JAJSSA8 November   2023 BQ76905

PRODUCTION DATA  

  1.   1
  2. 特長
  3. アプリケーション
  4. 概要
  5. Device Comparison Table
  6. Pin Configuration and Functions
  7. Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Supply Current
    6. 6.6  Digital I/O
    7. 6.7  REGOUT LDO
    8. 6.8  Voltage References
    9. 6.9  Coulomb Counter
    10. 6.10 Coulomb Counter Digital Filter
    11. 6.11 Current Wake Detector
    12. 6.12 Analog-to-Digital Converter
    13. 6.13 Cell Balancing
    14. 6.14 Internal Temperature Sensor
    15. 6.15 Thermistor Measurement
    16. 6.16 Hardware Overtemperature Detector
    17. 6.17 Internal Oscillator
    18. 6.18 Charge and Discharge FET Drivers
    19. 6.19 Comparator-Based Protection Subsystem
    20. 6.20 Timing Requirements—I2C Interface, 100-kHz Mode
    21. 6.21 Timing Requirements—I2C Interface, 400-kHz Mode
    22. 6.22 Timing Diagram
    23. 6.23 Typical Characteristics
  8. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Device Configuration
      1. 7.3.1 Commands and Subcommands
      2. 7.3.2 Configuration Using OTP or Registers
      3. 7.3.3 Device Security
    4. 7.4 Device Hardware Features
      1. 7.4.1  Voltage ADC
      2. 7.4.2  Coulomb Counter and Digital Filters
      3. 7.4.3  Protection FET Drivers
      4. 7.4.4  Voltage References
      5. 7.4.5  Multiplexer
      6. 7.4.6  LDOs
      7. 7.4.7  Standalone Versus Host Interface
      8. 7.4.8  ALERT Pin Operation
      9. 7.4.9  Low Frequency Oscillator
      10. 7.4.10 I2C Serial Communications Interface
    5. 7.5 Measurement Subsystem
      1. 7.5.1 Voltage Measurement
        1. 7.5.1.1 Voltage ADC Scheduling
        2. 7.5.1.2 Unused VC Pins
        3. 7.5.1.3 General Purpose ADCIN Functionality
      2. 7.5.2 Current Measurement and Charge Integration
      3. 7.5.3 Internal Temperature Measurement
      4. 7.5.4 Thermistor Temperature Measurement
      5. 7.5.5 Factory Trim and Calibration
    6. 7.6 Protection Subsystem
      1. 7.6.1 Protections Overview
      2. 7.6.2 Primary Protections
      3. 7.6.3 CHG Detector
      4. 7.6.4 Cell Open-Wire Protection
      5. 7.6.5 Diagnostic Checks
    7. 7.7 Cell Balancing
    8. 7.8 Device Operational Modes
      1. 7.8.1 Overview of Operational Modes
      2. 7.8.2 NORMAL Mode
      3. 7.8.3 SLEEP Mode
      4. 7.8.4 DEEPSLEEP Mode
      5. 7.8.5 SHUTDOWN Mode
      6. 7.8.6 CONFIG_UPDATE Mode
  9. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Performance Plot
      4. 8.2.4 Random Cell Connection Support
      5. 8.2.5 Startup Timing
      6. 8.2.6 FET Driver Turn-Off
      7. 8.2.7 Usage of Unused Pins
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 ドキュメントの更新通知を受け取る方法
    3. 9.3 サポート・リソース
    4. 9.4 Trademarks
    5. 9.5 静電気放電に関する注意事項
    6. 9.6 用語集
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ(パッケージ|ピン)
サーマルパッド・メカニカル・データ
発注情報

Protection FET Drivers

The BQ76905 integrates low-side CHG and DSG FET drivers, which can directly drive low-side protection NFET transistors. The device supports both series and parallel FET configurations, providing FET body diode protection when configured for a series FET configuration, if one FET driver is on, and the other FET driver is off. When body diode protection is enabled, the DSG driver may be turned on to prevent FET damage if the battery pack is charging while a discharge inhibit fault condition is present. Similarly, the CHG driver may be turned on if the pack is discharging while a charge inhibit fault condition is present. These decisions depend on the detection of a current with an absolute value in excess of the programmable body diode threshold, which uses the coulomb counter current measurement for its decision.

The DSG pin is driven high when not blocked by command and when no related faults (such as UV, OTD, UTD, OCD1, OCD2, SCD, and select diagnostics) that are configured for autonomous control are present, or for body diode protection. The driver can be forced on by command, but the command only takes effect if configuration settings allow.

The DSG driver is designed to allow users to select an optimal resistance in series between the DSG pin and the DSG FET gate to achieve the desired FET rise and fall time per the application requirement and the choice of FET characteristics. When the DSG FET is turned off, the DSG pin drives low, and all overcurrent in discharge protections (OCD1, OCD2, SCD) are disabled to better conserve power. These resume operation when the DSG FET is turned on. Device configuration settings determine which protection autonomously controls the appropriate FET driver.

The CHG pin is driven high only when not blocked by command and when no related faults (OV, OTC, UTC, OCC, SCD, and select diagnostics) which are configured for autonomous control are present, or for body diode protection. The driver can be forced on by command, but the command only takes effect if configuration settings allow. Turning off the CHG pin has no influence on the overcurrent protection circuitry. The CHG FET driver actively drives the CHG pin high when enabled, and actively drives the pin low to approximately 0.5 V above the VSS voltage for about 100 μs when disabled, then allows the pin to settle to the PACK– voltage through the external CHG FET gate-source resistor. If a charger is attached to the pack while the CHG FET is disabled, the CHG pin can fall to a voltage as low as 25 V below the device VSS, per the device electrical specifications. Due to the 100 μs time interval during which CHG is actively pulled low, the time constant of the CHG drive circuit (made up of the driver effective resistance, any series resistance between the CHG pin and the CHG FET gate, and the FET gate capacitance) should be kept well below this level.

The BQ76905 includes PWM drive capability on the CHG and DSG FET drivers, which allows them to limit the average current flowing in a charge or discharge mode. The DSG FET driver actively drives the DSG pin high or low, based on the driver control, so can implement continual switching to turn on and off the DSG FET. If a charger is not attached, then the CHG driver can also implement continual switching in PWM mode. If a charger is attached with voltage significantly above the pack voltage, then the CHG FET gate voltage is generally driven to approximately VSS + 0.5 V quickly, then settles to the lower PACK– voltage more slowly, depending on the system capacitance. See the BQ76905 Technical Reference Manual for more information.