JAJSND8C September   2021  – January 2023 BQ25180

PRODUCTION DATA  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 概要
  4. 4 Revision History
  5. 5 概要 (続き)
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Thermal Information
    4. 7.4 Recommended Operating Conditions
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
      1. 8.1.1 Battery Charging Process
        1. 8.1.1.1 Trickle Charge
        2. 8.1.1.2 Precharge
        3. 8.1.1.3 Fast Charge
        4. 8.1.1.4 Termination
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Input Voltage Based Dynamic Power Management (VINDPM)
      2. 8.3.2  Dynamic Power Path Management Mode (DPPM)
      3. 8.3.3  Battery Supplement Mode
      4. 8.3.4  SYS Power Control (SYS_MODE bit control)
        1. 8.3.4.1 SYS Pulldown Control
      5. 8.3.5  SYS Regulation
      6. 8.3.6  ILIM Control
      7. 8.3.7  Protection Mechanisms
        1. 8.3.7.1 Input Overvoltage Protection
        2. 8.3.7.2 Battery Undervoltage Lockout
        3. 8.3.7.3 System Overvoltage Protection
        4. 8.3.7.4 System Short Protection
        5. 8.3.7.5 Battery Overcurrent Protection
        6. 8.3.7.6 Safety Timer and Watchdog Timer
        7. 8.3.7.7 Thermal Protection and Thermal Regulation
      8. 8.3.8  Pushbutton Wake and Reset Input
        1. 8.3.8.1 Pushbutton Wake or Short Button Press Functions
        2. 8.3.8.2 Pushbutton Reset or Long Button Press Functions
      9. 8.3.9  15-Second Timeout for HW Reset
      10. 8.3.10 Hardware Reset
      11. 8.3.11 Software Reset
      12. 8.3.12 Interrupt Indicator (/INT) Pin
      13. 8.3.13 External NTC Monitoring (TS)
        1. 8.3.13.1 TS Biasing and Function
      14. 8.3.14 I2C Interface
        1. 8.3.14.1 F/S Mode Protocol
    4. 8.4 Device Functional Modes
    5. 8.5 Register Maps
      1. 8.5.1 I2C Registers
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Input (IN/SYS) Capacitors
        2. 9.2.2.2 TS
        3. 9.2.2.3 Recommended Passive Components
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 サード・パーティ製品に関する免責事項
    2. 12.2 ドキュメントの更新通知を受け取る方法
    3. 12.3 サポート・リソース
    4. 12.4 Trademarks
    5. 12.5 静電気放電に関する注意事項
    6. 12.6 用語集
  13. 13Mechanical, Packaging, and Orderable Information

パッケージ・オプション

デバイスごとのパッケージ図は、PDF版データシートをご参照ください。

メカニカル・データ（パッケージ｜ピン）
  • YBG|8
サーマルパッド・メカニカル・データ
発注情報

11.1 Layout Guidelines

  • To obtain optimal performance, the decoupling capacitor from IN to GND, the capacitor from SYS to GND and BAT to GND should be placed as close as possible to the device, with short trace runs to IN, SYS, BAT and GND.Have solid ground plane that is tied to the GND bump

  • The pushbutton GND should be connected close to the device as possible.

  • The high current charge paths into IN, SYS and BAT pins must be sized appropriately for the maximum charge current in order to avoid voltage drops in these traces.