JAJSQM6B June 2023 – February 2024 BQ25622E
PRODUCTION DATA
THERMAL METRIC(1) | BQ25622E | UNIT | |
---|---|---|---|
RYK (QFN) | |||
18 pins | |||
RθJA | Junction-to-ambient thermal resistance | 60.1 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 42.1 | °C/W |
RθJB | Junction-to-board thermal resistance | 13.0 | °C/W |
ΨJT | Junction-to-top characterization parameter | 1.3 | °C/W |
ΨJB | Junction-to-board characterization parameter | 12.8 | °C/W |