JAJSEZ3E June 2014 – January 2019 AM4372 , AM4376 , AM4377 , AM4378 , AM4379
PRODUCTION DATA.
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Failure to maintain a junction temperature within the range specified in Section 5.5 reduces operating lifetime, reliability, and performance—and may cause irreversible damage to the system. Therefore, the product design cycle should include thermal analysis to verify the maximum operating junction temperature of the device. It is important this thermal analysis is performed using specific system use cases and conditions. TI provides an application report to aid users in overcoming some of the existing challenges of producing a good thermal design. For more information, see AM43xx Thermal Considerations.
Table 5-7 provides thermal characteristics for the packages used on this device.
NOTE
This table provides simulation data and may not represent actual use-case values.