JAJSGC7F December 2015 – May 2019 AM5726 , AM5728 , AM5729
PRODUCTION DATA.
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Table 5-18 provides the thermal resistance characteristics for the package used on this device.
NOTE
Power dissipation of 1.5 W and an ambient temperature of 85ºC is assumed for ABC package.
NO. | PARAMETER | DESCRIPTION | °C/W(1) | AIR FLOW (m/s)(2) |
---|---|---|---|---|
T1 | RΘJC | Junction-to-case | 0.82 | N/A |
T2 | RΘJB | Junction-to-board | 3.78 | N/A |
T3 | RΘJA | Junction-to-free air | 11.1 | 0 |
T4 | Junction-to-moving air | 8.8 | 1 | |
T5 | 8.0 | 2 | ||
T6 | 7.5 | 3 | ||
T7 | ΨJT | Junction-to-package top | 0.62 | 0 |
T8 | 0.66 | 1 | ||
T9 | 0.66 | 2 | ||
T10 | 0.66 | 3 | ||
T11 | ΨJB | Junction-to-board | 3.43 | 0 |
T12 | 3.22 | 1 | ||
T13 | 3.12 | 2 | ||
T14 | 3.04 | 3 |