SWRS121E July   2012  – January 2016 CC2560B , CC2564

PRODUCTION DATA.  

  1. 1Device Overview
    1. 1.1 Features
    2. 1.2 Applications
    3. 1.3 Description
    4. 1.4 Functional Block Diagram
  2. 2Revision History
  3. 3Device Comparison
  4. 4Terminal Configuration and Functions
    1. 4.1 Pin Attributes
    2. 4.2 Connections for Unused Signals
  5. 5Specifications
    1. 5.1 Absolute Maximum Ratings
      1. 5.1.1 ESD Ratings
      2. 5.1.2 Power-On Hours
    2. 5.2 Recommended Operating Conditions
    3. 5.3 Power Consumption Summary
      1. 5.3.1 Static Current Consumption
      2. 5.3.2 Dynamic Current Consumption
        1. 5.3.2.1 Current Consumption for Different Bluetooth BR/EDR Scenarios
        2. 5.3.2.2 Current Consumption for Different LE Scenarios
    4. 5.4 Electrical Characteristics
    5. 5.5 Timing and Switching Characteristics
      1. 5.5.1 Device Power Supply
        1. 5.5.1.1 Power Sources
        2. 5.5.1.2 Device Power-Up and Power-Down Sequencing
        3. 5.5.1.3 Power Supplies and Shutdown - Static States
        4. 5.5.1.4 I/O States in Various Power Modes
        5. 5.5.1.5 nSHUTD Requirements
      2. 5.5.2 Clock Specifications
        1. 5.5.2.1 Slow Clock Requirements
        2. 5.5.2.2 External Fast Clock Crystal Requirements and Operation
        3. 5.5.2.3 Fast Clock Source Requirements (-40°C to +85°C)
      3. 5.5.3 Peripherals
        1. 5.5.3.1 UART
        2. 5.5.3.2 PCM
      4. 5.5.4 RF Performance
        1. 5.5.4.1 Bluetooth BR/EDR RF Performance
          1. 5.5.4.1.1 Bluetooth Receiver—In-Band Signals
          2. 5.5.4.1.2 Bluetooth Receiver—General Blocking
          3. 5.5.4.1.3 Bluetooth Transmitter—GFSK
          4. 5.5.4.1.4 Bluetooth Transmitter—EDR
          5. 5.5.4.1.5 Bluetooth Modulation—GFSK
          6. 5.5.4.1.6 Bluetooth Modulation—EDR
          7. 5.5.4.1.7 Bluetooth Transmitter—Out-of-Band and Spurious Emissions
        2. 5.5.4.2 Bluetooth LE RF Performance
          1. 5.5.4.2.1 BLE Receiver—In-Band Signals
          2. 5.5.4.2.2 BLE Receiver—General Blocking
          3. 5.5.4.2.3 BLE Transmitter
          4. 5.5.4.2.4 BLE Modulation
          5. 5.5.4.2.5 BLE Transceiver, Out-Of-Band and Spurious Emissions
  6. 6Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Clock Inputs
      1. 6.3.1 Slow Clock
      2. 6.3.2 Fast Clock Using External Clock Source
        1. 6.3.2.1 External FREF DC-Coupled
        2. 6.3.2.2 External FREF Sine Wave, AC-Coupled
        3. 6.3.2.3 Fast Clock Using External Crystal
    4. 6.4 Functional Blocks
      1. 6.4.1 RF
        1. 6.4.1.1 Receiver
        2. 6.4.1.2 Transmitter
      2. 6.4.2 Host Controller Interface
        1. 6.4.2.1 4-Wire UART Interface—H4 Protocol
        2. 6.4.2.2 3-Wire UART Interface—H5 Protocol (CC2560B and CC2564B Devices)
      3. 6.4.3 Digital Codec Interface
        1. 6.4.3.1 Hardware Interface
        2. 6.4.3.2 I2S
        3. 6.4.3.3 Data Format
        4. 6.4.3.4 Frame Idle Period
        5. 6.4.3.5 Clock-Edge Operation
        6. 6.4.3.6 Two-Channel Bus Example
        7. 6.4.3.7 Improved Algorithm For Lost Packets
        8. 6.4.3.8 Bluetooth and Codec Clock Mismatch Handling
      4. 6.4.4 Assisted Modes (CC2560B and CC2564B Devices)
        1. 6.4.4.1 Assisted HFP 1.6 (WBS)
        2. 6.4.4.2 Assisted A2DP
          1. 6.4.4.2.1 Assisted A2DP Sink
          2. 6.4.4.2.2 Assisted A2DP Source
    5. 6.5 Bluetooth BR/EDR Features
    6. 6.6 Bluetooth LE Description
    7. 6.7 Bluetooth Transport Layers
    8. 6.8 Changes from CC2560A and CC2564 to CC2560B and CC2564B Devices
  7. 7Applications, Implementation, and Layout
    1. 7.1 Reference Design Schematics and BOM for Power and Radio Connections
  8. 8Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Development Support
      2. 8.1.2 Device Nomenclature
    2. 8.2 Documentation Support
    3. 8.3 Related Links
    4. 8.4 Community Resources
    5. 8.5 Trademarks
    6. 8.6 Electrostatic Discharge Caution
    7. 8.7 Glossary
  9. 9Mechanical, Packaging, and Orderable Information
    1. 9.1 mrQFN Mechanical Data
    2. 9.2 Packaging and Ordering
      1. 9.2.1 Package and Ordering Information
      2. 9.2.2 Empty Tape Portion
      3. 9.2.3 Device Quantity and Direction
      4. 9.2.4 Insertion of Device
      5. 9.2.5 Tape Specification
      6. 9.2.6 Reel Specification
      7. 9.2.7 Packing Method
      8. 9.2.8 Packing Specification
        1. 9.2.8.1 Reel Box
        2. 9.2.8.2 Reel Box Material
        3. 9.2.8.3 Shipping Box
        4. 9.2.8.4 Shipping Box Material

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

1 Device Overview

1.1 Features

  • TI's Single-Chip Bluetooth Solution With Bluetooth Basic Rate (BR), Enhanced Data Rate (EDR), and Low Energy (LE) Support; Available in Two Variants:
    • Dual-Mode Bluetooth CC2564 Controller
    • Bluetooth CC2560 Controller
  • CC2564 Bluetooth 4.1 Controller Subsystem Qualified (QDID 58852); Compliant up to the HCI Layer
  • Highly Optimized for Low-Cost Designs:
    • Single-Ended 50-Ω RF Interface
    • Package Footprint: 76 Terminals, 0.6-mm Pitch, 8-mm x 8-mm mrQFN
  • BR/EDR Features Include:
    • Up to 7 Active Devices
    • Scatternet: Up to 3 Piconets Simultaneously, 1 as Master and 2 as Slaves
    • Up to 2 SCO Links on the Same Piconet
    • Support for All Voice Air-Coding – Continuously Variable Slope Delta (CVSD), A-Law, μ-Law, and Transparent (Uncoded)
    • CC2560B/CC2564B Devices Provide an Assisted Mode for HFP 1.6 Wideband Speech (WBS) Profile or A2DP Profile to Reduce Host Processing and Power
    • Support of Multiple Bluetooth Profiles With Enhanced QoS
  • LE Features Include:
    • Support of Up to 10 (CC2564B) Connections
    • Multiple Sniff Instances Tightly Coupled to Achieve Minimum Power Consumption
    • Independent Buffering for LE Allows Large Numbers of Multiple Connections Without Affecting BR/EDR Performance.
    • Built-In Coexistence and Prioritization Handling for BR/EDR and LE
  • Best-in-Class Bluetooth (RF) Performance (TX Power, RX Sensitivity, Blocking)
    • Class 1 TX Power Up to +10 dBm
    • –95 dbm Typical RX Sensitivity
    • Internal Temperature Detection and Compensation to Ensure Minimal Variation in RF Performance Over Temperature, No External Calibration Required
    • Improved Adaptive Frequency Hopping (AFH) Algorithm With Minimum Adaptation Time
    • Provides Longer Range, Including 2x Range Over Other LE-Only Solutions
  • Advanced Power Management for Extended Battery Life and Ease of Design
    • On-Chip Power Management, Including Direct Connection to Battery
    • Low Power Consumption for Active, Standby, and Scan Bluetooth Modes
    • Shutdown and Sleep Modes to Minimize Power Consumption
  • Physical Interfaces:
    • UART Interface With Support for Maximum Bluetooth Data Rates
      • UART Transport Layer (H4) With Maximum Rate of 4 Mbps
      • Three-Wire UART Transport Layer (H5) With Maximum Rate of 4 Mbps (CC2560B and CC2564B Only)
    • Fully Programmable Digital PCM-I2S Codec Interface
  • Flexibility for Easy Stack Integration and Validation Into Various Microcontrollers, Such as MSP430™ and ARM® Cortex®-M3 and Cortex®-M4 MCUs
  • CC256x Bluetooth Hardware Evaluation Tool: PC-Based Application to Evaluate RF Performance of the Device and Configure Service Pack
  • Device Pin-to-Pin Compatible With Previous Devices or Modules

1.2 Applications

  • Mobile Accessories
  • Sports and Fitness Applications
  • Wireless Audio Solutions
  • Remote Controls
  • Toys
  • Test and Measurement
  • Industrial: Cable Replacement
  • Wireless Sensors
  • Automotive Aftermarket
  • Point of Service (POS)
  • Wellness and Health

1.3 Description

The TI CC256x device is a complete Bluetooth BR/EDR/LE HCI solution that reduces design effort and enables fast time to market. Based on TI’s seventh-generation Bluetooth core, the CC256x device provides a product-proven solution that is Bluetooth 4.1 compliant. When coupled with a microcontroller unit (MCU), this HCI device offers best-in-class RF performance with a range of about 2X compared to other Bluetooth LE-only solutions. Furthermore, TI’s power-management hardware and software algorithms provide significant power savings in all commonly used Bluetooth BR/EDR/LE modes of operation.

The TI Dual-Mode Bluetooth Stack software is certified and provided royalty free for TI's MSP430 and ARM Cortex-M3 and Cortex-M4 MCUs. Other MPUs can be supported through TI's third party. iPod® (MFi) protocol is supported by add-on software packages. For more information, see TI Dual-Mode Bluetooth Stack. Some of the profiles supported include the following:

  • Serial port profile (SPP)
  • Advanced audio distribution profile (A2DP)
  • Audio/video remote control profile (AVRCP)
  • Handsfree profile (HFP)
  • Human interface device (HID)
  • Generic attribute profile (GATT)
  • Several Bluetooth LE profiles and services

In addition to software, this solution consists of multiple reference designs with a low BOM cost, including a new Bluetooth audio sink reference design for customers to create a variety of applications for low-end, low-power audio solutions.

Device Information(1)

PART NUMBER PACKAGE BODY SIZE
CC2560A (NRND)(2) RVM (76) 8.0 mm × 8.0 mm × 0.6 mm
CC2560B RVM (76) 8.0 mm × 8.0 mm × 0.6 mm
CC2564 (NRND)(2) RVM (76) 8.0 mm × 8.0 mm × 0.6 mm
CC2564B RVM (76) 8.0 mm × 8.0 mm × 0.6 mm
(1) For more information on these devices, see Section 9.2, Packaging and Ordering.
(2) NRND = Not recommended for new designs

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1.4 Functional Block Diagram

CC2560A CC2560B CC2564 CC2564B SWRS121-001.gif
Note: The following technologies and assisted modes cannot be used simultaneously with the coprocessor: Bluetooth LE, ANT, assisted HFP 1.6 (WBS), and assisted A2DP. One and only one technology or assisted mode can be used at a time.
Figure 1-1 Functional Block Diagram