SLVSI70 December   2024 BZX84C15V-Q1 , BZX84C27V-Q1 , BZX84C8V2-Q1

PRODUCTION DATA  

  1.   1
  2. 1Features
  3. 2Applications
  4. 3Description
  5. 4Pin Configuration and Functions
  6. 5Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 Recommended Operating Conditions
    3. 5.3 Thermal Information
    4. 5.4 Electrical Characteristics
    5. 5.5 Typical Characteristics
  7. 6Device and Documentation Support
    1. 6.1 Documentation Support
      1. 6.1.1 Related Documentation
    2. 6.2 Receiving Notification of Documentation Updates
    3. 6.3 Support Resources
    4. 6.4 Trademarks
    5. 6.5 Electrostatic Discharge Caution
    6. 6.6 Glossary
  8. 7Revision History
  9. 8Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

5.3 Thermal Information

THERMAL METRIC (1) BZX84Cx-Q1 UNIT
DBZ (SOT-23)
3 PINS
RθJA Junction-to-ambient thermal resistance 285.5 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 197.5 °C/W
RθJB Junction-to-board thermal resistance 118.5 °C/W
ΨJT Junction-to-top characterization parameter 90.6 °C/W
ΨJB Junction-to-board characterization parameter 117.8 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.