SWRS046I November   2006  – September 2018 CC1020

PRODUCTION DATA.  

  1. 1Device Overview
    1. 1.1 Features
    2. 1.2 Applications
    3. 1.3 Description
    4. 1.4 Functional Block Diagram
  2. 2Revision History
  3. 3Terminal Configuration and Functions
    1. 3.1 Pin Diagram
    2. 3.2 Pin Configuration
  4. 4Specifications
    1. 4.1  Absolute Maximum Ratings
    2. 4.2  ESD Ratings
    3. 4.3  Recommended Operating Conditions
    4. 4.4  RF Transmit
    5. 4.5  RF Receive
    6. 4.6  RSSI / Carrier Sense
    7. 4.7  Intermediate Frequency (IF)
    8. 4.8  Crystal Oscillator
    9. 4.9  Frequency Synthesizer
    10. 4.10 Digital Inputs and Outputs
    11. 4.11 Current Consumption
    12. 4.12 Thermal Resistance Characteristics for VQFNP Package
  5. 5Detailed Description
    1. 5.1  Overview
    2. 5.2  Functional Block Diagram
    3. 5.3  Configuration Overview
      1. 5.3.1 Configuration Software
    4. 5.4  Microcontroller Interface
      1. 5.4.1 Configuration Interface
      2. 5.4.2 Signal Interface
      3. 5.4.3 PLL Lock Signal
    5. 5.5  4-wire Serial Configuration Interface
    6. 5.6  Signal Interface
      1. 5.6.1 Synchronous NRZ Mode
      2. 5.6.2 Transparent Asynchronous UART Mode
      3. 5.6.3 Synchronous Manchester Encoded Mode
        1. 5.6.3.1 Manchester Encoding and Decoding
    7. 5.7  Data Rate Programming
    8. 5.8  Frequency Programming
      1. 5.8.1 Dithering
    9. 5.9  Receiver
      1. 5.9.1  IF Frequency
      2. 5.9.2  Receiver Channel Filter Bandwidth
      3. 5.9.3  Demodulator, Bit Synchronizer, and Data Decision
      4. 5.9.4  Receiver Sensitivity Versus Data Rate and Frequency Separation
      5. 5.9.5  RSSI
      6. 5.9.6  Image Rejection Calibration
      7. 5.9.7  Blocking and Selectivity
      8. 5.9.8  Linear IF Chain and AGC Settings
      9. 5.9.9  AGC Settling
      10. 5.9.10 Preamble Length and Sync Word
      11. 5.9.11 Carrier Sense
      12. 5.9.12 Automatic Power-up Sequencing
      13. 5.9.13 Automatic Frequency Control
      14. 5.9.14 Digital FM
    10. 5.10 Transmitter
      1. 5.10.1 FSK Modulation Formats
      2. 5.10.2 Output Power Programming
      3. 5.10.3 TX Data Latency
      4. 5.10.4 Reducing Spurious Emission and Modulation Bandwidth
    11. 5.11 Input and Output Matching and Filtering
    12. 5.12 Frequency Synthesizer
      1. 5.12.1 VCO, Charge Pump and PLL Loop Filter
      2. 5.12.2 VCO and PLL Self-Calibration
      3. 5.12.3 PLL Turn-on Time Versus Loop Filter Bandwidth
      4. 5.12.4 PLL Lock Time Versus Loop Filter Bandwidth
    13. 5.13 VCO and LNA Current Control
    14. 5.14 Power Management
    15. 5.15 On-Off Keying (OOK)
    16. 5.16 Crystal Oscillator
    17. 5.17 Built-in Test Pattern Generator
    18. 5.18 Interrupt on Pin DCLK
      1. 5.18.1 Interrupt Upon PLL Lock
      2. 5.18.2 Interrupt Upon Received Signal Carrier Sense
    19. 5.19 PA_EN and LNA_EN Digital Output Pins
      1. 5.19.1 Interfacing an External LNA or PA
      2. 5.19.2 General Purpose Output Control Pins
      3. 5.19.3 PA_EN and LNA_EN Pin Drive
    20. 5.20 System Considerations and Guidelines
      1. 5.20.1 SRD Regulations
      2. 5.20.2 Narrowband Systems
      3. 5.20.3 Low Cost Systems
      4. 5.20.4 Battery Operated Systems
      5. 5.20.5 High Reliability Systems
      6. 5.20.6 Frequency Hopping Spread Spectrum Systems (FHSS)
    21. 5.21 Antenna Considerations
    22. 5.22 Configuration Registers
      1. 5.22.1 Memory
  6. 6Applications, Implementation, and Layout
    1. 6.1 Application Information
      1. 6.1.1 Typical Application
    2. 6.2 Design Requirements
      1. 6.2.1 Input and Output Matching
      2. 6.2.2 Bias Resistor
      3. 6.2.3 PLL Loop Filter
      4. 6.2.4 Crystal
      5. 6.2.5 Additional Filtering
      6. 6.2.6 Power Supply Decoupling and Filtering
    3. 6.3 PCB Layout Recommendations
  7. 7Device and Documentation Support
    1. 7.1 Device Support
      1. 7.1.1 Device Nomenclature
    2. 7.2 Documentation Support
      1. 7.2.1 Community Resources
    3. 7.3 Trademarks
    4. 7.4 Electrostatic Discharge Caution
    5. 7.5 Export Control Notice
    6. 7.6 Glossary
  8. 8Mechanical Packaging and Orderable Information
    1. 8.1 Packaging Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ

6.3 PCB Layout Recommendations

The top layer should be used for signal routing, and the open areas should be filled with metallization connected to ground using several vias.

The area under the chip is used for grounding and must be connected to the bottom ground plane with several vias. In the TI reference designs we have placed 9 vias inside the exposed die attached pad. These vias should be “tented” (covered with solder mask) on the component side of the PCB to avoid migration of solder through the vias during the solder reflow process.

Do not place a via underneath the CC1020 device at “pin #1 corner” as this pin is internally connected to the exposed die attached pad, which is the main ground connection for the chip.

Each decoupling capacitor should be placed as close as possible to the supply pin it is supposed to decouple. Each decoupling capacitor should be connected to the power line (or power plane) by separate vias. The best routing is from the power line (or power plane) to the decoupling capacitor and then to the CC1020 device supply pin. Supply power filtering is very important, especially for pins 23, 22, 20 and 18.

Each decoupling capacitor ground pad should be connected to the ground plane using a separate via. Direct connections between neighboring power pins will increase noise coupling and should be avoided unless absolutely necessary.

The external components should ideally be as small as possible and surface mount devices are highly recommended.

Precaution should be used when placing the microcontroller in order to avoid noise interfering with the RF circuitry.

A CC1020/1070DK reference design is available here: http://www.ti.com/tool/CC1020EMX_REFDES. It is strongly advised that this reference layout is followed very closely in order to get the best performance.