SLUS928B March   2009  – July 2016

 

  1. 1Features
  2. 2Applications
  3. 3Description
    1.     Device Images
      1.      System Partitioning Diagram
  4. 4Revision History
  5. 5Pin Configuration and Functions
    1.     Pin Functions
  6. 6Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
  7. 7Detailed Description
    1. 7.1 Feature Description
      1. 7.1.1  Battery Parameter Measurements
        1. 7.1.1.1 Charge and Discharge Counting
        2. 7.1.1.2 Voltage
        3. 7.1.1.3 Voltage Calibration and Accuracy
        4. 7.1.1.4 Current
        5. 7.1.1.5 Auto Calibration
        6. 7.1.1.6 Temperature
      2. 7.1.2  Primary (1st Level) Safety Features
      3. 7.1.3  Secondary (2nd Level) Safety Features
      4. 7.1.4  Charge Control Features
      5. 7.1.5  Gas Gauging
      6. 7.1.6  Lifetime Data Logging Features
      7. 7.1.7  Authentication
      8. 7.1.8  Configuration
        1. 7.1.8.1 System Present Operation
        2. 7.1.8.2 2-, 3-, or 4-Cell Configuration
        3. 7.1.8.3 Cell Balance Control
      9. 7.1.9  Communications
        1. 7.1.9.1 SMBus On and Off State
      10. 7.1.10 SBS Commands
    2. 7.2 Device Functional Modes
      1. 7.2.1 Power Modes
  8. 8Device and Documentation Support
    1. 8.1 Documentation Support
      1. 8.1.1 Related Documentation
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Community Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  9. 9Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

6.4 Thermal Information

THERMAL METRIC(1) bq3060 UNIT
PW (TSSOP)
24 PINS
RθJA Junction-to-ambient thermal resistance 83.6 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 16.5 °C/W
RθJB Junction-to-board thermal resistance 39.4 °C/W
ψJT Junction-to-top characterization parameter 0.4 °C/W
ψJB Junction-to-board characterization parameter 38.8 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance – °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.