SLUSBY7 July   2014

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Description (Continued)
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 Handling Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Dynamic Power Path Management
      2. 8.3.2 Production Test Mode
      3. 8.3.3 AnyBoot Battery Detection
    4. 8.4 Device Functional Modes
      1. 8.4.1  Charge Profile
      2. 8.4.2  EN1/EN2 Pins
      3. 8.4.3  I2C Operation (Host Mode / Default Mode)
      4. 8.4.4  External Settings: ISET, ILIM and VIN_DPM
      5. 8.4.5  Transient Response
      6. 8.4.6  Input Voltage Based DPM
      7. 8.4.7  Sleep Mode
      8. 8.4.8  Input Over-Voltage Protection
      9. 8.4.9  NTC Monitor
      10. 8.4.10 Safety Timer
      11. 8.4.11 Watchdog Timer
      12. 8.4.12 Thermal Regulation and Thermal Shutdown
      13. 8.4.13 Fault Modes
      14. 8.4.14 Serial Interface Description
        1. 8.4.14.1 F/S Mode Protocol
    5. 8.5 Register Maps
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Inductor Selection
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Board Layout
    3. 11.3 Package Summary
  12. 12Device and Documentation Support
    1. 12.1 Trademarks
    2. 12.2 Electrostatic Discharge Caution
    3. 12.3 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

12 Device and Documentation Support

12.1 Trademarks

NanoFree is a trademark of Texas Instruments.

12.2 Electrostatic Discharge Caution

esds-image

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

12.3 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.