SPRS653E February 2010 – March 2014 AM1808
PRODUCTION DATA.
デバイスごとのパッケージ図は、PDF版データシートをご参照ください。
This section describes the device orderable part numbers, packaging options, materials, thermal and mechanical parameters.
The following table(s) show the thermal resistance characteristics for the PBGA–ZCE mechanical package.
NO. | °C/W(1) | AIR FLOW (m/s)(2) | ||
---|---|---|---|---|
1 | RΘJC | Junction-to-case | 7.6 | N/A |
2 | RΘJB | Junction-to-board | 11.3 | N /A |
3 | RΘJA | Junction-to-free air | 23.9 | 0.00 |
4 | RΘJMA | Junction-to-moving air | 21.2 | 0.50 |
5 | 20.3 | 1.00 | ||
6 | 19.5 | 2.00 | ||
7 | 18.6 | 4.00 | ||
8 | PsiJT | Junction-to-package top | 0.2 | 0.00 |
9 | 0.3 | 0.50 | ||
10 | 0.3 | 1.00 | ||
11 | 0.4 | 2.00 | ||
12 | 0.5 | 4.00 | ||
13 | PsiJB | Junction-to-board | 11.2 | 0.00 |
14 | 11.1 | 0.50 | ||
15 | 11.1 | 1.00 | ||
16 | 11.0 | 2.00 | ||
17 | 10.9 | 4.00 |
The following table(s) show the thermal resistance characteristics for the PBGA–ZWT mechanical package.
NO. | °C/W(1) | AIR FLOW (m/s)(2) | ||
---|---|---|---|---|
1 | RΘJC | Junction-to-case | 7.3 | N/A |
2 | RΘJB | Junction-to-board | 12.4 | N /A |
3 | RΘJA | Junction-to-free air | 23.7 | 0.00 |
4 | RΘJMA | Junction-to-moving air | 21.0 | 0.50 |
5 | 20.1 | 1.00 | ||
6 | 19.3 | 2.00 | ||
7 | 18.4 | 4.00 | ||
8 | PsiJT | Junction-to-package top | 0.2 | 0.00 |
9 | 0.3 | 0.50 | ||
10 | 0.3 | 1.00 | ||
11 | 0.4 | 2.00 | ||
12 | 0.5 | 4.00 | ||
13 | PsiJB | Junction-to-board | 12.3 | 0.00 |
14 | 12.2 | 0.50 | ||
15 | 12.1 | 1.00 | ||
16 | 12.0 | 2.00 | ||
17 | 11.9 | 4.00 |