SLUS811A November   2008  – June 2015

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4  Simplified Schematic
  5. 5 Revision History
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Input Overvoltage Protection
      2. 8.3.2 Input Overcurrent Protection
      3. 8.3.3 Battery Overvoltage Protection
      4. 8.3.4 Thermal Protection
      5. 8.3.5 Enable Function
      6. 8.3.6 Fault Indication
    4. 8.4 Device Functional Modes
      1. 8.4.1 OPERATION Mode
      2. 8.4.2 POWER-DOWN Mode
      3. 8.4.3 POWER-ON RESET Mode
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Powering Accessories
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Selection of RBAT
        2. 9.2.2.2 Selection of RCE, RFAULT, and RPU
        3. 9.2.2.3 Selection of Input and Output Bypass Capacitors
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Community Resources
    2. 12.2 Trademarks
    3. 12.3 Electrostatic Discharge Caution
    4. 12.4 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

11 Layout

11.1 Layout Guidelines

  • This device is a protection device, and is meant to protect down-stream circuitry from hazardous voltages. Potentially, high voltages may be applied to this device. It has to be ensured that the edge-to-edge clearances of PCB traces satisfy the design rules for high voltages. See Figure 24.
  • The device uses WSON packages with a thermal pad. For good thermal performance, the thermal pad must be thermally coupled with the PCB ground plane (GND). This requires a copper pad directly under the device. This copper pad must be connected to the ground plane with an array of thermal vias.
  • Ensure that external CIN and COUT are located close to the device. Other external components like RILIM and RBAT must also be located close to the device. See Figure 13 for additional information.

11.2 Layout Example

bq24314A layout_slus912.gifFigure 24. Layout Example