JAJSVM4A September   2024  – November 2024 AM2612

ADVANCE INFORMATION  

  1.   1
  2. 特長
  3. アプリケーション
  4. 概要
    1. 3.1 機能ブロック図
  5. Package Comparison
    1. 4.1 Related Products
  6. Terminal Configuration and Functions
    1. 5.1 Pin Diagram
      1. 5.1.1 AM261x ZCZ Pin Diagram
      2. 5.1.2 AM261x ZFG Pin Diagram
      3. 5.1.3 AM261x ZEJ Pin Diagram
      4. 5.1.4 AM261x ZNC Pin Diagram
    2. 5.2 Pin Attributes
      1.      15
      2.      16
    3. 5.3 Signal Descriptions
      1.      18
      2. 5.3.1  ADC
        1.       20
        2.       21
        3.       22
      3. 5.3.2  ADC_CAL
        1.       24
      4. 5.3.3  ADC VREF
        1.       26
      5. 5.3.4  CPSW
        1.       28
        2.       29
        3.       30
        4.       31
        5.       32
        6.       33
        7.       34
      6. 5.3.5  CPTS
        1.       36
      7. 5.3.6  DAC
        1.       38
      8. 5.3.7  EPWM
        1.       40
        2.       41
        3.       42
        4.       43
        5.       44
        6.       45
        7.       46
        8.       47
        9.       48
        10.       49
      9. 5.3.8  EQEP
        1.       51
        2.       52
      10. 5.3.9  FSI
        1.       54
        2.       55
      11. 5.3.10 GPIO
        1.       57
      12. 5.3.11 GPMC0
        1.       59
      13. 5.3.12 I2C
        1.       61
        2.       62
        3.       63
      14. 5.3.13 LIN
        1.       65
        2.       66
        3.       67
      15. 5.3.14 MCAN
        1.       69
        2.       70
      16. 5.3.15 SPI (MCSPI)
        1.       72
        2.       73
        3.       74
        4.       75
      17. 5.3.16 MMC
        1.       77
      18. 5.3.17 Power Supply
        1.       79
      19. 5.3.18 PRU-ICSS
        1.       81
        2.       82
        3.       83
        4.       84
        5.       85
      20. 5.3.19 OSPI
        1.       87
        2.       88
      21. 5.3.20 SDFM
        1.       90
        2.       91
      22. 5.3.21 System and Miscellaneous
        1. 5.3.21.1 Boot Mode Configuration
          1.        94
        2. 5.3.21.2 Clocking
          1.        96
          2.        97
          3.        98
        3. 5.3.21.3 Emulation and Debug
          1.        100
          2.        101
        4. 5.3.21.4 SYSTEM
          1.        103
        5. 5.3.21.5 USB0
          1.        105
        6. 5.3.21.6 VMON
          1.        107
        7.       108
          1.        109
      23. 5.3.22 UART
        1.       111
        2.       112
        3.       113
        4.       114
        5.       115
        6.       116
      24. 5.3.23 XBAR
        1.       118
        2.       119
  7. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 Recommended Operating Conditions
    3. 6.3 Electrical Characteristics
      1. 6.3.1 Digital and Analog IO Electrical Characteristics
    4. 6.4 Thermal Resistance Characteristics
      1. 6.4.1 Package Thermal Characteristics
  8. Detailed Description
    1. 7.1 Overview
    2. 7.2 Processor Subsystems
      1. 7.2.1 Arm Cortex-R5F Subsystem
  9. Applications, Implementation, and Layout
    1. 8.1 Device Connection and Layout Fundamentals
      1. 8.1.1 External Oscillator
      2. 8.1.2 JTAG, EMU, and TRACE
      3. 8.1.3 Hardware Reference Design and Guidelines
  10. Device and Documentation Support
    1. 9.1 Device Nomenclature
      1. 9.1.1 Device Naming Convention
    2. 9.2 Tools and Software
    3. 9.3 Documentation Support
    4. 9.4 Support Resources
    5. 9.5 Trademarks
    6. 9.6 Electrostatic Discharge Caution
    7. 9.7 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ(パッケージ|ピン)
  • ZFG|304
サーマルパッド・メカニカル・データ
発注情報

Digital and Analog IO Electrical Characteristics

over recommended operating conditions (unless otherwise noted). The below are for IOs powered at 3.3V
PARAMETERMINTYPMAXUNIT
PORz IO
VIHHigh-Level Input Voltage1.35V
VILLow-Level Input Voltage0.5V
VHYSHysteresis Voltage at an Input0.070V
ILInput Leakage Current–22μA
Warm Reset IO
VIHHigh-Level Input Voltage2V
VILLow-Level Input Voltage0.8V
VHYSHysteresis Voltage at an Input0.347V
VOLLow Level Output Voltage, Driver Enabled : IOL = 6 mA0.45V
ILInput Leakage Current, Receiver Disabled, Pull Disabled–57μA
TCK IO
VIHHigh-Level Input Voltage2.15V
VILLow-Level Input Voltage0.55V
VHYSHysteresis Voltage at an Input0.4V
ILInput Leakage Current, Receiver Disabled, Pull Disabled–3.98.917.2μA
Input Leakage Current, Receiver Disabled, Pullup Enabled106.9128.2μA
Input Leakage Current, Receiver Disabled, Pulldown Enabled100.3130.3μA
I2C OD IOs
VIHHigh-Level Input Voltage2V
VILLow-Level Input Voltage0.8V
VHYSHysteresis Voltage at an Input0.165V
ILInput Leakage Current, Receiver Disabled, Pull Disabled–1818μA
VOLLow Level Output Voltage, Driver Enabled : IOL = 3 mA0.45V
All Other LVCMOS
VIHHigh- Level Input Voltage2V
VILLow-Level Input Voltage0.8V
VHYSHysteresis Voltage at an Input0.265V
VOLLow Level Output Voltage, Driver Enabled : IOL = 6 mA0.45V
VOHHigh Level Output Voltage, Driver Enabled : IOH = 6 mAVDDS33(1) – 0.45V
ILInput Leakage Current, Receiver Disabled, Pull Disabled–1818μA
Input Leakage Current, Receiver Disabled, Pullup Enabled–243–100–19μA
Input Leakage Current, Receiver Disabled, Pulldown Enabled51100210μA
VDDS33 is the voltage on the corresponding power-supply pins(VDDS33, VDDS1833_FLASH0, VDDS1833_FLASH1) on the IC.