JAJSQ12A
February 2023 – August 2023
AM68
,
AM68A
PRODUCTION DATA
1
1
特長
2
アプリケーション
3
概要
3.1
機能ブロック図
4
Revision History
5
Device Comparison
6
Terminal Configuration and Functions
6.1
Pin Diagrams
6.2
Pin Attributes
11
12
6.3
Signal Descriptions
14
6.3.1
ADC
6.3.1.1
MCU Domain
17
18
19
6.3.2
DDRSS
6.3.2.1
MAIN Domain
22
23
6.3.3
GPIO
6.3.3.1
MAIN Domain
26
6.3.3.2
WKUP Domain
28
6.3.4
I2C
6.3.4.1
MAIN Domain
31
32
33
34
35
36
37
6.3.4.2
MCU Domain
39
40
6.3.4.3
WKUP Domain
42
6.3.5
I3C
6.3.5.1
MCU Domain
45
6.3.6
MCAN
6.3.6.1
MAIN Domain
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
65
6.3.6.2
MCU Domain
67
68
6.3.7
MCSPI
6.3.7.1
MAIN Domain
71
72
73
74
75
76
77
6.3.7.2
MCU Domain
79
80
6.3.8
UART
6.3.8.1
MAIN Domain
83
84
85
86
87
88
89
90
91
92
6.3.8.2
MCU Domain
94
6.3.8.3
WKUP Domain
96
6.3.9
MDIO
6.3.9.1
MAIN Domain
99
6.3.9.2
MCU Domain
101
6.3.10
CPSW2G
6.3.10.1
MAIN Domain
104
6.3.10.2
MCU Domain
106
6.3.11
ECAP
6.3.11.1
MAIN Domain
109
110
111
6.3.12
EQEP
6.3.12.1
MAIN Domain
114
115
116
6.3.13
EPWM
6.3.13.1
MAIN Domain
119
120
121
122
123
124
125
6.3.14
USB
6.3.14.1
MAIN Domain
128
6.3.15
Display Port
6.3.15.1
MAIN Domain
131
6.3.16
Hyperlink
6.3.16.1
MAIN Domain
134
135
136
6.3.17
PCIE
6.3.17.1
MAIN Domain
139
6.3.18
SERDES
6.3.18.1
MAIN Domain
142
6.3.19
DSI
6.3.19.1
MAIN Domain
145
146
6.3.20
CSI
6.3.20.1
MAIN Domain
149
150
6.3.21
MCASP
6.3.21.1
MAIN Domain
153
154
155
156
157
6.3.22
DMTIMER
6.3.22.1
MAIN Domain
160
6.3.22.2
MCU Domain
162
6.3.23
CPTS
6.3.23.1
MAIN Domain
165
6.3.23.2
MCU Domain
167
6.3.24
DSS
6.3.24.1
MAIN Domain
170
6.3.25
GPMC
6.3.25.1
MAIN Domain
173
6.3.26
MMC
6.3.26.1
MAIN Domain
176
177
6.3.27
OSPI
6.3.27.1
MCU Domain
180
181
6.3.28
Hyperbus
6.3.28.1
MCU Domain
184
6.3.29
Emulation and Debug
6.3.29.1
MAIN Domain
187
188
6.3.30
System and Miscellaneous
6.3.30.1
Boot Mode configuration
191
6.3.30.2
Clock
193
194
6.3.30.3
System
196
197
6.3.30.4
EFUSE
199
6.3.30.5
VMON
201
6.3.31
Power
203
6.4
Connection for Unused Pins
7
Specifications
7.1
絶対最大定格
7.2
ESD Ratings
7.3
Recommended Operating Conditions
7.4
Power-On-Hour (POH) Limits
7.5
Operating Performance Points
7.6
Electrical Characteristics
7.6.1
I2C, Open-Drain, Fail-Safe (I2C OD FS) Electrical Characteristics
7.6.2
Fail-Safe Reset (FS Reset) Electrical Characteristics
7.6.3
HFOSC/LFOSC Electrical Characteristics
7.6.4
eMMCPHY Electrical Characteristics
7.6.5
SDIO Electrical Characteristics
7.6.6
CSI2/DSI D-PHY Electrical Characteristics
7.6.7
ADC12B Electrical Characteristics
7.6.8
LVCMOS Electrical Characteristics
7.6.9
USB2PHY Electrical Characteristics
7.6.10
SerDes 2-L-PHY/4-L-PHY Electrical Characteristics
7.6.11
UFS M-PHY Electrical Characteristics
7.6.12
eDP/DP AUX-PHY Electrical Characteristics
7.6.13
DDR0 Electrical Characteristics
7.7
VPP Specifications for One-Time Programmable (OTP) eFuses
7.7.1
Recommended Operating Conditions for OTP eFuse Programming
7.7.2
Hardware Requirements
7.7.3
Programming Sequence
7.7.4
Impact to Your Hardware Warranty
7.8
Thermal Resistance Characteristics
7.8.1
Thermal Resistance Characteristics for ALZ Package
7.9
Temperature Sensor Characteristics
7.10
Timing and Switching Characteristics
7.10.1
Timing Parameters and Information
7.10.2
Power Supply Sequencing
7.10.2.1
Power Supply Slew Rate Requirement
7.10.2.2
Combined MCU and Main Domains Power- Up Sequencing
7.10.2.3
Combined MCU and Main Domains Power- Down Sequencing
7.10.2.4
Isolated MCU and Main Domains Power- Up Sequencing
7.10.2.5
Isolated MCU and Main Domains Power- Down Sequencing
7.10.2.6
Independent MCU and Main Domains, Entry and Exit of MCU Only Sequencing
7.10.2.7
Independent MCU and Main Domains, Entry and Exit of DDR Retention State
7.10.2.8
Independent MCU and Main Domains, Entry and Exit of GPIO Retention Sequencing
7.10.3
System Timing
7.10.3.1
Reset Timing
7.10.3.2
Safety Signal Timing
7.10.3.3
Clock Timing
7.10.4
Clock Specifications
7.10.4.1
Input and Output Clocks / Oscillators
7.10.4.1.1
WKUP_OSC0 Internal Oscillator Clock Source
7.10.4.1.1.1
Load Capacitance
7.10.4.1.1.2
Shunt Capacitance
7.10.4.1.2
WKUP_OSC0 LVCMOS Digital Clock Source
7.10.4.1.3
Auxiliary OSC1 Internal Oscillator Clock Source
7.10.4.1.3.1
Load Capacitance
7.10.4.1.3.2
Shunt Capacitance
7.10.4.1.4
Auxiliary OSC1 LVCMOS Digital Clock Source
7.10.4.1.5
Auxiliary OSC1 Not Used
7.10.4.2
Output Clocks
7.10.4.3
PLLs
7.10.4.4
Module and Peripheral Clocks Frequencies
7.10.5
Peripherals
7.10.5.1
ATL
7.10.5.1.1
ATL_PCLK Timing Requirements
7.10.5.1.2
ATL_AWS[x] Timing Requirements
7.10.5.1.3
ATL_BWS[x] Timing Requirements
7.10.5.1.4
ATCLK[x] Switching Characteristics
7.10.5.2
CPSW2G
7.10.5.2.1
CPSW2G MDIO Interface Timings
7.10.5.2.2
CPSW2G RMII Timings
7.10.5.2.2.1
CPSW2G RMII[x]_REF_CLK Timing Requirements – RMII Mode
7.10.5.2.2.2
CPSW2G RMII[x]_RXD[1:0], RMII[x]_CRS_DV, and RMII[x]_RX_ER Timing Requirements – RMII Mode
7.10.5.2.2.3
CPSW2G RMII[x]_TXD[1:0], and RMII[x]_TX_EN Switching Characteristics – RMII Mode
7.10.5.2.3
CPSW2G RGMII Timings
7.10.5.2.3.1
RGMII[x]_RXC Timing Requirements – RGMII Mode
7.10.5.2.3.2
CPSW2G Timing Requirements for RGMII[x]_RD[3:0], and RGMII[x]_RCTL – RGMII Mode
7.10.5.2.3.3
CPSW2G RGMII[x]_TXC Switching Characteristics – RGMII Mode
7.10.5.2.3.4
RGMII[x]_TD[3:0], and RGMII[x]_TX_CTL Switching Characteristics – RGMII Mode
7.10.5.3
CSI-2
7.10.5.4
DDRSS
7.10.5.5
DSS
7.10.5.6
eCAP
7.10.5.6.1
Timing Requirements for eCAP
7.10.5.6.2
Switching Characteristics for eCAP
7.10.5.7
EPWM
7.10.5.7.1
Timing Requirements for eHRPWM
7.10.5.7.2
Switching Characteristics for eHRPWM
7.10.5.8
eQEP
7.10.5.8.1
Timing Requirements for eQEP
7.10.5.8.2
Switching Characteristics for eQEP
7.10.5.9
GPIO
7.10.5.9.1
GPIO Timing Requirements
7.10.5.9.2
GPIO Switching Characteristics
7.10.5.10
GPMC
7.10.5.10.1
GPMC and NOR Flash — Synchronous Mode
7.10.5.10.1.1
GPMC and NOR Flash Timing Requirements — Synchronous Mode
7.10.5.10.1.2
GPMC and NOR Flash Switching Characteristics – Synchronous Mode
7.10.5.10.2
GPMC and NOR Flash — Asynchronous Mode
7.10.5.10.2.1
GPMC and NOR Flash Timing Requirements – Asynchronous Mode
7.10.5.10.2.2
GPMC and NOR Flash Switching Characteristics – Asynchronous Mode
7.10.5.10.3
GPMC and NAND Flash — Asynchronous Mode
7.10.5.10.3.1
GPMC and NAND Flash Timing Requirements – Asynchronous Mode
7.10.5.10.3.2
GPMC and NAND Flash Switching Characteristics – Asynchronous Mode
7.10.5.10.4
GPMC0 IOSET
7.10.5.11
HyperBus
7.10.5.11.1
Timing Requirements for HyperBus
7.10.5.11.2
HyperBus 166 MHz Switching Characteristics
7.10.5.11.3
HyperBus 100 MHz Switching Characteristics
7.10.5.12
I2C
7.10.5.13
I3C
7.10.5.14
MCAN
7.10.5.15
MCASP
7.10.5.16
MCSPI
7.10.5.16.1
MCSPI — Controller Mode
7.10.5.16.2
MCSPI — Peripheral Mode
7.10.5.17
MMCSD
7.10.5.17.1
MMC0 - eMMC Interface
7.10.5.17.1.1
Legacy SDR Mode
7.10.5.17.1.2
High Speed SDR Mode
7.10.5.17.1.3
High Speed DDR Mode
7.10.5.17.1.4
HS200 Mode
7.10.5.17.1.5
HS400 Mode
7.10.5.17.2
MMC1/2 - SD/SDIO Interface
7.10.5.17.2.1
Default Speed Mode
7.10.5.17.2.2
High Speed Mode
7.10.5.17.2.3
UHS–I SDR12 Mode
7.10.5.17.2.4
UHS–I SDR25 Mode
7.10.5.17.2.5
UHS–I SDR50 Mode
7.10.5.17.2.6
UHS–I DDR50 Mode
7.10.5.17.2.7
UHS–I SDR104 Mode
7.10.5.18
CPTS
7.10.5.18.1
CPTS Timing Requirements
7.10.5.18.2
CPTS Switching Characteristics
7.10.5.19
OSPI
7.10.5.19.1
OSPI0 PHY Mode
7.10.5.19.1.1
OSPI With Data Training
7.10.5.19.1.1.1
OSPI Switching Characteristics – Data Training
7.10.5.19.1.2
OSPI Without Data Training
7.10.5.19.1.2.1
OSPI Timing Requirements – SDR Mode
7.10.5.19.1.2.2
OSPI Switching Characteristics – SDR Mode
7.10.5.19.1.2.3
OSPI Timing Requirements – DDR Mode
7.10.5.19.1.2.4
OSPI Switching Characteristics – DDR Mode
7.10.5.19.2
OSPI0 Tap Mode
7.10.5.19.2.1
OSPI0 Tap SDR Timing
7.10.5.19.2.2
OSPI0 Tap DDR Timing
7.10.5.20
PCIE
7.10.5.21
Timers
7.10.5.21.1
Timing Requirements for Timers
7.10.5.21.2
Switching Characteristics for Timers
7.10.5.22
UART
7.10.5.22.1
Timing Requirements for UART
7.10.5.22.2
UART Switching Characteristics
7.10.5.23
USB
7.10.6
Emulation and Debug
7.10.6.1
Trace
7.10.6.2
JTAG
7.10.6.2.1
JTAG Electrical Data and Timing
7.10.6.2.1.1
JTAG Timing Requirements
7.10.6.2.1.2
JTAG Switching Characteristics
8
Detailed Description
9
Applications, Implementation, and Layout
9.1
Device Connection and Layout Fundamentals
9.1.1
Power Supply Decoupling and Bulk Capacitors
9.1.1.1
Power Distribution Network Implementation Guidance
9.1.2
External Oscillator
9.1.3
JTAG and EMU
9.1.4
Reset
9.1.5
Unused Pins
9.1.6
Hardware Design Guide for JacintoTM 7 Devices
9.2
Peripheral- and Interface-Specific Design Information
9.2.1
LPDDR4 Board Design and Layout Guidelines
9.2.2
OSPI and QSPI Board Design and Layout Guidelines
9.2.2.1
No Loopback and Internal Pad Loopback
9.2.2.2
External Board Loopback
9.2.2.3
DQS (only available in Octal Flash devices)
9.2.3
USB VBUS Design Guidelines
9.2.4
System Power Supply Monitor Design Guidelines using VMON/POK
9.2.5
High Speed Differential Signal Routing Guidance
9.2.6
Thermal Solution Guidance
10
Device and Documentation Support
10.1
Device Nomenclature
10.1.1
Standard Package Symbolization
10.1.2
Device Naming Convention
10.2
ツールとソフトウェア
10.3
Documentation Support
10.4
Trademarks
10.5
サポート・リソース
10.6
静電気放電に関する注意事項
10.7
用語集
11
Mechanical, Packaging, and Orderable Information
11.1
Packaging Information
パッケージ・オプション
デバイスごとのパッケージ図は、PDF版データシートをご参照ください。
メカニカル・データ(パッケージ|ピン)
ALZ|770
サーマルパッド・メカニカル・データ
発注情報
jajsq12a_oa
10.7
用語集
テキサス・インスツルメンツ用語集
この用語集には、用語や略語の一覧および定義が記載されています。