SLUSAW5B January 2012 – December 2014
PRODUCTION DATA.
PIN | NUMBER | TYPE | DESCRIPTION | |
---|---|---|---|---|
bq24190 | bq24192 bq24192I |
|||
VBUS | VBUS | 1,24 | P | Charger Input Voltage. The internal n-channel reverse block MOSFET (RBFET) is connected between VBUS and PMID with VBUS on source. Place a 1-µF ceramic capacitor from VBUS to PGND and place it as close as possible to IC. (Refer to Application Information Section for details) |
D+ | – | 2 | I Analog |
Positive line of the USB data line pair. D+/D– based USB host/charging port detection. The detection includes data contact detection (DCD) and primary detection in bc1.2. |
– | PSEL | 2 | I Digital |
Power source selection input. High indicates a USB host source and Low indicates an adapter source. |
D– | – | 3 | I Analog |
Negative line of the USB data line pair. D+/D– based USB host/charging port detection. The detection includes data contact detection (DCD) and primary detection in bc1.2. |
– | PG | 3 | O Digital |
Open drain active low power good indicator. Connect to the pull up rail via 10-kΩ resistor. LOW indicates a good input source if the input voltage is between UVLO and ACOV, above SLEEP mode threshold, and current limit is above 30 mA. |
STAT | STAT | 4 | O Digital |
Open drain charge status output to indicate various charger operation. Connect to the pull up rail via 10-kΩ. LOW indicates charge in progress. HIGH indicates charge complete or charge disabled. When any fault condition occurs, STAT pin in bq24190, bq24192 blinks at 1 Hz, and STAT pin in bq24192I has a 10-kΩ resistor to ground. |
SCL | SCL | 5 | I Digital |
I2C Interface clock. Connect SCL to the logic rail through a 10-kΩ resistor. |
SDA | SDA | 6 | I/O Digital |
I2C Interface data. Connect SDA to the logic rail through a 10-kΩ resistor. |
INT | INT | 7 | O Digital |
Open-drain Interrupt Output. Connect the INT to a logic rail via 10-kΩ resistor. The INT pin sends active low, 256-us pulse to host to report charger device status and fault. |
OTG | OTG | 8 | I Digital |
USB current limit selection pin during buck mode, and active high enable pin during boost mode. |
In buck mode with USB host (PSEL=High), when OTG = High, IIN limit = 500 mA and when OTG = Low, IIN limit = 100 mA. | ||||
The boost mode is activated when the REG01[5:4] = 10 and OTG pin is High. | ||||
CE | CE | 9 | I Digital |
Active low Charge Enable pin. Battery charging is enabled when REG01[5:4] = 01 and CE pin = Low. CE pin must be pulled high or low. |
ILIM | ILIM | 10 | I Analog |
ILIM pin sets the maximum input current limit by regulating the ILIM voltage at 1 V. A resistor is connected from ILIM pin to ground to set the maximum limit as IINMAX = (1V/RILIM) × 530. The actual input current limit is the lower one set by ILIM and by I2C REG00[2:0]. The minimum input current programmed on ILIM pin is 500 mA. |
TS1 | TS1 | 11 | I Analog |
Temperature qualification voltage input #1. Connect a negative temperature coefficient thermistor. Program temperature window with a resistor divider from REGN to TS1 to GND. Charge suspends when either TS pin is out of range. Recommend 103AT-2 thermistor. |
TS2 | TS2 | 12 | I Analog |
Temperature qualification voltage input #2. Connect a negative temperature coefficient thermistor. Program temperature window with a resistor divider from REGN to TS2 to GND. Charge suspends when either TS pin is out of range. Recommend 103AT-2 thermistor. |
BAT | BAT | 13,14 | P | Battery connection point to the positive terminal of the battery pack. The internal BATFET is connected between BAT and SYS. Connect a 10 µF closely to the BAT pin. |
SYS | SYS | 15,16 | P | System connection point. The internal BATFET is connected between BAT and SYS. When the battery falls below the minimum system voltage, switch-mode converter keeps SYS above the minimum system voltage. (Refer to Application Information Section for inductor and capacitor selection.) |
PGND | PGND | 17,18 | P | Power ground connection for high-current power converter node. Internally, PGND is connected to the source of the n-channel LSFET. On PCB layout, connect directly to ground connection of input and output capacitors of the charger. A single point connection is recommended between power PGND and the analog GND near the IC PGND pin. |
SW | SW | 19,20 | O Analog |
Switching node connecting to output inductor. Internally SW is connected to the source of the n-channel HSFET and the drain of the n-channel LSFET. Connect the 0.047-µF bootstrap capacitor from SW to BTST. |
BTST | BTST | 21 | P | PWM high side driver positive supply. Internally, the BTST is connected to the anode of the boost-strap diode. Connect the 0.047-µF bootstrap capacitor from SW to BTST. |
REGN | REGN | 22 | P | PWM low side driver positive supply output. Internally, REGN is connected to the cathode of the boost-strap diode. Connect a 4.7-µF (10-V rating) ceramic capacitor from REGN to analog GND. The capacitor should be placed close to the IC. REGN also serves as bias rail of TS1 and TS2 pins. |
PMID | PMID | 23 | O Analog |
Connected to the drain of the reverse blocking MOSFET and the drain of HSFET. Given the total input capacitance, connect a 1-µF capacitor on VBUS to PGND, and the rest all on PMID to PGND. (Refer to Application Information Section for details) |
Thermal Pad | – | – | P | Exposed pad beneath the IC for heat dissipation. Always solder thermal pad to the board, and have vias on the thermal pad plane star-connecting to PGND and ground plane for high-current power converter. |