JAJSFV9D September   2015  – July 2018 CC1310

PRODUCTION DATA.  

  1. 1デバイスの概要
    1. 1.1 特長
    2. 1.2 アプリケーション
    3. 1.3 概要
    4. 1.4 機能ブロック図
  2. 2改訂履歴
  3. 3Device Comparison
    1. 3.1 Related Products
  4. 4Terminal Configuration and Functions
    1. 4.1 Pin Diagram – RSM Package
    2. 4.2 Signal Descriptions – RSM Package
    3. 4.3 Pin Diagram – RHB Package
    4. 4.4 Signal Descriptions – RHB Package
    5. 4.5 Pin Diagram – RGZ Package
    6. 4.6 Signal Descriptions – RGZ Package
  5. 5Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Power Consumption Summary
    5. 5.5  RF Characteristics
    6. 5.6  Receive (RX) Parameters, 861 MHz to 1054 MHz
    7. 5.7  Receive (RX) Parameters, 431 MHz to 527 MHz
    8. 5.8  Transmit (TX) Parameters, 861 MHz to 1054 MHz
    9. 5.9  Transmit (TX) Parameters, 431 MHz to 527 MHz
    10. 5.10 PLL Parameters
    11. 5.11 ADC Characteristics
    12. 5.12 Temperature Sensor
    13. 5.13 Battery Monitor
    14. 5.14 Continuous Time Comparator
    15. 5.15 Low-Power Clocked Comparator
    16. 5.16 Programmable Current Source
    17. 5.17 DC Characteristics
    18. 5.18 Thermal Characteristics
    19. 5.19 Timing and Switching Characteristics
      1. 5.19.1 Reset Timing
        1. Table 5-1 Reset Timing
      2. 5.19.2 Wakeup Timing
        1. Table 5-2 Wakeup Timing
      3. 5.19.3 Clock Specifications
        1. Table 5-3 24-MHz Crystal Oscillator (XOSC_HF)
        2. Table 5-4 32.768-kHz Crystal Oscillator (XOSC_LF)
        3. Table 5-5 48-MHz RC Oscillator (RCOSC_HF)
        4. Table 5-6 32-kHz RC Oscillator (RCOSC_LF)
      4. 5.19.4 Flash Memory Characteristics
        1. Table 5-7 Flash Memory Characteristics
      5. 5.19.5 Synchronous Serial Interface (SSI) Characteristics
        1. Table 5-8 Synchronous Serial Interface (SSI) Characteristics
    20. 5.20 Typical Characteristics
  6. 6Detailed Description
    1. 6.1  Overview
    2. 6.2  Main CPU
    3. 6.3  RF Core
    4. 6.4  Sensor Controller
    5. 6.5  Memory
    6. 6.6  Debug
    7. 6.7  Power Management
    8. 6.8  Clock Systems
    9. 6.9  General Peripherals and Modules
    10. 6.10 Voltage Supply Domains
    11. 6.11 System Architecture
  7. 7Application, Implementation, and Layout
    1. 7.1 Application Information
    2. 7.2 TI Design or Reference Design
  8. 8デバイスおよびドキュメントのサポート
    1. 8.1  デバイスの項目表記
    2. 8.2  ツールとソフトウェア
    3. 8.3  ドキュメントのサポート
    4. 8.4  テキサス・インスツルメンツのローパワーRF Webサイト
    5. 8.5  追加情報
    6. 8.6  コミュニティ・リソース
    7. 8.7  商標
    8. 8.8  静電気放電に関する注意事項
    9. 8.9  Export Control Notice
    10. 8.10 Glossary
  9. 9メカニカル、パッケージ、および注文情報
    1. 9.1 パッケージ情報

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

3 Device Comparison

Table 3-1 lists the device family overview.

Table 3-1 Device Family Overview

DEVICE RADIO SUPPORT FLASH
(KB)		 RAM
(KB)		 GPIOs PACKAGE SIZE
CC1310F128RGZ Proprietary, Wireless M-Bus,
IEEE 802.15.4g		 128 20 30 RGZ (7 mm × 7 mm VQFN48)
CC1310F64RGZ 64 16 30
CC1310F32RGZ 32 16 30
CC1310F128RHB Proprietary, Wireless M-Bus,
IEEE 802.15.4g		 128 20 15 RHB (5 mm × 5 mm VQFN32)
CC1310F64RHB 64 16 15
CC1310F32RHB 32 16 15
CC1310F128RSM Proprietary, Wireless M-Bus,
IEEE 802.15.4g		 128 20 10 RSM (4 mm × 4 mm VQFN32)
CC1310F64RSM 64 16 10
CC1310F32RSM 32 16 10
CC1350 Sub-1 GHz
Bluetooth low energy		 128 20 10-30 RGZ (7 mm × 7 mm VQFN48)
RHB (5 mm × 5 mm VQFN32)
RSM (4 mm × 4 mm VQFN32)
CC2640R2 Bluetooth 5 low energy
2.4-GHz proprietary FSK-based formats		 128 20 10-31 RGZ (7 mm × 7 mm VQFN48)
RHB (5 mm × 5 mm VQFN32)
RSM (4 mm × 4 mm VQFN32)
YFV (2.7 mm × 2.7 mm DSBGA34)
CC1312R Sub-1 GHz
Proprietary, Wireless M-Bus,
IEEE 802.15.4g		 352 80 30 RGZ (7 mm × 7 mm VQFN48)
CC1352R Dual-band (2.4-GHz and Sub-1 GHz) Multiprotocol 352 80 28 RGZ (7 mm × 7 mm VQFN48)
CC2652R Multiprotocol
Bluetooth 5 low energy
Zigbee
Thread
2.4-GHz proprietary FSK-based formats		 352 80 31 RGZ (7 mm × 7 mm VQFN48)