SLUS987C
January 2011 – December 2019
BQ33100
PRODUCTION DATA.
1
Features
2
Applications
3
Description
Device Images
Simplified Schematic
4
Revision History
5
Description (Continued)
6
Pin Configuration and Functions
Pin Functions
7
Specifications
7.1
Absolute Maximum Ratings
7.2
ESD Ratings
7.3
Recommended Operating Conditions
7.4
Thermal Information
7.5
Electrical Characteristics: General Purpose I/O
7.6
Supply Current
7.7
REG27 LDO
7.8
Coulomb Counter
7.9
ADC
7.10
External Capacitor Voltage Balance Drive
7.11
Capacitor Voltage Monitor
7.12
Internal Temperature Sensor
7.13
Thermistor Measurement Support
7.14
Internal Thermal Shutdown
7.15
High-Frequency Oscillator
7.16
Low-Frequency Oscillator
7.17
RAM Backup
7.18
Flash
7.19
Current Protection Thresholds
7.20
Current Protection Timing
7.21
Timing Requirements: SMBus
7.22
Typical Characteristics
8
Detailed Description
8.1
Overview
8.1.1
Super Capacitor Measurements
8.1.1.1
Voltage
8.1.1.2
Current, Charge, and Discharge Counting
8.1.1.3
Device Calibration
8.1.1.4
Temperature
8.1.1.5
Series Capacitor Configuration
8.2
Functional Block Diagram
8.3
Feature Description
8.3.1
Capacitance Monitoring and Learning
8.3.1.1
Monitoring and Control Operational Overview
8.3.1.2
Main Monitoring Registers
8.3.1.3
Initial Capacitance at Device Reset
8.3.1.4
Qualified Capacitance Learning
8.3.1.5
Health Determination
8.3.1.6
ESR Measurement
8.3.1.7
Monitor Operating Modes
8.3.2
Capacitor Voltage Balancing
8.3.3
Charge Control
8.3.3.1
Charge Termination
8.3.3.2
CHG Override Control
8.3.4
Lifetime Data Gathering
8.3.4.1
Lifetime Maximum Temperature
8.3.4.2
Lifetime Minimum Temperature
8.3.4.3
Lifetime Maximum Capacitor Voltage
8.3.5
Safety Detection Features
8.3.5.1
Capacitor Overvoltage (OV)
8.3.5.2
Capacitor Voltage Imbalance (CIM)
8.3.5.3
Weak Capacitor (CLBAD)
8.3.5.4
Overtemperature (OT)
8.3.5.5
Overcurrent During Charging (OC Chg)
8.3.5.6
Overcurrent During Discharging (OC Dsg)
8.3.5.7
Short-Circuit During Charging (SC Chg)
8.3.5.8
Short-Circuit During Discharging (SC Dsg)
8.3.5.9
AFE Watchdog (WDF)
8.3.5.10
Integrated AFE Communication Fault (AFE_C)
8.3.5.11
Data Flash Fault (DFF)
8.3.5.12
FAULT Indication (FAULT Pin)
8.3.6
Communications
8.3.6.1
SMBus On and Off State
8.3.7
Security (Enables and Disables Features)
8.3.8
Measurement System Calibration
8.3.8.1
Coulomb Counter Deadband
8.3.8.2
Auto Calibration
8.3.8.3
Current Gain
8.3.8.4
CC Delta
8.3.8.5
Cap1 K-factor
8.3.8.6
Cap2 K-factor
8.3.8.7
Cap3 K-factor
8.3.8.8
Cap4 K-factor
8.3.8.9
Cap5 K-factor
8.3.8.10
K-factor Override Flag
8.3.8.11
System Voltage K-factor
8.3.8.12
Stack Voltage K-factor
8.3.8.13
K-factor Stack Override Flag
8.3.8.14
CC Offset
8.3.8.15
Board Offset
8.3.8.16
Int Temp Offset
8.3.8.17
Ext1 Temp Offset
8.3.8.18
CC Current
8.3.8.19
Voltage Signal
8.3.8.20
Temp Signal
8.3.8.21
CC Offset Time
8.3.8.22
ADC Offset Time
8.3.8.23
Current Gain Time
8.3.8.24
Voltage Time
8.3.8.25
Temperature Time
8.3.8.26
Cal Mode Timeout
8.3.8.27
Ext Coef a1..a5, b1..b4, Ext rc0, Ext adc0
8.3.8.28
Rpad
8.3.8.29
Rint
8.3.8.30
Int Coef 1..4, Int Min AD, Int Max Temp
8.3.8.31
Filter
8.3.8.32
Deadband
8.3.8.33
CC Deadband
8.4
Device Functional Modes
8.4.1
Operating Power Modes
8.5
Programming
8.5.1
Communications
8.5.1.1
BQ33100 Slave Address
8.5.1.2
SMBus On and Off State
8.5.1.3
Packet Error Checking
8.5.2
SBS Commands
8.5.2.1
SBS Command Summary
8.5.2.2
SBS Command Details
8.5.2.2.1
ManufacturerAccess (0x00)
8.5.2.2.1.1
Device Type (0x0001)
8.5.2.2.1.2
Firmware Version (0x0002)
8.5.2.2.1.3
Hardware Version (0x0003)
8.5.2.2.1.4
DF Checksum (0x0004)
8.5.2.2.1.5
Seal Device (0x0020)
8.5.2.2.1.6
Lifetime and Capacitor Balancing Enable (0x0021)
8.5.2.2.1.7
FAULT Activation (0x0030)
8.5.2.2.1.8
FAULT Clear (0x0031)
8.5.2.2.1.9
CHGLVL0 Activation (0x0032)
8.5.2.2.1.10
CHGLVL0 Clear (0x0033)
8.5.2.2.1.11
CHGLVL1 Activation (0x0033)
8.5.2.2.1.12
CHGLVL1 Clear (0x0034)
8.5.2.2.1.13
Learn Load Activation (0x0037)
8.5.2.2.1.14
Learn Load Clear (0x0038)
8.5.2.2.1.15
Calibration Mode (0x0040)
8.5.2.2.1.16
Reset (0x0041)
8.5.2.2.1.17
Unseal Device (UnsealKey)
8.5.2.2.1.18
Extended SBS Commands
8.5.2.2.2
Temperature (0x08)
8.5.2.2.3
Voltage (0x09)
8.5.2.2.4
Current (0x0A)
8.5.2.2.5
ESR (0x0B)
8.5.2.2.6
RelativeStateofCharge (0x0D)
8.5.2.2.7
Health (0x0E)
8.5.2.2.8
Capacitance (0x10)
8.5.2.2.9
ChargingCurrent (0x14)
8.5.2.2.10
ChargingVoltage (0x15)
8.5.2.2.11
CapacitorVoltage5..1 (0x3B..0x3F)
8.5.2.2.12
Extended SBS Commands
8.5.2.2.12.1
FETControl(0x46)
8.5.2.2.12.2
SafetyAlert (0x50)
8.5.2.2.12.3
SafetyStatus (0x51)
8.5.2.2.12.4
OperationStatus (0x54)
8.5.2.2.12.5
SystemVoltage (0x5a)
8.5.2.2.12.6
UnSealKey(0x60)
8.5.2.2.12.7
ManufacturerInfo(0x70)
8.5.3
Data Flash
8.5.3.1
Accessing Data Flash
8.5.3.2
Data Flash Interface
8.5.3.3
Data Flash Summary
8.5.3.4
Specific Data Flash Programming Details
8.5.3.4.1
OC Dsg
8.5.3.4.2
OC Dsg Time
8.5.3.4.3
SC Dsg Cfg
8.5.3.4.4
SC Chg Cfg
8.5.3.4.5
Initial 1st Capacitance
8.5.3.4.6
Capacitance
8.5.3.4.7
Firmware Version
8.5.3.4.8
Hardware Version
8.5.3.4.9
Manuf. Info
8.5.3.4.10
Operation Cfg
8.5.3.4.11
FET ACTION
8.5.3.4.12
FAULT
8.5.3.4.13
AFE State_CTL
8.5.3.4.14
Measurement Margin %
8.5.3.4.15
Max Dsg Time
8.5.3.4.16
V Chg Nominal
8.5.3.4.17
V Chg A
8.5.3.4.18
V Chg B
8.5.3.4.19
V Chg Max
8.5.3.4.20
Min Voltage
8.5.3.4.21
Learning Frequency
8.5.3.4.22
Dsg Current Threshold
8.5.3.4.23
Chg Current Threshold
9
Application and Implementation
9.1
Application Information
9.2
Typical Application
9.2.1
Design Requirements
9.2.2
Detailed Design Procedure
9.2.2.1
Selecting Number of Series Capacitor Support
9.2.2.2
Selecting Charging Voltage Values
9.2.2.3
Learning Frequency Selection
9.2.3
Application Curve
10
Power Supply Recommendations
11
Layout
11.1
Layout Guidelines
11.2
Layout Example
12
Device and Documentation Support
12.1
Documentation Support
12.1.1
Related Documentation
12.2
Support Resources
12.3
Trademarks
12.4
Electrostatic Discharge Caution
12.5
Glossary
13
Mechanical, Packaging, and Orderable Information
パッケージ・オプション
メカニカル・データ(パッケージ|ピン)
PW|24
MPDS363A
サーマルパッド・メカニカル・データ
発注情報
slus987c_oa
slus987c_pm
7.2
ESD Ratings
VALUE
UNIT
V
(ESD)
Electrostatic discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001
(1)
±2000
V
Charged-device model (CDM), per JEDEC specification JESD22-C101
(2)
±500
(1)
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2)
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.