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  • BQ34Z100 ワイド・レンジ残量計、Impedance Track™ テクノロジー採用

    • JAJSLN6C May   2012  – May 2021 BQ34Z100

      PRODUCTION DATA  

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  • BQ34Z100 ワイド・レンジ残量計、Impedance Track™ テクノロジー採用
  1. 1 特長
  2. 2 アプリケーション
  3. 3 概要
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics: Power-On Reset
    6. 6.6  Electrical Characteristics: LDO Regulator
    7. 6.7  Electrical Characteristics: Internal Temperature Sensor Characteristics
    8. 6.8  Electrical Characteristics: Low-Frequency Oscillator
    9. 6.9  Electrical Characteristics: High-Frequency Oscillator
    10. 6.10 Electrical Characteristics: Integrating ADC (Coulomb Counter) Characteristics
    11. 6.11 Electrical Characteristics: ADC (Temperature and Cell Measurement) Characteristics
    12. 6.12 Electrical Characteristics: Data Flash Memory Characteristics
    13. 6.13 Timing Requirements: HDQ Communication
    14. 6.14 Timing Requirements: I2C-Compatible Interface
    15. 6.15 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Feature Description
      1. 7.2.1  Data Commands
        1. 7.2.1.1 Standard Data Commands
        2. 7.2.1.2 Control(): 0x00/0x01
          1. 7.2.1.2.1  CONTROL_STATUS: 0x0000
          2. 7.2.1.2.2  DEVICE TYPE: 0x0001
          3. 7.2.1.2.3  FW_VERSION: 0x0002
          4. 7.2.1.2.4  HW_VERSION: 0x0003
          5. 7.2.1.2.5  RESET_DATA: 0x0005
          6. 7.2.1.2.6  PREV_MACWRITE: 0x0007
          7. 7.2.1.2.7  CHEM ID: 0x0008
          8. 7.2.1.2.8  BOARD_OFFSET: 0x0009
          9. 7.2.1.2.9  CC_OFFSET: 0x000A
          10. 7.2.1.2.10 CC_OFFSET_SAVE: 0x000B
          11. 7.2.1.2.11 DF_VERSION: 0x000C
          12. 7.2.1.2.12 SET_FULLSLEEP: 0x0010
          13. 7.2.1.2.13 STATIC_CHEM_DF_CHKSUM: 0x0017
          14. 7.2.1.2.14 SEALED: 0x0020
          15. 7.2.1.2.15 IT ENABLE: 0x0021
          16. 7.2.1.2.16 RESET: 0x0041
          17. 7.2.1.2.17 EXIT_CAL: 0x0080
          18. 7.2.1.2.18 ENTER_CAL: 0x0081
          19. 7.2.1.2.19 OFFSET_CAL: 0x0082
        3. 7.2.1.3 StateOfCharge(): 0x02/0x03
        4. 7.2.1.4 RemainingCapacity(): 0x04/0x05
        5. 7.2.1.5 FullChargeCapacity(): 0x06/07
        6. 7.2.1.6 Voltage(): 0x08/0x09
        7. 7.2.1.7 AverageCurrent(): 0x0A/0x0B
        8. 7.2.1.8 Temperature(): 0x0C/0x0D
        9. 7.2.1.9 Flags(): 0x0E/0x0F
      2. 7.2.2  Extended Data Commands
        1. 7.2.2.1  AtRate(): 0X10/0x11
        2. 7.2.2.2  AtRateTimeToEmpty(): 0x12/0x13
        3. 7.2.2.3  Current(): 0x10/0x11
        4. 7.2.2.4  NominalAvailableCapacity(): 0x14/0x15
        5. 7.2.2.5  FullAvailableCapacity(): 0x16/0x17
        6. 7.2.2.6  TimeToEmpty(): 0x18/0x19
        7. 7.2.2.7  TimeToFull(): 0x1A/0x1B
        8. 7.2.2.8  StandbyCurrent(): 0x1C/0x1D
        9. 7.2.2.9  StandbyTimeToEmpty(): 0x1E/0x1F
        10. 7.2.2.10 MaxLoadCurrent(): 0x20/0x21
        11. 7.2.2.11 MaxLoadTimeToEmpty(): 0x22/0x23
        12. 7.2.2.12 AvailableEnergy(): 0x24/0x25
        13. 7.2.2.13 AveragePower(): 0x26/0x27
        14. 7.2.2.14 TimeToEmptyAtConstantPower(): 0x28/0x29
        15. 7.2.2.15 InternalTemp(): 0x2A/0x2B
        16. 7.2.2.16 CycleCount(): 0x2C/0x2D
        17. 7.2.2.17 StateOfHealth(): 0x2E/0x2F
        18. 7.2.2.18 ChargeVoltage(): 0x30/0x31
        19. 7.2.2.19 ChargeCurrent(): 0x32/0x33
        20. 7.2.2.20 PassedCharge(): 0x34/0x35
        21. 7.2.2.21 DOD0(): 0x36/0x37
        22. 7.2.2.22 SelfDischargeCurrent(): 0x38/0x39
        23. 7.2.2.23 PackConfiguration(): 0x3A/0x3B
        24. 7.2.2.24 DesignCapacity(): 0x3C/0x3D
        25. 7.2.2.25 DataFlashClass(): 0x3E
        26. 7.2.2.26 DataFlashBlock(): 0x3F
        27. 7.2.2.27 AuthenticateData/BlockData(): 0x40…0x53
        28. 7.2.2.28 AuthenticateChecksum/BlockData(): 0x54
        29. 7.2.2.29 BlockData(): 0x55…0x5F
        30. 7.2.2.30 BlockDataChecksum(): 0x60
        31. 7.2.2.31 BlockDataControl(): 0x61
        32. 7.2.2.32 DeviceNameLength(): 0x62
        33. 7.2.2.33 DeviceName(): 0x63…0x6A
      3. 7.2.3  Data Flash Interface
        1. 7.2.3.1 Accessing Data Flash
        2. 7.2.3.2 Manufacturer Information Block
        3. 7.2.3.3 Access Modes
        4. 7.2.3.4 Sealing/Unsealing Data Flash Access
      4. 7.2.4  Data Flash Summary
      5. 7.2.5  Fuel Gauging
      6. 7.2.6  Impedance Track Variables
        1. 7.2.6.1  Load Mode
        2. 7.2.6.2  Load Select
        3. 7.2.6.3  Reserve Cap-mAh
        4. 7.2.6.4  Reserve Cap-mWh/cWh
        5. 7.2.6.5  Design Energy Scale
        6. 7.2.6.6  Dsg Current Threshold
        7. 7.2.6.7  Chg Current Threshold
        8. 7.2.6.8  Quit Current, Dsg Relax Time, Chg Relax Time, and Quit Relax Time
        9. 7.2.6.9  Qmax
        10. 7.2.6.10 Update Status
        11. 7.2.6.11 Avg I Last Run
        12. 7.2.6.12 Avg P Last Run
        13. 7.2.6.13 Delta Voltage
        14. 7.2.6.14 Ra Tables
        15. 7.2.6.15 Pack Configuration Register
          1. 7.2.6.15.1 Pack Configuration B Register
          2. 7.2.6.15.2 Pack Configuration C Register
      7. 7.2.7  Voltage Division and Calibration
        1. 7.2.7.1 1S Example
        2. 7.2.7.2 7S Example
        3. 7.2.7.3 Autocalibration
      8. 7.2.8  Temperature Measurement
      9. 7.2.9  Overtemperature Indication
        1. 7.2.9.1 Overtemperature: Charge
        2. 7.2.9.2 Overtemperature: Discharge
      10. 7.2.10 Charging and Charge Termination Indication
      11. 7.2.11 X10 Mode
      12. 7.2.12 Remaining State of Charge LED Indication
      13. 7.2.13 Alert Signal
      14. 7.2.14 Communications
        1. 7.2.14.1 Authentication
        2. 7.2.14.2 Key Programming
        3. 7.2.14.3 Executing an Authentication Query
        4. 7.2.14.4 HDQ Single-Pin Serial Interface
        5. 7.2.14.5 I2C Interface
      15. 7.2.15 Power Control
        1. 7.2.15.1 Reset Functions
        2. 7.2.15.2 Wake-Up Comparator
        3. 7.2.15.3 Flash Updates
    3. 7.3 Device Functional Modes
      1. 7.3.1 NORMAL Mode
      2. 7.3.2 SLEEP Mode
      3. 7.3.3 FULL SLEEP Mode
  8. 8 Application and Implementation
    1. 8.1 Typical Applications
      1. 8.1.1 Design Requirements
      2. 8.1.2 Detailed Design Procedure
        1. 8.1.2.1 Step-by-Step Design Procedure
          1. 8.1.2.1.1 STEP 1: Review and Modify the Data Flash Configuration Data.
          2. 8.1.2.1.2 STEP 2: Review and Modify the Data Flash Configuration Registers.
          3. 8.1.2.1.3 STEP 3: Design and Configure the Voltage Divider.
          4. 8.1.2.1.4 STEP 4: Determine the Sense Resistor Value.
          5. 8.1.2.1.5 STEP 5: Review and Modify the Data Flash Gas Gauging Configuration, Data, and State.
          6. 8.1.2.1.6 STEP 6: Determine and Program the Chemical ID.
          7. 8.1.2.1.7 STEP 7: Calibrate.
          8. 8.1.2.1.8 STEP 8: Run an Optimization Cycle.
      3. 8.1.3 Battery Chemistry Configuration
        1. 8.1.3.1 Battery Chemistry Charge Termination
      4. 8.1.4 Replaceable Battery Systems
      5. 8.1.5 Digital Interface Options
      6. 8.1.6 Display Options
      7. 8.1.7 Application Curves
      8. 8.1.8 Special Applications
        1. 8.1.8.1 Operation Configuration B Register
        2. 8.1.8.2 Operation Configuration C Register
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Introduction
      2. 10.1.2 Power Supply Decoupling Capacitor
      3. 10.1.3 Capacitors
      4. 10.1.4 Communication Line Protection Components
    2. 10.2 Layout Example
      1. 10.2.1 Ground System
      2. 10.2.2 Kelvin Connections
      3. 10.2.3 Board Offset Considerations
      4. 10.2.4 ESD Spark Gap
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 サポート・リソース
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information
  13. 重要なお知らせ

パッケージ・オプション

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  • PW|14
    • MPDS360A
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DATA SHEET

BQ34Z100 ワイド・レンジ残量計、Impedance Track™ テクノロジー採用

このリソースの元の言語は英語です。 翻訳は概要を便宜的に提供するもので、自動化ツール (機械翻訳) を使用していることがあり、TI では翻訳の正確性および妥当性につきましては一切保証いたしません。 実際の設計などの前には、ti.com で必ず最新の英語版をご参照くださいますようお願いいたします。

1 特長

  • リチウムイオンおよび LiFePO4 ケミストリをサポート
  • 特許取得済みの Impedance Track™ テクノロジーを使った容量推定 (3V～65V のバッテリに対応)
    • 経時変化補償
    • 自己放電補償
  • 65Ah を上回るバッテリ容量をサポート

  • 32A を上回る    充放電電流をサポート
  • 外部 NTC サーミスタをサポート
  • ホスト・システムとの 2 線式 I2C および HDQ 1 線式通信インターフェイスをサポート
  • SHA-1/HMAC 認証機能
  • 1 または 4 LED 直接表示制御
  • ポート・エクスパンダによる 5 LED 以上の表示
  • 低消費電力モード (一般的なバッテリ・パックの動作範囲の条件)
    • 通常動作：< 140µA (平均値)
    • スリープ：< 64µA (平均値)
    • フル・スリープ：< 19µA (平均値)
  • パッケージ：14 ピン TSSOP

2 アプリケーション

  • 軽量の電気自動車
  • 医療用計測機器
  • 移動無線
  • 電動工具
  • 無停電電源 (UPS)

3 概要

テキサス・インスツルメンツの BQ34Z100 は、バッテリの直列セル構成と無関係に動作するバッテリ残量計ソリューションであり、多様なリチウムイオンおよび LiFePO4 バッテリ・ケミストリをサポートしています。システムの消費電力を低減するように自動的に制御される外部電圧変換回路を使って、3V～65V のバッテリをサポートできます。

BQ34Z100 デバイスは、I2C スレーブ、HDQ スレーブ、1 つまたは 4 つの直接 LED、ALERT 出力ピンを含む複数のインターフェイスの選択肢を備えています。また、BQ34Z100 は、5 つ以上の LED のための外部ポート・エクスパンダもサポートしています。

製品情報
部品番号(1) パッケージ 本体サイズ (公称)
BQ34Z100 TSSOP (14) 5.00mm × 4.40mm
(1) 利用可能なパッケージについては、このデータシートの末尾にある注文情報を参照してください。
GUID-3E663AF7-2E1C-440B-9B2E-6F1E1D843E0A-low.gif概略回路図

4 Revision History

Changes from Revision B (December 2012) to Revision C (May 2021)

  • 更新されたテキサス・インスツルメンツの標準に従ってドキュメントのフォーマットを変更し、ドキュメント全体を通して SRP および SRN ピンを更新Go
  • Changed #GUID-0D73CD1E-2219-4F5C-8127-6232F004FFB1/TITLE-SLUSAU1SLUSAU17896 Go
  • Changed #GUID-8E487D7E-15D6-4979-BE69-494F64581372/TITLE-SLUSAU1SLUSAU13468 Go

Changes from Revision A (September 2012) to Revision B (December 2012)

  • Changed #GUID-6CAC0BC8-350B-4D23-A25F-887C19C5D19B/TITLE-SLUSAU1SLUSAU15488 Go
  • Changed Section 6.3 Go
  • Changed Section 7.2.15.3 Go
  • Changed Section 7.3.2 Go
  • Changed Section 7.3.3 Go
  • Changed STEP 3Go

5 Pin Configuration and Functions

Table 5-1 Pin Functions
PIN I/O DESCRIPTION
NAME NUMBER
P2 1 O LED 2 or Not Used (connect to Vss)
VEN 2 O Active High Voltage Translation Enable. This signal is optionally used to switch the input voltage divider on/off to reduce the power consumption (typ 45 µA) of the divider network. If not used, then this pin can be left floating or tied to Vss.
P1 3 O LED 1 or Not Used (connect to Vss). This pin is also used to drive an LED for single-LED mode. Use a small signal N-FET (Q1) in series with the LED as shown on Figure 8-4.
BAT 4 I Translated Battery Voltage Input
CE 5 I Chip Enable. Internal LDO is disconnected from REGIN when driven low.
REGIN 6 P Internal integrated LDO input. Decouple with a 0.1-µF ceramic capacitor to Vss.
REG25 7 P 2.5-V Output voltage of the internal integrated LDO. Decouple with 1-µF ceramic capacitor to Vss.
VSS 8 P Device ground
SRP 9 I Analog input pin connected to the internal coulomb-counter peripheral for integrating a small voltage between SRP and SRN where SRP is nearest the BAT– connection.
SRN 10 I Analog input pin connected to the internal coulomb-counter peripheral for integrating a small voltage between SRP and SRN where SRN is nearest the PACK– connection.
P6/TS 11 I Pack thermistor voltage sense (use 103AT-type thermistor)
P5/HDQ 12 I/O Open drain HDQ Serial communication line (slave). If not used, then this pin can be left floating or tied to Vss.
P4/SCL 13 I Slave I2C serial communication clock input. Use with a 10-KΩ pull-up resistor (typical). This pin is also used for LED 4 in the four-LED mode. If not used, then this pin can be left floating or tied to Vss.
P3/SDA 14 I/O Open drain slave I2C serial communication data line. Use with a 10-kΩ pull-up resistor (typical). This pin is also used for LED 3 in the four-LED mode. If not used, then this pin can be left floating or tied to Vss.

 
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