SLUSAB0D October 2010 – April 2016
UNLESS OTHERWISE NOTED, this document contains PRODUCTION DATA.
The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
The bq24153A/6A/8/9 devices are available in a 20-bump chip scale package (YFF, NanoFree™).
The package dimensions are:
D | E |
---|---|
Max = 2.17mm | Max = 2.03 mm |
Min = 2.11 mm | Min = 1.97 mm |