JAJSDZ0J October   2011  – April 2016 AM3351 , AM3352 , AM3354 , AM3356 , AM3357 , AM3358 , AM3359

PRODUCTION DATA.  

  1. 1デバイスの概要
    1. 1.1 特長
    2. 1.2 アプリケーション
    3. 1.3 概要
    4. 1.4 機能ブロック図
  2. 2改訂履歴
  3. 3Device Comparison
    1. 3.1 Related Products
  4. 4Terminal Configuration and Functions
    1. 4.1 Pin Diagram
      1. 4.1.1 ZCE Package Pin Maps (Top View)
      2. 4.1.2 ZCZ Package Pin Maps (Top View)
    2. 4.2 Pin Attributes
    3. 4.3 Signal Descriptions
      1. 4.3.1 External Memory Interfaces
      2. 4.3.2 General-Purpose IOs
      3. 4.3.3 Miscellaneous
        1. 4.3.3.1 eCAP
        2. 4.3.3.2 eHRPWM
        3. 4.3.3.3 eQEP
        4. 4.3.3.4 Timer
      4. 4.3.4 PRU-ICSS
        1. 4.3.4.1 PRU0
        2. 4.3.4.2 PRU1
      5. 4.3.5 Removable Media Interfaces
      6. 4.3.6 Serial Communication Interfaces
        1. 4.3.6.1 CAN
        2. 4.3.6.2 GEMAC_CPSW
        3. 4.3.6.3 I2C
        4. 4.3.6.4 McASP
        5. 4.3.6.5 SPI
        6. 4.3.6.6 UART
        7. 4.3.6.7 USB
  5. 5Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Power-On Hours (POH)
    4. 5.4  Operating Performance Points (OPPs)
    5. 5.5  Recommended Operating Conditions
    6. 5.6  Power Consumption Summary
    7. 5.7  DC Electrical Characteristics
    8. 5.8  Thermal Resistance Characteristics for ZCE and ZCZ Packages
    9. 5.9  External Capacitors
      1. 5.9.1 Voltage Decoupling Capacitors
        1. 5.9.1.1 Core Voltage Decoupling Capacitors
        2. 5.9.1.2 I/O and Analog Voltage Decoupling Capacitors
      2. 5.9.2 Output Capacitors
    10. 5.10 Touch Screen Controller and Analog-to-Digital Subsystem Electrical Parameters
  6. 6Power and Clocking
    1. 6.1 Power Supplies
      1. 6.1.1 Power Supply Slew Rate Requirement
      2. 6.1.2 Power-Down Sequencing
      3. 6.1.3 VDD_MPU_MON Connections
      4. 6.1.4 Digital Phase-Locked Loop Power Supply Requirements
    2. 6.2 Clock Specifications
      1. 6.2.1 Input Clock Specifications
      2. 6.2.2 Input Clock Requirements
        1. 6.2.2.1 OSC0 Internal Oscillator Clock Source
        2. 6.2.2.2 OSC0 LVCMOS Digital Clock Source
        3. 6.2.2.3 OSC1 Internal Oscillator Clock Source
        4. 6.2.2.4 OSC1 LVCMOS Digital Clock Source
        5. 6.2.2.5 OSC1 Not Used
      3. 6.2.3 Output Clock Specifications
      4. 6.2.4 Output Clock Characteristics
        1. 6.2.4.1 CLKOUT1
        2. 6.2.4.2 CLKOUT2
  7. 7Peripheral Information and Timings
    1. 7.1  Parameter Information
      1. 7.1.1 Timing Parameters and Board Routing Analysis
    2. 7.2  Recommended Clock and Control Signal Transition Behavior
    3. 7.3  OPP50 Support
    4. 7.4  Controller Area Network (CAN)
      1. 7.4.1 DCAN Electrical Data and Timing
    5. 7.5  DMTimer
      1. 7.5.1 DMTimer Electrical Data and Timing
    6. 7.6  Ethernet Media Access Controller (EMAC) and Switch
      1. 7.6.1 EMAC and Switch Electrical Data and Timing
        1. 7.6.1.1 EMAC/Switch MDIO Electrical Data and Timing
        2. 7.6.1.2 EMAC and Switch MII Electrical Data and Timing
        3. 7.6.1.3 EMAC and Switch RMII Electrical Data and Timing
        4. 7.6.1.4 EMAC and Switch RGMII Electrical Data and Timing
    7. 7.7  External Memory Interfaces
      1. 7.7.1 General-Purpose Memory Controller (GPMC)
        1. 7.7.1.1 GPMC and NOR Flash—Synchronous Mode
        2. 7.7.1.2 GPMC and NOR Flash—Asynchronous Mode
        3. 7.7.1.3 GPMC and NAND Flash—Asynchronous Mode
      2. 7.7.2 mDDR(LPDDR), DDR2, DDR3, DDR3L Memory Interface
        1. 7.7.2.1 mDDR (LPDDR) Routing Guidelines
          1. 7.7.2.1.1 Board Designs
          2. 7.7.2.1.2 LPDDR Interface
            1. 7.7.2.1.2.1 LPDDR Interface Schematic
            2. 7.7.2.1.2.2 Compatible JEDEC LPDDR Devices
            3. 7.7.2.1.2.3 PCB Stackup
            4. 7.7.2.1.2.4 Placement
            5. 7.7.2.1.2.5 LPDDR Keepout Region
            6. 7.7.2.1.2.6 Bulk Bypass Capacitors
            7. 7.7.2.1.2.7 High-Speed Bypass Capacitors
            8. 7.7.2.1.2.8 Net Classes
            9. 7.7.2.1.2.9 LPDDR Signal Termination
          3. 7.7.2.1.3 LPDDR CK and ADDR_CTRL Routing
        2. 7.7.2.2 DDR2 Routing Guidelines
          1. 7.7.2.2.1 Board Designs
          2. 7.7.2.2.2 DDR2 Interface
            1. 7.7.2.2.2.1  DDR2 Interface Schematic
            2. 7.7.2.2.2.2  Compatible JEDEC DDR2 Devices
            3. 7.7.2.2.2.3  PCB Stackup
            4. 7.7.2.2.2.4  Placement
            5. 7.7.2.2.2.5  DDR2 Keepout Region
            6. 7.7.2.2.2.6  Bulk Bypass Capacitors
            7. 7.7.2.2.2.7  High-Speed (HS) Bypass Capacitors
            8. 7.7.2.2.2.8  Net Classes
            9. 7.7.2.2.2.9  DDR2 Signal Termination
            10. 7.7.2.2.2.10 DDR_VREF Routing
          3. 7.7.2.2.3 DDR2 CK and ADDR_CTRL Routing
        3. 7.7.2.3 DDR3 and DDR3L Routing Guidelines
          1. 7.7.2.3.1 Board Designs
            1. 7.7.2.3.1.1 DDR3 versus DDR2
          2. 7.7.2.3.2 DDR3 Device Combinations
          3. 7.7.2.3.3 DDR3 Interface
            1. 7.7.2.3.3.1  DDR3 Interface Schematic
            2. 7.7.2.3.3.2  Compatible JEDEC DDR3 Devices
            3. 7.7.2.3.3.3  PCB Stackup
            4. 7.7.2.3.3.4  Placement
            5. 7.7.2.3.3.5  DDR3 Keepout Region
            6. 7.7.2.3.3.6  Bulk Bypass Capacitors
            7. 7.7.2.3.3.7  High-Speed Bypass Capacitors
              1. 7.7.2.3.3.7.1 Return Current Bypass Capacitors
            8. 7.7.2.3.3.8  Net Classes
            9. 7.7.2.3.3.9  DDR3 Signal Termination
            10. 7.7.2.3.3.10 DDR_VREF Routing
            11. 7.7.2.3.3.11 VTT
          4. 7.7.2.3.4 DDR3 CK and ADDR_CTRL Topologies and Routing Definition
            1. 7.7.2.3.4.1 Two DDR3 Devices
              1. 7.7.2.3.4.1.1 CK and ADDR_CTRL Topologies, Two DDR3 Devices
              2. 7.7.2.3.4.1.2 CK and ADDR_CTRL Routing, Two DDR3 Devices
            2. 7.7.2.3.4.2 One DDR3 Device
              1. 7.7.2.3.4.2.1 CK and ADDR_CTRL Topologies, One DDR3 Device
              2. 7.7.2.3.4.2.2 CK and ADDR_CTRL Routing, One DDR3 Device
          5. 7.7.2.3.5 Data Topologies and Routing Definition
            1. 7.7.2.3.5.1 DQS[x] and DQ[x] Topologies, Any Number of Allowed DDR3 Devices
            2. 7.7.2.3.5.2 DQS[x] and DQ[x] Routing, Any Number of Allowed DDR3 Devices
          6. 7.7.2.3.6 Routing Specification
            1. 7.7.2.3.6.1 CK and ADDR_CTRL Routing Specification
            2. 7.7.2.3.6.2 DQS[x] and DQ[x] Routing Specification
    8. 7.8  I2C
      1. 7.8.1 I2C Electrical Data and Timing
    9. 7.9  JTAG Electrical Data and Timing
    10. 7.10 LCD Controller (LCDC)
      1. 7.10.1 LCD Interface Display Driver (LIDD Mode)
      2. 7.10.2 LCD Raster Mode
    11. 7.11 Multichannel Audio Serial Port (McASP)
      1. 7.11.1 McASP Device-Specific Information
      2. 7.11.2 McASP Electrical Data and Timing
    12. 7.12 Multichannel Serial Port Interface (McSPI)
      1. 7.12.1 McSPI Electrical Data and Timing
        1. 7.12.1.1 McSPI—Slave Mode
        2. 7.12.1.2 McSPI—Master Mode
    13. 7.13 Multimedia Card (MMC) Interface
      1. 7.13.1 MMC Electrical Data and Timing
    14. 7.14 Programmable Real-Time Unit Subsystem and Industrial Communication Subsystem (PRU-ICSS)
      1. 7.14.1 Programmable Real-Time Unit (PRU-ICSS PRU)
        1. 7.14.1.1 PRU-ICSS PRU Direct Input/Output Mode Electrical Data and Timing
        2. 7.14.1.2 PRU-ICSS PRU Parallel Capture Mode Electrical Data and Timing
        3. 7.14.1.3 PRU-ICSS PRU Shift Mode Electrical Data and Timing
      2. 7.14.2 PRU-ICSS EtherCAT (PRU-ICSS ECAT)
        1. 7.14.2.1 PRU-ICSS ECAT Electrical Data and Timing
      3. 7.14.3 PRU-ICSS MII_RT and Switch
        1. 7.14.3.1 PRU-ICSS MDIO Electrical Data and Timing
        2. 7.14.3.2 PRU-ICSS MII_RT Electrical Data and Timing
      4. 7.14.4 PRU-ICSS Universal Asynchronous Receiver Transmitter (PRU-ICSS UART)
    15. 7.15 Universal Asynchronous Receiver Transmitter (UART)
      1. 7.15.1 UART Electrical Data and Timing
      2. 7.15.2 UART IrDA Interface
  8. 8Device and Documentation Support
    1. 8.1 Device Nomenclature
    2. 8.2 Tools and Software
    3. 8.3 Documentation Support
    4. 8.4 Related Links
    5. 8.5 Community Resources
    6. 8.6 商標
    7. 8.7 静電気放電に関する注意事項
    8. 8.8 Glossary
  9. 9Mechanical, Packaging, and Orderable Information
    1. 9.1 Via Channel
    2. 9.2 Packaging Information

パッケージ・オプション

デバイスごとのパッケージ図は、PDF版データシートをご参照ください。

メカニカル・データ（パッケージ｜ピン）
  • ZCZ|324
サーマルパッド・メカニカル・データ
発注情報

3 Device Comparison

Table 3-1 lists the features supported across different AM335x devices.

Table 3-1 Device Features Comparison

FUNCTION AM3351 AM3352 AM3354 AM3356 AM3357 AM3358 AM3359
ARM Cortex-A8 Yes Yes Yes Yes Yes Yes Yes
Frequency(1) 300 MHz
600 MHz		 300 MHz
600 MHz
800 MHz
1000 MHz		 600 MHz
800 MHz
1000 MHz		 300 MHz
600 MHz
800 MHz		 300 MHz
600 MHz
800 MHz		 600 MHz
800 MHz
1000 MHz		 600 MHz
800 MHz
MIPS(2) 600
1200		 600
1200
1600
2000		 1200
1600
2000		 600
1200
1600		 600
1200
1600		 1200
1600
2000		 1200
1600
On-chip L1 cache 64KB 64KB 64KB 64KB 64KB 64KB 64KB
On-chip L2 cache 256KB 256KB 256KB 256KB 256KB 256KB 256KB
Graphics accelerator (SGX530) — — 3D — — 3D 3D
Hardware acceleration Crypto accelerator Crypto accelerator Crypto accelerator Crypto accelerator Crypto accelerator Crypto accelerator Crypto accelerator
Programmable real-time unit subsystem and industrial communication subsystem (PRU-ICSS) — — — Features including basic Industrial protocols;
ZCE: Limited PRU I/Os pinned out		 Features including all Industrial protocols Features including basic Industrial protocols Features including all Industrial protocols
On-chip memory 128KB 128KB 128KB 128KB 128KB 128KB 128KB
Display options LCD LCD LCD LCD LCD LCD LCD
General-purpose memory 1 16-bit (GPMC, NAND flash, NOR flash, SRAM) 1 16-bit (GPMC, NAND flash, NOR flash, SRAM) 1 16-bit (GPMC, NAND flash, NOR flash, SRAM) 1 16-bit (GPMC, NAND flash, NOR flash, SRAM) 1 16-bit (GPMC, NAND flash, NOR flash, SRAM) 1 16-bit (GPMC, NAND flash, NOR flash, SRAM) 1 16-bit (GPMC, NAND flash, NOR flash, SRAM)
DRAM(3) 1 16-bit (LPDDR-400, DDR2-532, DDR3-800) 1 16-bit (LPDDR-400, DDR2-532, DDR3-800) 1 16-bit (LPDDR-400, DDR2-532, DDR3-800) 1 16-bit (LPDDR-400, DDR2-532, DDR3-800) 1 16-bit (LPDDR-400, DDR2-532, DDR3-800) 1 16-bit (LPDDR-400, DDR2-532, DDR3-800) 1 16-bit (LPDDR-400, DDR2-532, DDR3-800)
Universal serial bus (USB) ZCE: 1 port ZCE: 1 port
ZCZ: 2 ports		 ZCE: 1 port
ZCZ: 2 ports		 ZCE: 1 port
ZCZ: 2 ports		 No ZCE Available
ZCZ: 2 ports		 No ZCE Available
ZCZ: 2 ports		 No ZCE Available
ZCZ: 2 ports
Ethernet media access controller (EMAC) with 2-port switch 10/100/1000
ZCE: 1 port		 10/100/1000
ZCE: 1 port
ZCZ: 2 ports		 10/100/1000
ZCE: 1 port
ZCZ: 2 ports		 10/100/1000
ZCE: 1 port
ZCZ: 2 ports		 10/100/1000
No ZCE Available
ZCZ: 2 ports		 10/100/1000
No ZCE Available
ZCZ: 2 ports		 10/100/1000
No ZCE Available
ZCZ: 2 ports
Multimedia card (MMC) 3 3 3 3 3 3 3
Controller-area network (CAN) — 2 2 2 2 2 2
Universal asynchronous receiver and transmitter (UART) 6 6 6 6 6 6 6
Analog-to-digital converter (ADC) 8-ch 12-bit 8-ch 12-bit 8-ch 12-bit 8-ch 12-bit 8-ch 12-bit 8-ch 12-bit 8-ch 12-bit
Enhanced high-resolution PWM modules (eHRPWM) 3 3 3 3 3 3 3
Enhanced capture modules (eCAP) 3 3 3 3 3 3 3
Enhanced quadrature encoder pulse (eQEP) 3 3 3 3 3 3 3
Real-time clock (RTC) 1 1 1 1 1 1 1
Inter-integrated circuit (I2C) 3 3 3 3 3 3 3
Multichannel audio serial port (McASP) 2 2 2 2 2 2 2
Multichannel serial port interface (McSPI) 2 2 2 2 2 2 2
Enhanced direct memory access (EDMA) 64-Ch 64-Ch 64-Ch 64-Ch 64-Ch 64-Ch 64-Ch
Input/output (I/O) supply 1.8 V, 3.3 V 1.8 V, 3.3 V 1.8 V, 3.3 V 1.8 V, 3.3 V 1.8 V, 3.3 V 1.8 V, 3.3 V 1.8 V, 3.3 V
Operating temperature range 0 to 90°C
–40 to 105°C		 -40 to 125°C(4)
–40 to 105°C
–40 to 90°C
0 to 90°C		 –40 to 105°C
–40 to 90°C
0 to 90°C		 –40 to 105°C
–40 to 90°C
0 to 90°C		 –40 to 105°C
–40 to 90°C		 –40 to 105°C
–40 to 90°C
0 to 90°C		 –40 to 105°C
–40 to 90°C
  1. Frequencies listed correspond to silicon revision 2.x. Earlier silicon revisions support 275 MHz, 500 MHz, 600 MHz, and 720 MHz.
  2. MIPS listed correspond to silicon revision 2.x. Earlier silicon revisions support 560, 1000, 1200, and 1440.
  3. DRAM speeds listed are data rates.
  4. Industrial extended temperature only supported for 300-MHz and 600-MHz frequencies.

3.1 Related Products

For information about other devices in this family of products, see the following links:

    Sitara Processors Scalable processors based on ARM Cortex-A cores with flexible peripherals, connectivity and unified software support – perfect for sensors to servers.
    TI's ARM Cortex-A8 Advantage The ARM Cortex-A8 core is highly-optimized by ARM for performance and power efficiency. With the ability to scale in speed from 300 MHz to 1.35 GHz, the ARM Cortex-A8-based processor can meet the requirements for power optimized devices with a power budget of less than the Cortex-A8 core a dual-issue superscalar, achieving twice the instructions executed per clock cycle at 2 DMIPS/MHz.
    AM335x Sitara Processors Scalable ARM Cortex-A8-based core from 300 MHz up to 1 GHz, 3D graphics option for enhanced user interface, dual-core PRU-ICSS for industrial Ethernet protocols and position feedback control, and premium secure boot option.
    TI Designs for AM335x Sitara Processors The TI Designs Reference Design Library is a robust reference design library spanning analog, embedded processor and connectivity. Created by TI experts to help you jump start your system design, all TI Designs include schematic or block diagrams, BOMs and design files to speed your time to market. Search and download designs at ti.com/tidesigns.