SLUSAB0D October   2010  – April 2016

UNLESS OTHERWISE NOTED, this document contains PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Description (Continued)
  6. 6 Device Comparisons
  7. 7 Pin Configuration and Functions
  8. 8 Specifications
    1. 8.1 Absolute Maximum Ratings
    2. 8.2 ESD Ratings
    3. 8.3 Recommended Operating Conditions
    4. 8.4 Thermal Information
    5. 8.5 Electrical Characteristics
    6. 8.6 Timing Requirements
    7. 8.7 Typical Characteristics
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Input Voltage Protection
        1. 9.3.1.1 Input Overvoltage Protection
        2. 9.3.1.2 Bad Adaptor Detection/Rejection
        3. 9.3.1.3 Sleep Mode
        4. 9.3.1.4 Input Voltage Based DPM (Special Charger Voltage Threshold)
      2. 9.3.2 Battery Protection
        1. 9.3.2.1 Output Overvoltage Protection
        2. 9.3.2.2 Battery Short Protection
        3. 9.3.2.3 Battery Detection at Power Up in 15-minute Mode (bq24153A/6A only)
        4. 9.3.2.4 Battery Detection in Host Mode
      3. 9.3.3 15-Minute Safety Timer and 32-second Watchdog Timer in Charge Mode
      4. 9.3.4 USB Friendly Power Up
      5. 9.3.5 Input Current Limiting at Power Up
    4. 9.4 Device Functional Modes
      1. 9.4.1 Charge Mode Operation
        1. 9.4.1.1 Charge Profile
      2. 9.4.2 PWM Controller in Charge Mode
      3. 9.4.3 Battery Charging Process
      4. 9.4.4 Thermal Regulation and Protection
      5. 9.4.5 Charge Status Output, STAT Pin
      6. 9.4.6 Control Bits in Charge Mode
        1. 9.4.6.1 CE Bit (Charge Mode)
        2. 9.4.6.2 RESET Bit
        3. 9.4.6.3 OPA_Mode Bit
      7. 9.4.7 Control Pins in Charge Mode
        1. 9.4.7.1 CD Pin (Charge Disable)
        2. 9.4.7.2 SLRST Pin (Safety Limit Register 06H Reset, bq24156A/9 only)
      8. 9.4.8 BOOST Mode Operation (bq24153A/8 only)
        1. 9.4.8.1 PWM Controller in Boost Mode
        2. 9.4.8.2 Boost Start Up
        3. 9.4.8.3 PFM Mode at Light Load
        4. 9.4.8.4 Safety Timer in Boost Mode
        5. 9.4.8.5 Protection in Boost Mode
          1. 9.4.8.5.1 Output Overvoltage Protection
          2. 9.4.8.5.2 Output Overload Protection
          3. 9.4.8.5.3 Battery Overvoltage Protection
        6. 9.4.8.6 STAT Pin in Boost Mode
      9. 9.4.9 High Impedance (HI-Z) Mode
    5. 9.5 Programming
      1. 9.5.1 Serial Interface Description
        1. 9.5.1.1 F/S Mode Protocol
        2. 9.5.1.2 H/S Mode Protocol
        3. 9.5.1.3 I2C Update Sequence
        4. 9.5.1.4 Slave Address Byte
        5. 9.5.1.5 Register Address Byte
    6. 9.6 Register Maps
      1. 9.6.1 Status/Control Register [Memory Location: 00, Reset State: x1xx 0xxx]
      2. 9.6.2 Control Register [Memory Location: 01, Reset State: 0011 0000]
      3. 9.6.3 Control/Battery Voltage Register [Memory Location: 02, Reset State: 0000 1010]
      4. 9.6.4 Vender/Part/Revision Register [Memory Location: 03, Reset State: 0101 000x]
      5. 9.6.5 Battery Termination/Fast Charge Current Register [Memory Location: 04, Reset State: 0000 000]
      6. 9.6.6 Special Charger Voltage/Enable Pin Status Register [Memory location: 05, Reset state: 001X X100]
      7. 9.6.7 Safety Limit Register [Memory location: 06, Reset state: 01000000]
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
        1. 10.2.2.1 Systems Design Specifications
        2. 10.2.2.2 Charge Current Sensing Resistor Selection Guidelines
        3. 10.2.2.3 Output Inductor and Capacitance Selection Guidelines
      3. 10.2.3 Application Curves
    3. 10.3 System Example
  11. 11Power Supply Recommendations
    1. 11.1 System Load After Sensing Resistor
    2. 11.2 System Load Before Sensing Resistor
  12. 12Layout
    1. 12.1 Layout Guidelines
      1. 12.1.1 Current Path
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Third-Party Products Disclaimer
    2. 13.2 Related Links
    3. 13.3 Community Resources
    4. 13.4 Trademarks
    5. 13.5 Electrostatic Discharge Caution
    6. 13.6 Glossary
  14. 14Mechanical, Packaging, and Orderable Information
    1. 14.1 Package Summary
      1. 14.1.1 Chip Scale Packaging Dimensions

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

13 Device and Documentation Support

13.1 Third-Party Products Disclaimer

TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE.

13.2 Related Links

The table below lists quick access links. Categories include technical documents, support and community resources, tools and software, and quick access to sample or buy.

Table 14. Related Links

PARTS PRODUCT FOLDER SAMPLE & BUY TECHNICAL DOCUMENTS TOOLS & SOFTWARE SUPPORT & COMMUNITY
bq24153A Click here Click here Click here Click here Click here
bq24156A Click here Click here Click here Click here Click here
bq24158 Click here Click here Click here Click here Click here
bq24159 Click here Click here Click here Click here Click here

13.3 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

13.4 Trademarks

E2E, NanoFree are trademarks of Texas Instruments.

I2C is a trademark of NXP B.V. Corporation.

13.5 Electrostatic Discharge Caution

esds-image

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

13.6 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.