JAJSUB9C April   2008  – April 2024 AM26LV31E

PRODUCTION DATA  

  1.   1
  2. 1 特長
  3. 2 アプリケーション
  4. 3 概要
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Switching Characteristics
    7. 5.7 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Complementary Out-Enable Inputs
      2. 7.3.2 High Output Impedance for Specific Driver Enable Inputs
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 サポート・リソース
    4. 9.4 Trademarks
    5. 9.5 静電気放電に関する注意事項
    6. 9.6 用語集
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

5.4 Thermal Information

THERMAL METRIC(1)AM26LV31EUNIT
D (SOIC)PW (TSSOP)NS (SO)RGY (VQFN)
16 PINS16 PINS16 PINS16 PINS
RθJAJunction-to-ambient thermal resistance84.6107.588.548.4°C/W
RθJC(top)Junction-to-case (top) thermal resistance43.538.446.246.8°C/W
RθJBJunction-to-board thermal resistance43.253.750.724.6°C/W
ψJTJunction-to-top characterization parameter10.43.213.52.3°C/W
ψJBJunction-to-board characterization parameter42.853.150.324.5°C/W
RθJC(bot)Junction-to-case (bottom) thermal resistancen/an/an/a8.5°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.