JAJSE21B October   2017  – November 2018

PRODUCTION DATA.  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 概要
    1.     代表的なアプリケーション回路
  4. 4 改訂履歴
  5. 5 概要（続き）
  6. 6 Device Comparison Table
  7. 7 Pin Configuration and Functions
    1.     Pin Functions
  8. 8 Specifications
    1. 8.1 Absolute Maximum Ratings
    2. 8.2 ESD Ratings
    3. 8.3 Recommended Operating Conditions
    4. 8.4 Thermal Information
    5. 8.5 Electrical Characteristics
    6. 8.6 Typical Characteristics
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Undervoltage Lockout (UVLO)
      2. 9.3.2 Power On
      3. 9.3.3 Overvoltage Protection (OVP)
      4. 9.3.4 Dynamic Power-path Management
        1. 9.3.4.1 Input Source Connected (Adapter or USB)
          1. 9.3.4.1.1 Input DPM Mode (VIN-DPM)
          2. 9.3.4.1.2 DPPM Mode
          3. 9.3.4.1.3 Battery Supplement Mode
        2. 9.3.4.2 Input Source Not Connected
      5. 9.3.5 Battery Charging
        1. 9.3.5.1 Charge Current Translator
        2. 9.3.5.2 Battery Detection And Recharge
        3. 9.3.5.3 Battery Disconnect (SYSOFF Input)
        4. 9.3.5.4 Dynamic Charge Timers (TMR Input)
        5. 9.3.5.5 Status Indicators (PGOOD, CHG)
        6. 9.3.5.6 Thermal Regulation And Thermal Shutdown
      6. 9.3.6 Battery Pack Temperature Monitoring
      7. 9.3.7 Half-Wave Adaptors
    4. 9.4 Device Functional Modes
      1. 9.4.1 Sleep Mode
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application – bq24079QW-Q1 Charger Design Example
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
        1. 10.2.2.1 Calculations
          1. 10.2.2.1.1 Program the Fast Charge Current (ISET):
          2. 10.2.2.1.2 Program the Input Current Limit (ILIM)
          3. 10.2.2.1.3 Program 6.25-hour Fast-Charge Safety Timer (TMR)
        2. 10.2.2.2 TS Function
        3. 10.2.2.3 CHG and PGOOD
        4. 10.2.2.4 System ON/OFF (SYSOFF)
        5. 10.2.2.5 Selecting In, Out And Bat Pin Capacitors
      3. 10.2.3 Application Curves
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
    3. 12.3 Thermal Package
  13. 13デバイスおよびドキュメントのサポート
    1. 13.1 デバイス・サポート
      1. 13.1.1 デベロッパー・ネットワークの製品に関する免責事項
    2. 13.2 ドキュメントのサポート
      1. 13.2.1 関連資料
    3. 13.3 ドキュメントの更新通知を受け取る方法
    4. 13.4 コミュニティ・リソース
    5. 13.5 商標
    6. 13.6 静電気放電に関する注意事項
    7. 13.7 Glossary
  14. 14メカニカル、パッケージ、および注文情報

パッケージ・オプション

デバイスごとのパッケージ図は、PDF版データシートをご参照ください。

メカニカル・データ（パッケージ｜ピン）
  • RGT|16
サーマルパッド・メカニカル・データ
発注情報

12.1 Layout Guidelines

  • To obtain optimal performance, the decoupling capacitor from IN to GND (thermal pad) and the output filter capacitors from OUT to GND (thermal pad) should be placed as close as possible to the bq24079QW-Q1, with short trace runs to both IN, OUT and GND (thermal pad).
  • All low-current GND connections should be kept separate from the high-current charge or discharge paths from the battery. Use a single-point ground technique incorporating both the small signal ground path and the power ground path.
  • The high current charge paths into IN pin and from the OUT pin must be sized appropriately for the maximum charge current in order to avoid voltage drops in these traces
  • The bq24079QW-Q1 is packaged in a thermally enhanced MLP package. The package includes a thermal pad to provide an effective thermal contact between the IC and the printed circuit board (PCB); this thermal pad is also the main ground connection for the device. Connect the thermal pad to the PCB ground connection. Full PCB design guidelines for this package are provided in the application note entitled: QFN/SON PCB Attachment Application Note (SLUA271).