JAJSMA5C June   2021  – March 2022 BUF802

PRODUCTION DATA  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 説明
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics: Wide Bandwidth Mode
    6. 6.6 Electrical Characteristics: Low Quiescent Current Mode
    7. 6.7 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Input and Output Over-Voltage Clamp
      2. 8.3.2 Adjustable Quiescent Current
      3. 8.3.3 ESD Structure
    4. 8.4 Device Functional Modes
      1. 8.4.1 Buffer Mode (BF Mode)
      2. 8.4.2 Composite Loop Mode (CL Mode)
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Oscilloscope Front-End Amplifier Design
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curves
      2. 9.2.2 Transforming a Wide-Bandwidth, 50 Ω Input Signal Chain to High-Input Impedance
        1. 9.2.2.1 Detailed Design Results
        2. 9.2.2.2 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 サポート・リソース
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

6.4 Thermal Information

THERMAL METRIC(1) BUF802 UNIT
RGT (VQFN) 
16 PINS
RθJA Junction-to-ambient thermal resistance 53 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 61 °C/W
RθJB Junction-to-board thermal resistance 27 °C/W
ΨJT Junction-to-top characterization parameter 2.7 °C/W
ΨJB Junction-to-board characterization parameter 27 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 13 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.