JAJSSK1 December   2023 AM62P , AM62P-Q1

ADVANCE INFORMATION  

  1.   1
  2. 1 特長
  3. 2 アプリケーション
  4. 3 概要
    1. 3.1 機能ブロック図
  5. 4 Device Comparison
    1. 4.1 Related Products
  6. 5 Terminal Configuration and Functions
    1. 5.1 Pin Diagrams
    2. 5.2 Pin Attributes
      1.      11
      2.      12
    3. 5.3 Signal Descriptions
      1.      14
      2. 5.3.1  CPSW3G
        1. 5.3.1.1 MAIN Domain
          1.        17
          2.        18
          3.        19
          4.        20
      3. 5.3.2  CPTS
        1. 5.3.2.1 MAIN Domain
          1.        23
      4. 5.3.3  CSI-2
        1. 5.3.3.1 MAIN Domain
          1.        26
      5. 5.3.4  DDRSS
        1. 5.3.4.1 MAIN Domain
          1.        29
      6. 5.3.5  DSI
        1. 5.3.5.1 MAIN Domain
          1.        32
      7. 5.3.6  DSS
        1. 5.3.6.1 MAIN Domain
          1.        35
      8. 5.3.7  ECAP
        1. 5.3.7.1 MAIN Domain
          1.        38
          2.        39
          3.        40
      9. 5.3.8  Emulation and Debug
        1. 5.3.8.1 MAIN Domain
          1.        43
        2. 5.3.8.2 MCU Domain
          1.        45
      10. 5.3.9  EPWM
        1. 5.3.9.1 MAIN Domain
          1.        48
          2.        49
          3.        50
          4.        51
      11. 5.3.10 EQEP
        1. 5.3.10.1 MAIN Domain
          1.        54
          2.        55
          3.        56
      12. 5.3.11 GPIO
        1. 5.3.11.1 MAIN Domain
          1.        59
          2.        60
        2. 5.3.11.2 MCU Domain
          1.        62
      13. 5.3.12 GPMC
        1. 5.3.12.1 MAIN Domain
          1.        65
      14. 5.3.13 I2C
        1. 5.3.13.1 MAIN Domain
          1.        68
          2.        69
          3.        70
          4.        71
        2. 5.3.13.2 MCU Domain
          1.        73
        3. 5.3.13.3 WKUP Domain
          1.        75
      15. 5.3.14 MCAN
        1. 5.3.14.1 MAIN Domain
          1.        78
          2.        79
        2. 5.3.14.2 MCU Domain
          1.        81
          2.        82
      16. 5.3.15 MCASP
        1. 5.3.15.1 MAIN Domain
          1.        85
          2.        86
          3.        87
      17. 5.3.16 MCSPI
        1. 5.3.16.1 MAIN Domain
          1.        90
          2.        91
          3.        92
        2. 5.3.16.2 MCU Domain
          1.        94
          2.        95
      18. 5.3.17 MDIO
        1. 5.3.17.1 MAIN Domain
          1.        98
      19. 5.3.18 MMC
        1. 5.3.18.1 MAIN Domain
          1.        101
          2.        102
          3.        103
      20. 5.3.19 OLDI
        1. 5.3.19.1 MAIN Domain
          1.        106
      21. 5.3.20 OSPI
        1. 5.3.20.1 MAIN Domain
          1.        109
      22. 5.3.21 Power Supply
        1.       111
      23. 5.3.22 Reserved
        1.       113
      24. 5.3.23 System and Miscellaneous
        1. 5.3.23.1 Boot Mode Configuration
          1. 5.3.23.1.1 MAIN Domain
            1.         117
        2. 5.3.23.2 Clock
          1. 5.3.23.2.1 MCU Domain
            1.         120
          2. 5.3.23.2.2 WKUP Domain
            1.         122
        3. 5.3.23.3 System
          1. 5.3.23.3.1 MAIN Domain
            1.         125
          2. 5.3.23.3.2 MCU Domain
            1.         127
          3. 5.3.23.3.3 WKUP Domain
            1.         129
        4. 5.3.23.4 VMON
          1.        131
      25. 5.3.24 TIMER
        1. 5.3.24.1 MAIN Domain
          1.        134
        2. 5.3.24.2 MCU Domain
          1.        136
        3. 5.3.24.3 WKUP Domain
          1.        138
      26. 5.3.25 UART
        1. 5.3.25.1 MAIN Domain
          1.        141
          2.        142
          3.        143
          4.        144
          5.        145
          6.        146
          7.        147
        2. 5.3.25.2 MCU Domain
          1.        149
        3. 5.3.25.3 WKUP Domain
          1.        151
      27. 5.3.26 USB
        1. 5.3.26.1 MAIN Domain
          1.        154
          2.        155
    4. 5.4 Pin Connectivity Requirements
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings for Devices which are not AEC - Q100 Qualified
    3. 6.3  ESD Ratings for AEC - Q100 Qualified Devices
    4. 6.4  Power-On Hours (POH)
    5. 6.5  Recommended Operating Conditions
    6. 6.6  Operating Performance Points
    7. 6.7  Power Consumption Summary
    8. 6.8  Electrical Characteristics
      1. 6.8.1  I2C Open-Drain, and Fail-Safe (I2C OD FS) Electrical Characteristics
      2. 6.8.2  Fail-Safe Reset (FS RESET) Electrical Characteristics
      3. 6.8.3  High-Frequency Oscillator (HFOSC) Electrical Characteristics
      4. 6.8.4  Low-Frequency Oscillator (LFXOSC) Electrical Characteristics
      5. 6.8.5  eMMCPHY Electrical Characteristics
      6. 6.8.6  SDIO Electrical Characteristics
      7. 6.8.7  LVCMOS Electrical Characteristics
      8. 6.8.8  OLDI LVDS (OLDI) Electrical Characteristics
      9. 6.8.9  CSI-2 (D-PHY) Electrical Characteristics
      10. 6.8.10 DSI (D-PHY) Electrical Characteristics
      11. 6.8.11 USB2PHY Electrical Characteristics
      12. 6.8.12 DDR Electrical Characteristics
    9. 6.9  VPP Specifications for One-Time Programmable (OTP) eFuses
      1. 6.9.1 Recommended Operating Conditions for OTP eFuse Programming
      2. 6.9.2 Hardware Requirements
      3. 6.9.3 Programming Sequence
      4. 6.9.4 Impact to Your Hardware Warranty
    10. 6.10 Thermal Resistance Characteristics
      1. 6.10.1 Thermal Resistance Characteristics for AMH Package
    11. 6.11 Timing and Switching Characteristics
      1. 6.11.1 Timing Parameters and Information
      2. 6.11.2 Power Supply Requirements
        1. 6.11.2.1 Power Supply Slew Rate Requirement
        2. 6.11.2.2 Power Supply Sequencing
          1. 6.11.2.2.1 Power-Up Sequencing
          2. 6.11.2.2.2 Power-Down Sequencing
          3. 6.11.2.2.3 Partial IO Power Sequencing
      3. 6.11.3 System Timing
        1. 6.11.3.1 Reset Timing
        2. 6.11.3.2 Error Signal Timing
        3. 6.11.3.3 Clock Timing
      4. 6.11.4 Clock Specifications
        1. 6.11.4.1 Input Clocks / Oscillators
          1. 6.11.4.1.1 MCU_OSC0 Internal Oscillator Clock Source
            1. 6.11.4.1.1.1 Load Capacitance
            2. 6.11.4.1.1.2 Shunt Capacitance
          2. 6.11.4.1.2 MCU_OSC0 LVCMOS Digital Clock Source
          3. 6.11.4.1.3 WKUP_LFOSC0 Internal Oscillator Clock Source
          4. 6.11.4.1.4 WKUP_LFOSC0 LVCMOS Digital Clock Source
          5. 6.11.4.1.5 WKUP_LFOSC0 Not Used
        2. 6.11.4.2 Output Clocks
        3. 6.11.4.3 PLLs
        4. 6.11.4.4 Recommended System Precautions for Clock and Control Signal Transitions
      5. 6.11.5 Peripherals
        1. 6.11.5.1  CPSW3G
          1. 6.11.5.1.1 CPSW3G MDIO Timing
          2. 6.11.5.1.2 CPSW3G RMII Timing
          3. 6.11.5.1.3 CPSW3G RGMII Timing
        2. 6.11.5.2  CPTS
        3. 6.11.5.3  CSI-2
        4. 6.11.5.4  DDRSS
        5. 6.11.5.5  DSI
        6. 6.11.5.6  DSS
        7. 6.11.5.7  ECAP
        8. 6.11.5.8  Emulation and Debug
          1. 6.11.5.8.1 Trace
          2. 6.11.5.8.2 JTAG
        9. 6.11.5.9  EPWM
        10. 6.11.5.10 EQEP
        11. 6.11.5.11 GPIO
        12. 6.11.5.12 GPMC
          1. 6.11.5.12.1 GPMC and NOR Flash — Synchronous Mode
          2. 6.11.5.12.2 GPMC and NOR Flash — Asynchronous Mode
          3. 6.11.5.12.3 GPMC and NAND Flash — Asynchronous Mode
        13. 6.11.5.13 I2C
        14. 6.11.5.14 MCAN
        15. 6.11.5.15 MCASP
        16. 6.11.5.16 MCSPI
          1. 6.11.5.16.1 MCSPI — Controller Mode
          2. 6.11.5.16.2 MCSPI — Peripheral Mode
        17. 6.11.5.17 MMCSD
          1. 6.11.5.17.1 MMC0 - eMMC Interface
            1. 6.11.5.17.1.1 Legacy SDR Mode
            2. 6.11.5.17.1.2 High Speed SDR Mode
            3. 6.11.5.17.1.3 High Speed DDR Mode
            4. 6.11.5.17.1.4 HS200 Mode
            5. 6.11.5.17.1.5 HS400 Mode
          2. 6.11.5.17.2 MMC1/MMC2 - SD/SDIO Interface
            1. 6.11.5.17.2.1 Default Speed Mode
            2. 6.11.5.17.2.2 High Speed Mode
            3. 6.11.5.17.2.3 UHS–I SDR12 Mode
            4. 6.11.5.17.2.4 UHS–I SDR25 Mode
            5. 6.11.5.17.2.5 UHS–I SDR50 Mode
            6. 6.11.5.17.2.6 UHS–I DDR50 Mode
            7. 6.11.5.17.2.7 UHS–I SDR104 Mode
        18. 6.11.5.18 OLDI
          1. 6.11.5.18.1 OLDI0 Switching Characteristics
        19. 6.11.5.19 OSPI
          1. 6.11.5.19.1 OSPI0 PHY Mode
            1. 6.11.5.19.1.1 OSPI0 With PHY Data Training
            2. 6.11.5.19.1.2 OSPI0 Without Data Training
              1. 6.11.5.19.1.2.1 OSPI0 PHY SDR Timing
              2. 6.11.5.19.1.2.2 OSPI0 PHY DDR Timing
          2. 6.11.5.19.2 OSPI0 Tap Mode
            1. 6.11.5.19.2.1 OSPI0 Tap SDR Timing
            2. 6.11.5.19.2.2 OSPI0 Tap DDR Timing
        20. 6.11.5.20 Timers
        21. 6.11.5.21 UART
        22. 6.11.5.22 USB
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Processor Subsystems
      1. 7.2.1 Arm Cortex-A53 Subsystem
      2. 7.2.2 Device/Power Manager
      3. 7.2.3 MCU Arm Cortex-R5F Subsystem
    3. 7.3 Accelerators and Coprocessors
    4. 7.4 Other Subsystems
      1. 7.4.1 Dual Clock Comparator (DCC)
      2. 7.4.2 Data Movement Subsystem (DMSS)
      3. 7.4.3 Memory Cyclic Redundancy Check (MCRC)
      4. 7.4.4 Peripheral DMA Controller (PDMA)
      5. 7.4.5 Real-Time Clock (RTC)
    5. 7.5 Peripherals
      1. 7.5.1  Gigabit Ethernet Switch (CPSW3G)
      2. 7.5.2  Camera Serial Interface Receiver (CSI_RX_IF)
      3. 7.5.3  Display Subsystem (DSS)
      4. 7.5.4  Enhanced Capture (ECAP)
      5. 7.5.5  Error Location Module (ELM)
      6. 7.5.6  Enhanced Pulse Width Modulation (EPWM)
      7. 7.5.7  Error Signaling Module (ESM)
      8. 7.5.8  Enhanced Quadrature Encoder Pulse (EQEP)
      9. 7.5.9  General-Purpose Interface (GPIO)
      10. 7.5.10 General-Purpose Memory Controller (GPMC)
      11. 7.5.11 Global Timebase Counter (GTC)
      12. 7.5.12 Inter-Integrated Circuit (I2C)
      13. 7.5.13 Modular Controller Area Network (MCAN)
      14. 7.5.14 Multichannel Audio Serial Port (MCASP)
      15. 7.5.15 Multichannel Serial Peripheral Interface (MCSPI)
      16. 7.5.16 Multi-Media Card Secure Digital (MMCSD)
      17. 7.5.17 Octal Serial Peripheral Interface (OSPI)
      18. 7.5.18 Timers
      19. 7.5.19 Universal Asynchronous Receiver/Transmitter (UART)
      20. 7.5.20 Universal Serial Bus Subsystem (USBSS)
  9. 8 Applications, Implementation, and Layout
    1. 8.1 Device Connection and Layout Fundamentals
      1. 8.1.1 Power Supply
        1. 8.1.1.1 Power Supply Designs
        2. 8.1.1.2 Power Distribution Network Implementation Guidance
      2. 8.1.2 External Oscillator
      3. 8.1.3 JTAG, EMU, and TRACE
      4. 8.1.4 Unused Pins
    2. 8.2 Peripheral- and Interface-Specific Design Information
      1. 8.2.1 DDR Board Design and Layout Guidelines
      2. 8.2.2 OSPI/QSPI/SPI Board Design and Layout Guidelines
        1. 8.2.2.1 No Loopback, Internal PHY Loopback, and Internal Pad Loopback
        2. 8.2.2.2 External Board Loopback
        3. 8.2.2.3 DQS (only available in Octal SPI devices)
      3. 8.2.3 USB VBUS Design Guidelines
      4. 8.2.4 System Power Supply Monitor Design Guidelines
      5. 8.2.5 High Speed Differential Signal Routing Guidance
      6. 8.2.6 Thermal Solution Guidance
    3. 8.3 Clock Routing Guidelines
      1. 8.3.1 Oscillator Routing
  10. 9 Device and Documentation Support
    1. 9.1 Device Nomenclature
      1. 9.1.1 Standard Package Symbolization
      2. 9.1.2 Device Naming Convention
    2. 9.2 Tools and Software
    3. 9.3 Documentation Support
    4. 9.4 サポート・リソース
    5. 9.5 Trademarks
    6. 9.6 静電気放電に関する注意事項
    7. 9.7 用語集
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information
    1. 11.1 Packaging Information

パッケージ・オプション

デバイスごとのパッケージ図は、PDF版データシートをご参照ください。

メカニカル・データ（パッケージ｜ピン）
  • AMH|466
サーマルパッド・メカニカル・データ
発注情報

6.11.3.1 Reset Timing

Tables and figures provided in this section define timing conditions, timing requirements, and switching characteristics for reset related signals.

Table 6-6 Reset Timing Conditions
PARAMETER MIN MAX UNIT
INPUT CONDITIONS
SRI Input slew rate VDD(1) = 1.8V 0.0018 V/ns
VDD(1) = 3.3V 0.0033 V/ns
OUTPUT CONDITIONS
CL Output load capacitance 30 pF
(1) VDD stands for corresponding power supply. For more information on the power supply name and the corresponding ball(s), see POWER column of the Pin Attributes table.
Table 6-7 MCU_PORz Timing Requirements see Figure 6-7
NO. PARAMETER MIN MAX UNIT
RST1 th(SUPPLIES_VALID - MCU_PORz) Hold time, MCU_PORz active (low) at Power-up after supplies valid (using external crystal circuit) 9500000 ns
RST2 Hold time, MCU_PORz active (low) at Power-up after supplies valid and external clock stable (using external LVCMOS clock source) 1200 ns
RST3 tw(MCU_PORzL) Pulse Width, MCU_PORz low after Power-up (without removal of Power or system reference clock MCU_OSC0_XI/XO) 1200 ns
GUID-20201203-CA0I-V7TM-4GDD-HCLFF1NQ2VFS-low.gif Figure 6-7 MCU_PORz Timing Requirements
Table 6-8 MCU_RESETSTATz, and RESETSTATz Switching Characteristics see Figure 6-8
NO. PARAMETER MIN MAX UNIT
RST4 td(MCU_PORzL-MCU_RESETSTATzL) Delay time, MCU_PORz active (low) to MCU_RESETSTATz active (low) 0 ns
RST5 td(MCU_PORzH-MCU_RESETSTATzH) Delay time, MCU_PORz inactive (high) to MCU_RESETSTATz inactive (high) 6120*S(1) ns
RST6 td(MCU_PORzL-RESETSTATzL) Delay time, MCU_PORz active (low) to RESETSTATz active (low) 0 ns
RST7 td(MCU_PORzH-RESETSTATzH) Delay time, MCU_PORz inactive (high) to RESETSTATz inactive (high) 9195*S(1) ns
RST8 tw(MCU_RESETSTATzL) Pulse Width, MCU_RESETSTATz low (SW_MCU_WARMRST) 966*S(1) ns
RST9 tw(RESETSTATzL) Pulse Width, RESETSTATz low (SW_MCU_WARMRST, SW_MAIN_PORz, or SW_MAIN_WARMRST) 4040*S ns
(1) S = MCU_OSC0_XI/XO clock period in ns.
GUID-20201203-CA0I-7G87-3ZN8-NLDKQB9DLWN0-low.gif Figure 6-8 MCU_RESETSTATz, and RESETSTATz Switching Characteristics
Table 6-9 MCU_RESETz Timing Requirements see Figure 6-9
NO. PARAMETER MIN MAX UNIT
RST10 tw(MCU_RESETzL)(1) Pulse Width, MCU_RESETz active (low) 1200 ns
(1) This timing parameter is valid only after all supplies are valid and MCU_PORz has been asserted for the specified time.
Table 6-10 MCU_RESETSTATz, and RESETSTATz Switching Characteristics see Figure 6-9
NO. PARAMETER MIN MAX UNIT
RST11 td(MCU_RESETzL-MCU_RESETSTATzL) Delay time, MCU_RESETz active (low) to MCU_RESETSTATz active (low) 0   ns
RST12 td(MCU_RESETzH-MCU_RESETSTATzH) Delay time, MCU_RESETz inactive (high) to MCU_RESETSTATz inactive (high) 966*S(1)   ns
RST13 td(MCU_RESETzL-RESETSTATzL) Delay time, MCU_RESETz active (low) to RESETSTATz active (low) 960   ns
RST14 td(MCU_RESETzH-RESETSTATzH) Delay time, MCU_RESETz inactive (high) to RESETSTATz inactive (high) 4040*S(1)   ns
(1) S = MCU_OSC0_XI/XO clock period in ns.
GUID-20201203-CA0I-VX22-S6RT-L3ZWH3HLXTJZ-low.gif Figure 6-9 MCU_RESETz, MCU_RESETSTATz, and RESETSTATz Timing Requirements and Switching Characteristics
Table 6-11 RESET_REQz Timing Requirements see Figure 6-10
NO. PARAMETER MIN MAX UNIT
RST15 tw(RESET_REQzL)(1) Pulse Width, RESET_REQz active (low) 1200   ns
(1) This timing parameter is valid only after all supplies are valid and MCU_PORz has been asserted for the specified time.
Table 6-12 RESETSTATz Switching Characteristics see Figure 6-10
NO. PARAMETER MIN MAX UNIT
RST16 td(RESET_REQzL-RESETSTATzL) Delay time, RESET_REQz active (low) to RESETSTATz active (low) 900*T(1) ns
RST17 td(RESET_REQzH-RESETSTATzH) Delay time, RESET_REQz inactive (high) to RESETSTATz inactive (high) 4040*S(2) ns
(1) T = Reset Isolation Time (Software Dependent)
(2) S = MCU_OSC0_XI/XO clock period in ns.
GUID-20201203-CA0I-3PH0-GBT4-HKQGC1ZF880N-low.gif Figure 6-10 RESET_REQz and RESETSTATz Timing Requirements and Switching Characteristics
Table 6-13 EMUx Timing Requirements see Figure 6-11
NO. PARAMETER MIN MAX UNIT
RST18 tsu(EMUx-MCU_PORz) Setup time, EMU[1:0] before MCU_PORz inactive (high) 3*S(1) ns
RST19 th(MCU_PORz - EMUx) Hold time, EMU[1:0] after MCU_PORz inactive (high) 10 ns
(1) S = MCU_OSC0_XI/XO clock period in ns.
GUID-20201203-CA0I-V2SH-L4F0-JWZBNSQNLJB9-low.gif Figure 6-11 EMUx Timing Requirements
Table 6-14 BOOTMODE Timing Requirements see Figure 6-12
NO. PARAMETER MIN MAX UNIT
RST23 tsu(BOOTMODE-PORz_OUT) Setup time, BOOTMODE[15:00] before PORz_OUT high (External MCU PORz event or Software SW_MAIN_PORz) 3*S(1)   ns
RST24 th(PORz_OUT - BOOTMODE) Hold time, BOOTMODE[15:00] after PORz_OUT high (External MCU PORz event, or Software SW_MAIN_PORz) 0   ns
(1) S = MCU_OSC0_XI/XO clock period in ns.
Table 6-15 PORz_OUT Switching Characteristics see Figure 6-12
NO. PARAMETER MIN MAX UNIT
RST25 td(MCU_PORzL-PORz_OUT) Delay time, MCU_PORz active (low) to PORz_OUT active (low) 0   ns
RST26 td(MCU_PORzH-PORz_OUT) Delay time, MCU_PORz inactive (high) to PORz_OUT inactive (high) 1840   ns
RST27 tw(PORz_OUTL) Pulse Width, PORz_OUT low (MCU_PORz or SW_MAIN_PORz) 1200   ns
GUID-20201203-CA0I-JR47-ZJG6-G4ZPJZTZZN9S-low.gif Figure 6-12 BOOTMODE Timing Requirements and PORz_OUT Switching Characteristics