SWRS046I November   2006  – September 2018 CC1020

PRODUCTION DATA.  

  1. 1Device Overview
    1. 1.1 Features
    2. 1.2 Applications
    3. 1.3 Description
    4. 1.4 Functional Block Diagram
  2. 2Revision History
  3. 3Terminal Configuration and Functions
    1. 3.1 Pin Diagram
    2. 3.2 Pin Configuration
  4. 4Specifications
    1. 4.1  Absolute Maximum Ratings
    2. 4.2  ESD Ratings
    3. 4.3  Recommended Operating Conditions
    4. 4.4  RF Transmit
    5. 4.5  RF Receive
    6. 4.6  RSSI / Carrier Sense
    7. 4.7  Intermediate Frequency (IF)
    8. 4.8  Crystal Oscillator
    9. 4.9  Frequency Synthesizer
    10. 4.10 Digital Inputs and Outputs
    11. 4.11 Current Consumption
    12. 4.12 Thermal Resistance Characteristics for VQFNP Package
  5. 5Detailed Description
    1. 5.1  Overview
    2. 5.2  Functional Block Diagram
    3. 5.3  Configuration Overview
      1. 5.3.1 Configuration Software
    4. 5.4  Microcontroller Interface
      1. 5.4.1 Configuration Interface
      2. 5.4.2 Signal Interface
      3. 5.4.3 PLL Lock Signal
    5. 5.5  4-wire Serial Configuration Interface
    6. 5.6  Signal Interface
      1. 5.6.1 Synchronous NRZ Mode
      2. 5.6.2 Transparent Asynchronous UART Mode
      3. 5.6.3 Synchronous Manchester Encoded Mode
        1. 5.6.3.1 Manchester Encoding and Decoding
    7. 5.7  Data Rate Programming
    8. 5.8  Frequency Programming
      1. 5.8.1 Dithering
    9. 5.9  Receiver
      1. 5.9.1  IF Frequency
      2. 5.9.2  Receiver Channel Filter Bandwidth
      3. 5.9.3  Demodulator, Bit Synchronizer, and Data Decision
      4. 5.9.4  Receiver Sensitivity Versus Data Rate and Frequency Separation
      5. 5.9.5  RSSI
      6. 5.9.6  Image Rejection Calibration
      7. 5.9.7  Blocking and Selectivity
      8. 5.9.8  Linear IF Chain and AGC Settings
      9. 5.9.9  AGC Settling
      10. 5.9.10 Preamble Length and Sync Word
      11. 5.9.11 Carrier Sense
      12. 5.9.12 Automatic Power-up Sequencing
      13. 5.9.13 Automatic Frequency Control
      14. 5.9.14 Digital FM
    10. 5.10 Transmitter
      1. 5.10.1 FSK Modulation Formats
      2. 5.10.2 Output Power Programming
      3. 5.10.3 TX Data Latency
      4. 5.10.4 Reducing Spurious Emission and Modulation Bandwidth
    11. 5.11 Input and Output Matching and Filtering
    12. 5.12 Frequency Synthesizer
      1. 5.12.1 VCO, Charge Pump and PLL Loop Filter
      2. 5.12.2 VCO and PLL Self-Calibration
      3. 5.12.3 PLL Turn-on Time Versus Loop Filter Bandwidth
      4. 5.12.4 PLL Lock Time Versus Loop Filter Bandwidth
    13. 5.13 VCO and LNA Current Control
    14. 5.14 Power Management
    15. 5.15 On-Off Keying (OOK)
    16. 5.16 Crystal Oscillator
    17. 5.17 Built-in Test Pattern Generator
    18. 5.18 Interrupt on Pin DCLK
      1. 5.18.1 Interrupt Upon PLL Lock
      2. 5.18.2 Interrupt Upon Received Signal Carrier Sense
    19. 5.19 PA_EN and LNA_EN Digital Output Pins
      1. 5.19.1 Interfacing an External LNA or PA
      2. 5.19.2 General Purpose Output Control Pins
      3. 5.19.3 PA_EN and LNA_EN Pin Drive
    20. 5.20 System Considerations and Guidelines
      1. 5.20.1 SRD Regulations
      2. 5.20.2 Narrowband Systems
      3. 5.20.3 Low Cost Systems
      4. 5.20.4 Battery Operated Systems
      5. 5.20.5 High Reliability Systems
      6. 5.20.6 Frequency Hopping Spread Spectrum Systems (FHSS)
    21. 5.21 Antenna Considerations
    22. 5.22 Configuration Registers
      1. 5.22.1 Memory
  6. 6Applications, Implementation, and Layout
    1. 6.1 Application Information
      1. 6.1.1 Typical Application
    2. 6.2 Design Requirements
      1. 6.2.1 Input and Output Matching
      2. 6.2.2 Bias Resistor
      3. 6.2.3 PLL Loop Filter
      4. 6.2.4 Crystal
      5. 6.2.5 Additional Filtering
      6. 6.2.6 Power Supply Decoupling and Filtering
    3. 6.3 PCB Layout Recommendations
  7. 7Device and Documentation Support
    1. 7.1 Device Support
      1. 7.1.1 Device Nomenclature
    2. 7.2 Documentation Support
      1. 7.2.1 Community Resources
    3. 7.3 Trademarks
    4. 7.4 Electrostatic Discharge Caution
    5. 7.5 Export Control Notice
    6. 7.6 Glossary
  8. 8Mechanical Packaging and Orderable Information
    1. 8.1 Packaging Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ

4.6 RSSI / Carrier Sense

All measurements were performed using the two-layer PCB CC1020EMX reference design. See Figure 6-1. The electrical specifications given for 868 MHz are also applicable for 902 to 928 MHz. TA = 25°C, AVDD = DVDD = 3.0 V,
fC = 14.7456 MHz if nothing else stated.
PARAMETER TYP UNIT CONDITION
RSSI dynamic range 55 dB 12.5 and 25 kHz channel spacing
RSSI accuracy ±3 dB See Section 5.9.5 for details.
RSSI linearity ±1 dB
RSSI attach time 2.4 kBaud, 12.5 kHz channel spacing 3.8 ms Shorter RSSI attach times can be traded for lower RSSI accuracy. See Section 5.9.5 for details.
Shorter RSSI attach times can also be traded for reduced sensitivity and selectivity by increasing the receiver channel filter bandwidth.
4.8 kBaud, 25 kHz channel spacing 1.9 ms
153.6 kBaud, 500 kHz channel spacing 140 µs
Carrier sense programmable range 40 dB Accuracy is as for RSSI
Adjacent channel carrier sense 12.5 kHz channel spacing –72 dBm At carrier sense level –110 dBm, FM jammer (1 kHz sine, ±2.5 kHz deviation) at adjacent channel.
Adjacent channel carrier sense is measured by applying a signal on the adjacent channel and observe at which level carrier sense is indicated.
25 kHz channel spacing –72 dBm
Spurious carrier sense –70 dBm At carrier sense level –110 dBm, 100 MHz to 2 GHz. Adjacent channel and image channel are excluded.