11.1 Layout Guidelines
bq25872 supports up to 7-A charge current. It is very critical to maximize Cu trace of VBUS and VOUT. Following PCB layout guideline is recommended:
- Use Cu trace of at least 110 mil (2.794 mm) wide for VBUS and VOUT respectively. This allows current flow evenly through all 7 WCSP solder balls.
- Cu trace of VBUS and VOUT should run at least 150 mil (3.81 mm) straight (perpendicular to WCSP ball array) before making turns.
- Use as large as possible Cu pour for VBUS and VOUT trace elsewhere.
- Use as large as possible Cu pour for PGND.
- Place decoupling capacitors of VBUS and VOUT as close as possible to the device.