4 Revision History
Changes from B Revision (December 2014) to C Revision
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Changed Typical Application title to Simplified Schematic Go
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Changed resistor RVD location, added PACK+ and PACK- in the Simplified Schematic imageGo
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Deleted the Lead Temperature (soldering) from the Absolute Maximum Ratings table Go
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Deleted table notes 2 through 7 from the Thermal InformationGo
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Changed resistor RVD location in Figure 9 Go
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Added title to Table 1Go
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Changed resistor RVD location, added PACK+ and PACK- in Figure 11 Go
Changes from A Revision (September 2010) to B Revision
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Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information sectionGo
Changes from * Revision (June 2010) to A Revision
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Changed values in XDELAY and XDELAY_CTM electrical characteristicsGo
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Changed specifications for VOUTGo
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Changed test conditions for VOUT, IOH, and IOLGo
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Added VMM_DET_ON: VC2 = VDD = 7.6 VGo
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Changed VMM_DET_OFF: From VDD – VC2 – 7.6 V to VC2 = VDD = 7.6 VGo
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Changed content in Recommended Cell Balancing Configurations sectionGo
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Added ICD Charge Current figureGo
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Added ICD Discharge Current figureGo
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Changed XDELAY from nominally 8.0 s/µF to nominally 9.0 s/µFGo
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Changed Timing for Overvoltage Sensing figureGo
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Added Cell Imbalance Auto-Detection (Via Cell Voltage) sectionGo
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Changed VDD value in Customer Test Mode from 8.5 V to 9.5 VGo
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Changed the Voltage Test Limits figureGo
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Added External Cell Balancing sectionGo