SWRS318 November   2024 AWR2944P

ADVANCE INFORMATION  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
    1. 3.1 Functional Block Diagram
  5. 4 Device Comparison
  6. 5 Related Products
  7. 6 Pin Configurations and Functions
    1. 6.1 Pin Diagram - AWR2944P
    2. 6.2 Pin Diagram - AWR2E44P
    3. 6.3 Pin Attributes
    4. 6.4 Signal Descriptions - Digital
    5. 6.5 Signal Descriptions - Analog
  8. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Power-On Hours (POH)
    4. 7.4  Recommended Operating Conditions
    5. 7.5  VPP Specifications for One-Time Programmable (OTP) eFuses
      1. 7.5.1 Recommended Operating Conditions for OTP eFuse Programming
      2. 7.5.2 Hardware Requirements
      3. 7.5.3 Impact to Your Hardware Warranty
    6. 7.6  Power Supply Specifications
    7. 7.7  Power Consumption Summary
    8. 7.8  RF Specifications
    9. 7.9  Thermal Resistance Characteristics
    10. 7.10 Power Supply Sequencing and Reset Timing
    11. 7.11 Input Clocks and Oscillators
      1. 7.11.1 Clock Specifications
    12. 7.12 Peripheral Information
      1. 7.12.1  QSPI Flash Memory Peripheral
        1. 7.12.1.1 QSPI Timing Conditions
        2. 7.12.1.2 QSPI Timing Requirements #GUID-4217F622-1EF7-45F6-B855-64CF2ED24728/GUID-97D19708-D87E-443B-9ADF-1760CFEF6F4C #GUID-4217F622-1EF7-45F6-B855-64CF2ED24728/GUID-0A61EEC9-2B95-4C27-B219-18D27C8F9430
        3. 7.12.1.3 QSPI Switching Characteristics #GUID-35EA1079-DDD6-4DC7-839D-D2FFA528448C/T4362547-64 #GUID-35EA1079-DDD6-4DC7-839D-D2FFA528448C/T4362547-65
      2. 7.12.2  Multibuffered / Standard Serial Peripheral Interface (MibSPI)
        1. 7.12.2.1 MibSPI Peripheral Description
        2. 7.12.2.2 MibSPI Transmit and Receive RAM Organization
          1. 7.12.2.2.1 SPI Timing Conditions
          2. 7.12.2.2.2 SPI Controller Mode Switching Parameters (CLOCK PHASE = 0, SPICLK = output, SPISIMO = output, and SPISOMI = input) #GUID-BF7326FD-4582-4010-B4F1-73F1B0C09FC2/T4362547-236 #GUID-BF7326FD-4582-4010-B4F1-73F1B0C09FC2/T4362547-237 #GUID-BF7326FD-4582-4010-B4F1-73F1B0C09FC2/T4362547-238
          3. 7.12.2.2.3 SPI Controller Mode Switching Parameters (CLOCK PHASE = 1, SPICLK = output, SPISIMO = output, and SPISOMI = input) #GUID-E6A0140B-9416-425D-8E79-C66C78DF3527/T4362547-244 #GUID-E6A0140B-9416-425D-8E79-C66C78DF3527/T4362547-245 #GUID-E6A0140B-9416-425D-8E79-C66C78DF3527/T4362547-246
        3. 7.12.2.3 SPI Peripheral Mode I/O Timings
          1. 7.12.2.3.1 SPI Peripheral Mode Switching Parameters (SPICLK = input, SPISIMO = input, and SPISOMI = output) #GUID-E2D86041-CEF3-4EEB-A74A-C17A9547F543/T4362547-70 #GUID-E2D86041-CEF3-4EEB-A74A-C17A9547F543/T4362547-71 #GUID-E2D86041-CEF3-4EEB-A74A-C17A9547F543/T4362547-73
      3. 7.12.3  Ethernet Switch (RGMII/RMII/MII) Peripheral
        1. 7.12.3.1 RGMII Timing Conditions
          1. 7.12.3.1.1  RGMII Transmit Clock Switching Characteristics
          2. 7.12.3.1.2  RGMII Transmit Data and Control Switching Characteristics
          3. 7.12.3.1.3  RGMII Receive Clock Timing Requirements
          4. 7.12.3.1.4  RGMII Receive Data and Control Timing Requirements
          5. 7.12.3.1.5  RMII Transmit Clock Switching Characteristics
          6. 7.12.3.1.6  RMII Transmit Data and Control Switching Characteristics
          7. 7.12.3.1.7  RMII Receive Clock Timing Requirements
          8. 7.12.3.1.8  RMII Receive Data and Control Timing Requirements
          9. 7.12.3.1.9  MII Transmit Switching Characteristics
          10. 7.12.3.1.10 MII Receive Timing Requirements
          11. 7.12.3.1.11 MII Transmit Clock Timing Requirements
          12. 7.12.3.1.12 MDIO Interface Timings
      4. 7.12.4  LVDS/Aurora Instrumentation and Measurement Peripheral
        1. 7.12.4.1 LVDS Interface Configuration
        2. 7.12.4.2 LVDS Interface Timings
      5. 7.12.5  UART Peripheral
        1. 7.12.5.1 SCI Timing Requirements
      6. 7.12.6  Inter-Integrated Circuit Interface (I2C)
        1. 7.12.6.1 I2C Timing Requirements #GUID-70BFADF8-F963-4E61-84ED-23FDE518F1A0/T4362547-185
      7. 7.12.7  Controller Area Network - Flexible Data-rate (CAN-FD)
        1. 7.12.7.1 Dynamic Characteristics for the CAN-FD TX and RX Pins
      8. 7.12.8  CSI2 Receiver Peripheral
        1. 7.12.8.1 CSI2 Switching Characteristics
      9. 7.12.9  Enhanced Pulse-Width Modulator (ePWM)
      10. 7.12.10 General-Purpose Input/Output
        1. 7.12.10.1 Switching Characteristics for Output Timing versus Load Capacitance (CL) #GUID-D645D302-151E-4A83-B5A0-36D93909E00A/T4362547-45 #GUID-D645D302-151E-4A83-B5A0-36D93909E00A/T4362547-50
    13. 7.13 Emulation and Debug
      1. 7.13.1 Emulation and Debug Description
      2. 7.13.2 JTAG Interface
        1. 7.13.2.1 Timing Requirements for IEEE 1149.1 JTAG
        2. 7.13.2.2 Switching Characteristics for IEEE 1149.1 JTAG
      3. 7.13.3 ETM Trace Interface
        1. 7.13.3.1 ETM TRACE Timing Requirements
        2. 7.13.3.2 ETM TRACE Switching Characteristics
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Subsytems
      1. 8.3.1 RF and Analog Subsystem
        1. 8.3.1.1 RF Clock Subsystem
        2. 8.3.1.2 Transmit Subsystem
        3. 8.3.1.3 Receive Subsystem
        4. 8.3.1.4 Processor Subsystem
      2. 8.3.2 Automotive Interfaces
    4. 8.4 Other Subsystems
      1. 8.4.1 Hardware Accelerator Subsystem
      2. 8.4.2 Security – Hardware Security Module
      3. 8.4.3 ADC Channels (Service) for User Application
  10. 9 Monitoring and Diagnostics
    1. 9.1 Monitoring and Diagnostic Mechanisms
  11. 10Applications, Implementation, and Layout
    1. 10.1 Application Information
    2. 10.2 Short, Medium, and Long Range Radar
    3. 10.3 Reference Schematic
  12. 11Device and Documentation Support
    1. 11.1 Device Support
    2. 11.2 Device Nomenclature
    3. 11.3 Tools and Software
    4. 11.4 Documentation support
    5. 11.5 Support Resources
    6. 11.6 Trademarks
    7. 11.7 Electrostatic Discharge Caution
    8. 11.8 Glossary
  13. 12Revision History

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)(2)
PARAMETERSMINMAXUNIT
VDD1.2V digital power supply–0.51.4V
VDD_SRAM1.2V power rail for internal SRAM–0.51.4V
VNWA1.2V power rail for SRAM array back bias–0.51.4V
VIOINI/O supply (3.3V or 1.8 V): All CMOS I/Os would operate on this supply.–0.53.8V
VIOIN_181.8V supply for CMOS IO–0.52V
VIOIN_18CLK1.8V supply for clock module–0.52V
VIN_18PM1.8V supply for the PM Module-0.52

V

VIOIN_18CSI1.8V supply for CSI2 port–0.52V
VIOIN_18LVDS1.8V supply for LVDS port–0.52

V

VDDA_10RF11V Analog and RF supply, VDDA_10RF1 and VDDA_10RF2 could be shorted on the board.–0.51.4V
VDDA_10RF2
VDDA_18BB1.8V Analog baseband power supply–0.52V
VDDA_18VCO supply1.8V RF VCO supply–0.52V
RX1-4Externally applied power on RF inputs10dBm
TX1-4Externally applied power on RF outputs(3)10dBm
TX1-4Temperature Sensor Accuracy(4)±5℃
Input and output voltage rangeDual-voltage LVCMOS inputs, 3.3V or 1.8V (Steady State)–0.3VVIOIN + 0.3V
Dual-voltage LVCMOS inputs, operated at 3.3 V/1.8 V
(Transient Overshoot/Undershoot) or external oscillator input		VIOIN + 20% up to
20% of signal period
CLKP, CLKMInput ports for reference crystal–0.52V
Clamp currentInput or Output Voltages 0.3V above or below their respective power rails. Limit clamp current that flows through the internal diode protection cells of the I/O.–2020mA
TJOperating junction temperature range–40140°C
TSTGStorage temperature range after soldered onto PC board–55150°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values are with respect to VSS, unless otherwise noted.
(3) This value is for an externally applied signal level on the TX. Additionally, a reflection coefficient up to Gamma= 1 can be applied on the TX output..
(4) Average of TX temp sensor readings at 140C can be tightened to +/-3C.