Controller
      1. 6.11.1 DDR2/mDDR Memory Controller Electrical Data/Timing
      2. 6.11.2 DDR2/mDDR Controller Register Description(s)
      3. 6.11.3 DDR2/mDDR Interface
        1. 6.11.3.1  DDR2/mDDR Interface Schematic
        2. 6.11.3.2  Compatible JEDEC DDR2/mDDR Devices
        3. 6.11.3.3  PCB Stackup
        4. 6.11.3.4  Placement
        5. 6.11.3.5  DDR2/mDDR Keep Out Region
        6. 6.11.3.6  Bulk Bypass Capacitors
        7. 6.11.3.7  High-Speed Bypass Capacitors
        8. 6.11.3.8  Net Classes
        9. 6.11.3.9  DDR2/mDDR Signal Termination
        10. 6.11.3.10 VREF Routing
        11. 6.11.3.11 DDR2/mDDR CK and ADDR_CTRL Routing
        12. 6.11.3.12 MDDR/DDR2 Boundary Scan Limitations
    12. 6.12 Memory Protection Units
    13. 6.13 MMC / SD / SDIO (MMCSD0)
      1. 6.13.1 MMCSD Peripheral Description
      2. 6.13.2 MMCSD Peripheral Register Description(s)
      3. 6.13.3 MMC/SD Electrical Data/Timing
    14. 6.14 Multichannel Audio Serial Port (McASP)
      1. 6.14.1 McASP Peripheral Registers Description(s)
      2. 6.14.2 McASP Electrical Data/Timing
        1. 6.14.2.1 Multichannel Audio Serial Port 0 (McASP0) Timing
    15. 6.15 Serial Peripheral Interface Ports (SPI0, SPI1)
      1. 6.15.1 SPI Peripheral Registers Description(s)
      2. 6.15.2 SPI Electrical Data/Timing
        1. 6.15.2.1 Serial Peripheral Interface (SPI) Timing
    16. 6.16 Inter-Integrated Circuit Serial Ports (I2C)
      1. 6.16.1 I2C Device-Specific Information
      2. 6.16.2 I2C Peripheral Registers Description(s)
      3. 6.16.3 I2C Electrical Data/Timing
        1. 6.16.3.1 Inter-Integrated Circuit (I2C) Timing
    17. 6.17 Universal Asynchronous Receiver/Transmitter (UART)
      1. 6.17.1 UART Peripheral Registers Description(s)
      2. 6.17.2 UART Electrical Data/Timing
    18. 6.18 Universal Serial Bus OTG Controller (USB0) [USB2.0 OTG]
      1. 6.18.1 USB0 [USB2.0] Electrical Data/Timing
    19. 6.19 Ethernet Media Access Controller (EMAC)
      1. 6.19.1 EMAC Peripheral Register Description(s)
        1. 6.19.1.1 EMAC Electrical Data/Timing
    20. 6.20 Management Data Input/Output (MDIO)
      1. 6.20.1 MDIO Registers
      2. 6.20.2 Management Data Input/Output (MDIO) Electrical Data/Timing
    21. 6.21 Timers
      1. 6.21.1 Timer Electrical Data/Timing
    22. 6.22 Real Time Clock (RTC)
      1. 6.22.1 Clock Source
      2. 6.22.2 Real-Time Clock Register Descriptions
    23. 6.23 General-Purpose Input/Output (GPIO)
      1. 6.23.1 GPIO Register Description(s)
      2. 6.23.2 GPIO Peripheral Input/Output Electrical Data/Timing
      3. 6.23.3 GPIO Peripheral External Interrupts Electrical Data/Timing
    24. 6.24 Emulation Logic
      1. 6.24.1 JTAG Port Description
      2. 6.24.2 Scan Chain Configuration Parameters
      3. 6.24.3 Initial Scan Chain Configuration
        1. 6.24.3.1 Adding TAPS to the Scan Chain
      4. 6.24.4 IEEE 1149.1 JTAG
        1. 6.24.4.1 JTAG Peripheral Register Description(s) - JTAG ID Register (DEVIDR0)
        2. 6.24.4.2 JTAG Test-Port Electrical Data/Timing
      5. 6.24.5 JTAG 1149.1 Boundary Scan Considerations
  7. 7Device and Documentation Support
    1. 7.1 Device Support
      1. 7.1.1 Development Support
      2. 7.1.2 Device and Development-Support Tool Nomenclature
    2. 7.2 Documentation Support
    3. 7.3 Community Resources
    4. 7.4 Trademarks
    5. 7.5 Electrostatic Discharge Caution
    6. 7.6 Glossary
  8. 8Mechanical Packaging and Orderable Information
    1. 8.1 Thermal Data for ZCE Package
    2. 8.2 Thermal Data for ZWT Package
    3. 8.3 Packaging Information

パッケージ・オプション

デバイスごとのパッケージ図は、PDF版データシートをご参照ください。

メカニカル・データ（パッケージ｜ピン）
  • ZCE|361
  • ZWT|361
サーマルパッド・メカニカル・データ
発注情報

8 Mechanical Packaging and Orderable Information

This section describes the packaging options, materials, thermal and mechanical parameters.

8.1 Thermal Data for ZCE Package

The following table shows the thermal resistance characteristics for the PBGA-ZCE mechanical package.

Table 8-1 Thermal Resistance Characteristics (PBGA Package) [ZCE]

NO. °C/W(1) AIR FLOW (m/s)(2)
1 RΘJC Junction-to-case 7.6 N/A
2 RΘJB Junction-to-board 11.3 N/A
3 RΘJA Junction-to-free air 23.9 0.00
4 RΘJMA Junction-to-moving air 21.2 0.50
5 20.3 1.00
6 19.5 2.00
7 18.6 4.00
8 PsiJT Junction-to-package top 0.2 0.00
9 0.3 0.50
10 0.3 1.00
11 0.4 2.00
12 0.5 4.00
13 PsiJB Junction-to-board 11.2 0.00
14 11.1 0.50
15 11.1 1.00
16 11.0 2.00
17 10.9 4.00
(1) These measurements were conducted in a JEDEC defined 2S2P system and will change based on environment as well as application. For more information, see these EIA/JEDEC standards - EIA/JESD51-2, Integrated Circuits Thermal Test Method Environment Conditions - Natural Convection (Still Air) and JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages. Power dissipation of 500 mW and ambient temp of 70C assumed. PCB with 2oz (70um) top and bottom copper thickness and 1.5oz (50um) inner copper thickness
(2) m/s = meters per second

8.2 Thermal Data for ZWT Package

The following table shows the thermal resistance characteristics for the PBGA-ZWT mechanical package.

Table 8-2 Thermal Resistance Characteristics (PBGA Package) [ZWT]

NO. °C/W(1) AIR FLOW (m/s)(2)
1 RΘJC Junction-to-case 7.3 N/A
2 RΘJB Junction-to-board 12.4 N /A
3 RΘJA Junction-to-free air 23.7 0.00
4 RΘJMA Junction-to-moving air 21.0 0.50
5 20.1 1.00
6 19.3 2.00
7 18.4 4.00
8 PsiJT Junction-to-package top 0.2 0.00
9 0.3 0.50
10 0.3 1.00
11 0.4 2.00
12 0.5 4.00
13 PsiJB Junction-to-board 12.3 0.00
14 12.2 0.50
15 12.1 1.00
16 12.0 2.00
17 11.9 4.00
(1) These measurements were conducted in a JEDEC defined 2S2P system and will change based on environment as well as application. For more information, see these EIA/JEDEC standards - EIA/JESD51-2, Integrated Circuits Thermal Test Method Environment Conditions - Natural Convection (Still Air) and JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages. Power dissipation of 1W and ambient temp of 70C assumed. PCB with 2oz (70um) top and bottom copper thickness and 1.5oz (50um) inner copper thickness
(2) m/s = meters per second

8.3 Packaging Information

The following packaging information and addendum reflect the most current data available for the designated device(s). This data is subject to change without notice and without revision of this document.