10.1 Layout Guidelines

• A capacitor of value of at least 2.2 µF is connected between the V_DD pin and V_SS. The capacitor must be placed close to the gauge IC and have short traces to both the V_DD pin and V_SS. This regulator must not be used to provide power for other devices in the system.
• It is required to have a capacitor of at least 1.0 µF connect between the BAT pin and V_SS if the connection between the battery pack and the gauge BAT pin has the potential to pick up noise. The capacitor should be placed close to the gauge IC and have short traces to both the BAT pin and V_SS.
• If the external pullup resistors on the SCL and SDA lines will be disconnected from the host during low-power operation, it is recommended to use external 1-MΩ pulldown resistors to V_SS to avoid floating inputs to the I²C engine.
• The value of the SCL and SDA pullup resistors should take into consideration the pullup voltage and the bus capacitance. Some recommended values, assuming a bus capacitance of 10 pF, can be seen in Table 1.

Table 1. Recommended Values for SCL and SDA Pullup Resistors

VPU	1.8 V		3.3 V
RPU	Range	Typical	Range	Typical
	400 Ω ≤ RPU ≤ 37.6 kΩ	10 kΩ	900 Ω ≤ RPU ≤ 29.2 kΩ	5.1 kΩ

• If the host is not using the GPOUT functionality, then it is recommended that GPOUT be connected to a GPIO of the host so that in the cases where the device is in SHUTDOWN, toggling GPOUT can wake the gauge from the SHUTDOWN state.
• If the battery pack thermistor is not connected to the BIN pin, the BIN pin should be pulled down to V_SS with a 10-kΩ resistor.
• The BIN pin should not be shorted directly to V_DD or V_SS.
• The actual device ground is pin B2 (V_SS).
• The SRP and SRN pins should be Kelvin connected to the R_SENSE terminals. SRP to the battery pack side of R_SENSE and SRN to the system side of the R_SENSE.
• Kelvin connect the BAT pin to the battery PACKP terminal.

10.2 Layout Example

Figure 14. EVM Board Layout