SLUSB96A November   2012  – December 2015

 

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 Recommended Operating Conditions
    3. 6.3 Thermal Information
    4. 6.4 Electrical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
      1. 7.1.1 Fundamentals
      2. 7.1.2 Wireless Power Consortium (WPC)
      3. 7.1.3 Power Transfer
      4. 7.1.4 Communication
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Capacitor Selection
      2. 7.3.2  A6 Coil Specification
      3. 7.3.3  Option Select Pins
      4. 7.3.4  LED Modes
      5. 7.3.5  Parasitic Metal Object Detect (PMOD) and Foreign Object Detection (FOD)
      6. 7.3.6  Shut Down by Thermal Sensor or Trigger
      7. 7.3.7  Fault Handling and Indication
      8. 7.3.8  Power Transfer Start Signal
      9. 7.3.9  Power-On Reset
      10. 7.3.10 External Reset, RESET Pin
      11. 7.3.11 Trickle Charge and CS100
      12. 7.3.12 Current Monitoring Requirements
      13. 7.3.13 Overcurrent Protection
      14. 7.3.14 MSP430G2101 Low Power Supervisor
      15. 7.3.15 All Unused Pins
  8. 8 Application and Implementation
    1. 8.1 Typical Application
      1. 8.1.1 Detailed Design Procedure
        1. 8.1.1.1 Input Regulator
        2. 8.1.1.2 Power Trains
        3. 8.1.1.3 Signal Processing Components
        4. 8.1.1.4 Low-Power Supervisor
        5. 8.1.1.5 Disabling Low-Power Supervisor Mode
        6. 8.1.1.6 Input Power Requirements
    2. 8.2 System Examples
  9. 9 Layout
    1. 9.1 Layout Guidelines
  10. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Community Resources
    3. 10.3 Trademarks
    4. 10.4 Electrostatic Discharge Caution
    5. 10.5 Glossary
  11. 11Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

4 Revision History

Changes from * Revision (November 2012) to A Revision

  • Added Feature Description section, Application and Implementation section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information sectionGo