JAJSEW3C may   2017  – january 2022 AWR1443

PRODUCTION DATA  

  1.   1
  2. 1 特長
  3. 2 アプリケーション
  4. 3 説明
  5. 4 機能ブロック図
  6. 5 Revision History
  7. 6 Device Comparison
    1. 6.1 Related Products
  8. 7 Terminal Configuration and Functions
    1. 7.1 Pin Diagram
    2. 7.2 Signal Descriptions
      1. 7.2.1 Signal Descriptions
    3. 7.3 Pin Multiplexing
  9. 8 Specifications
    1. 8.1 Absolute Maximum Ratings
    2. 8.2 ESD Ratings
    3. 8.3 Power-On Hours (POH)
    4. 8.4 Recommended Operating Conditions
    5. 8.5 Power Supply Specifications
    6. 8.6 Power Consumption Summary
    7. 8.7 RF Specification
    8. 8.8 Thermal Resistance Characteristics for FCBGA Package [ABL0161]
    9. 8.9 Timing and Switching Characteristics
      1. 8.9.1  Power Supply Sequencing and Reset Timing
      2. 8.9.2  Synchronized Frame Triggering
      3. 8.9.3  Input Clocks and Oscillators
        1. 8.9.3.1 Clock Specifications
      4. 8.9.4  Multibuffered / Standard Serial Peripheral Interface (MibSPI)
        1. 8.9.4.1 Peripheral Description
        2. 8.9.4.2 MibSPI Transmit and Receive RAM Organization
          1. 8.9.4.2.1 SPI Timing Conditions
          2. 8.9.4.2.2 SPI Controller Mode Switching Parameters (CLOCK PHASE = 0, SPICLK = output, SPISIMO = output, and SPISOMI = input) #GUID-C70CFB1F-161A-495B-85B8-62E1C643D037/T4362547-236 #GUID-C70CFB1F-161A-495B-85B8-62E1C643D037/T4362547-237 #GUID-C70CFB1F-161A-495B-85B8-62E1C643D037/T4362547-238
          3. 8.9.4.2.3 SPI Controller Mode Switching Parameters (CLOCK PHASE = 1, SPICLK = output, SPISIMO = output, and SPISOMI = input) #GUID-F724BCC6-8F26-42C4-8723-451EDE9A36D3/T4362547-244 #GUID-F724BCC6-8F26-42C4-8723-451EDE9A36D3/T4362547-245 #GUID-F724BCC6-8F26-42C4-8723-451EDE9A36D3/T4362547-246
        3. 8.9.4.3 SPI Peripheral Mode I/O Timings
          1. 8.9.4.3.1 SPI Peripheral Mode Switching Parameters (SPICLK = input, SPISIMO = input, and SPISOMI = output) #GUID-1B5DE4C6-14B2-48EF-965D-3B03E1AE325B/T4362547-70 #GUID-1B5DE4C6-14B2-48EF-965D-3B03E1AE325B/T4362547-71 #GUID-1B5DE4C6-14B2-48EF-965D-3B03E1AE325B/T4362547-73
        4. 8.9.4.4 Typical Interface Protocol Diagram (Peripheral Mode)
      5. 8.9.5  LVDS Interface Configuration
        1. 8.9.5.1 LVDS Interface Timings
      6. 8.9.6  General-Purpose Input/Output
        1. 8.9.6.1 Switching Characteristics for Output Timing versus Load Capacitance (CL)
      7. 8.9.7  Controller Area Network Interface (DCAN)
        1. 8.9.7.1 Dynamic Characteristics for the DCANx TX and RX Pins
      8. 8.9.8  Serial Communication Interface (SCI)
        1. 8.9.8.1 SCI Timing Requirements
      9. 8.9.9  Inter-Integrated Circuit Interface (I2C)
        1. 8.9.9.1 I2C Timing Requirements #GUID-36963FBF-DA1A-4FF8-B71D-4A185830E708/T4362547-185
      10. 8.9.10 Quad Serial Peripheral Interface (QSPI)
        1. 8.9.10.1 QSPI Timing Conditions
        2. 8.9.10.2 Timing Requirements for QSPI Input (Read) Timings #GUID-6DC69BBB-F187-4499-AC42-8C006552DEE1/T4362547-210 #GUID-6DC69BBB-F187-4499-AC42-8C006552DEE1/T4362547-209
        3. 8.9.10.3 QSPI Switching Characteristics
      11. 8.9.11 JTAG Interface
        1. 8.9.11.1 JTAG Timing Conditions
        2. 8.9.11.2 Timing Requirements for IEEE 1149.1 JTAG
        3. 8.9.11.3 Switching Characteristics Over Recommended Operating Conditions for IEEE 1149.1 JTAG
  10. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 External Interfaces
    4. 9.4 Subsystems
      1. 9.4.1 RF and Analog Subsystem
        1. 9.4.1.1 Clock Subsystem
        2. 9.4.1.2 Transmit Subsystem
        3. 9.4.1.3 Receive Subsystem
        4. 9.4.1.4 Radio Processor Subsystem
      2. 9.4.2 Main (Control) System
      3. 9.4.3 Host Interface
    5. 9.5 Accelerators and Coprocessors
    6. 9.6 Other Subsystems
      1. 9.6.1 ADC Channels (Service) for User Application
        1. 9.6.1.1 GP-ADC Parameter
    7. 9.7 Boot Modes
      1. 9.7.1 Flashing Mode
      2. 9.7.2 Functional Mode
  11. 10Applications, Implementation, and Layout
    1. 10.1 Application Information
    2. 10.2 Short-Range Radar
    3. 10.3 Blind Spot Detector and Ultrasonic Upgrades
    4. 10.4 Reference Schematic
  12. 11Device and Documentation Support
    1. 11.1 Device Nomenclature
    2. 11.2 Tools and Software
    3. 11.3 Documentation Support
    4. 11.4 サポート・リソース
    5. 11.5 Trademarks
    6. 11.6 静電気放電に関する注意事項
    7. 11.7 用語集
  13. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Packaging Information

パッケージ・オプション

デバイスごとのパッケージ図は、PDF版データシートをご参照ください。

メカニカル・データ（パッケージ｜ピン）
  • ABL|161
サーマルパッド・メカニカル・データ
発注情報

8.9.9 Inter-Integrated Circuit Interface (I2C)

The inter-integrated circuit (I2C) module is a multicontroller communication module providing an interface between devices compliant with Philips Semiconductor I2C-bus specification version 2.1 and connected by an I2C-bus™. This module will support any target or controller I2C compatible device.

The I2C has the following features:

  • Compliance to the Philips I2C bus specification, v2.1 (The I2C Specification, Philips document number 9398 393 40011)
    • Bit/Byte format transfer
    • 7-bit and 10-bit device addressing modes
    • General call
    • START byte
    • Multi-controller transmitter/ target receiver mode
    • Multi-controller receiver/ target transmitter mode
    • Combined controller transmit/receive and receive/transmit mode
    • Transfer rates of 100 kbps up to 400 kbps (Phillips fast-mode rate)
  • Free data format
  • Two DMA events (transmit and receive)
  • DMA event enable/disable capability
  • Module enable/disable capability
  • The SDA and SCL are optionally configurable as general purpose I/O
  • Slew rate control of the outputs
  • Open drain control of the outputs
  • Programmable pullup/pulldown capability on the inputs
  • Supports Ignore NACK mode
Note:

This I2C module does not support:

  • High-speed (HS) mode
  • C-bus compatibility mode
  • The combined format in 10-bit address mode (the I2C sends the target address second byte every time it sends the target address first byte)