SWRS158B February 2015 – July 2016 CC2650
PRODUCTION DATA.
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The core modules of the CC26xx product family are shown in the Section 6.2.
The SimpleLink CC2650 Wireless MCU contains an ARM Cortex-M3 (CM3) 32-bit CPU, which runs the application and the higher layers of the protocol stack.
The CM3 processor provides a high-performance, low-cost platform that meets the system requirements of minimal memory implementation, and low-power consumption, while delivering outstanding computational performance and exceptional system response to interrupts.
CM3 features include the following:
The RF Core contains an ARM Cortex-M0 processor that interfaces the analog RF and base-band circuitries, handles data to and from the system side, and assembles the information bits in a given packet structure. The RF core offers a high level, command-based API to the main CPU.
The RF core is capable of autonomously handling the time-critical aspects of the radio protocols (802.15.4 RF4CE and ZigBee, Bluetooth Low Energy) thus offloading the main CPU and leaving more resources for the user application.
The RF core has a dedicated 4-KB SRAM block and runs initially from separate ROM memory. The ARM Cortex-M0 processor is not programmable by customers.
The Sensor Controller contains circuitry that can be selectively enabled in standby mode. The peripherals in this domain may be controlled by the Sensor Controller Engine which is a proprietary power-optimized CPU. This CPU can read and monitor sensors or perform other tasks autonomously, thereby significantly reducing power consumption and offloading the main CM3 CPU.
The Sensor Controller is set up using a PC-based configuration tool, called Sensor Controller Studio, and potential use cases may be (but are not limited to):
NOTE
Texas Instruments provides application examples for some of these use cases, but not for all of them.
The peripherals in the Sensor Controller include the following:
The peripherals in the Sensor Controller can also be controlled from the main application processor.
ANALOG CAPABLE | 7 × 7 RGZ DIO NUMBER |
5 × 5 RHB DIO NUMBER |
4 × 4 RSM DIO NUMBER |
---|---|---|---|
Y | 30 | 14 | |
Y | 29 | 13 | |
Y | 28 | 12 | |
Y | 27 | 11 | 9 |
Y | 26 | 9 | 8 |
Y | 25 | 10 | 7 |
Y | 24 | 8 | 6 |
Y | 23 | 7 | 5 |
N | 7 | 4 | 2 |
N | 6 | 3 | 1 |
N | 5 | 2 | 0 |
N | 4 | 1 | |
N | 3 | 0 | |
N | 2 | ||
N | 1 | ||
N | 0 |
The flash memory provides nonvolatile storage for code and data. The flash memory is in-system programmable.
The SRAM (static RAM) can be used for both storage of data and execution of code and is split into two 4-KB blocks and two 6-KB blocks. Retention of the RAM contents in standby mode can be enabled or disabled individually for each block to minimize power consumption. In addition, if flash cache is disabled, the 8-KB cache can be used as a general-purpose RAM.
The ROM provides preprogrammed embedded TI RTOS kernel, Driverlib and lower layer protocol stack software (802.15.4 MAC and Bluetooth Low Energy Controller). It also contains a bootloader that can be used to reprogram the device using SPI or UART.
The on-chip debug support is done through a dedicated cJTAG (IEEE 1149.7) or JTAG (IEEE 1149.1) interface.
To minimize power consumption, the CC2650 device supports a number of power modes and power management features (see Table 6-2).
MODE | SOFTWARE CONFIGURABLE POWER MODES | RESET PIN HELD | |||
---|---|---|---|---|---|
ACTIVE | IDLE | STANDBY | SHUTDOWN | ||
CPU | Active | Off | Off | Off | Off |
Flash | On | Available | Off | Off | Off |
SRAM | On | On | On | Off | Off |
Radio | Available | Available | Off | Off | Off |
Supply System | On | On | Duty Cycled | Off | Off |
Current | 1.45 mA + 31 µA/MHz | 550 µA | 1 µA | 0.15 µA | 0.1 µA |
Wake-up Time to CPU Active(1) | – | 14 µs | 151 µs | 1015 µs | 1015 µs |
Register Retention | Full | Full | Partial | No | No |
SRAM Retention | Full | Full | Full | No | No |
High-Speed Clock | XOSC_HF or RCOSC_HF |
XOSC_HF or RCOSC_HF |
Off | Off | Off |
Low-Speed Clock | XOSC_LF or RCOSC_LF |
XOSC_LF or RCOSC_LF |
XOSC_LF or RCOSC_LF | Off | Off |
Peripherals | Available | Available | Off | Off | Off |
Sensor Controller | Available | Available | Available | Off | Off |
Wake up on RTC | Available | Available | Available | Off | Off |
Wake up on Pin Edge | Available | Available | Available | Available | Off |
Wake up on Reset Pin | Available | Available | Available | Available | Available |
Brown Out Detector (BOD) | Active | Active | Duty Cycled(2) | Off | N/A |
Power On Reset (POR) | Active | Active | Active | Active | N/A |
In active mode, the application CM3 CPU is actively executing code. Active mode provides normal operation of the processor and all of the peripherals that are currently enabled. The system clock can be any available clock source (see Table 6-2).
In idle mode, all active peripherals can be clocked, but the Application CPU core and memory are not clocked and no code is executed. Any interrupt event will bring the processor back into active mode.
In standby mode, only the always-on domain (AON) is active. An external wake event, RTC event, or sensor-controller event is required to bring the device back to active mode. MCU peripherals with retention do not need to be reconfigured when waking up again, and the CPU continues execution from where it went into standby mode. All GPIOs are latched in standby mode.
In shutdown mode, the device is turned off entirely, including the AON domain and the Sensor Controller. The I/Os are latched with the value they had before entering shutdown mode. A change of state on any I/O pin defined as a wake from Shutdown pin wakes up the device and functions as a reset trigger. The CPU can differentiate between a reset in this way, a reset-by-reset pin, or a power-on-reset by reading the reset status register. The only state retained in this mode is the latched I/O state and the Flash memory contents.
The Sensor Controller is an autonomous processor that can control the peripherals in the Sensor Controller independently of the main CPU, which means that the main CPU does not have to wake up, for example, to execute an ADC sample or poll a digital sensor over SPI. The main CPU saves both current and wake-up time that would otherwise be wasted. The Sensor Controller Studio enables the user to configure the sensor controller and choose which peripherals are controlled and which conditions wake up the main CPU.
The CC2650 supports two external and two internal clock sources.
A 24-MHz crystal is required as the frequency reference for the radio. This signal is doubled internally to create a 48-MHz clock.
The 32-kHz crystal is optional. Bluetooth low energy requires a slow-speed clock with better than
±500 ppm accuracy if the device is to enter any sleep mode while maintaining a connection. The internal
32-kHz RC oscillator can in some use cases be compensated to meet the requirements. The low-speed crystal oscillator is designed for use with a 32-kHz watch-type crystal.
The internal high-speed oscillator (48-MHz) can be used as a clock source for the CPU subsystem.
The internal low-speed oscillator (32.768-kHz) can be used as a reference if the low-power crystal oscillator is not used.
The 32-kHz clock source can be used as external clocking reference through GPIO.
The I/O controller controls the digital I/O pins and contains multiplexer circuitry to allow a set of peripherals to be assigned to I/O pins in a flexible manner. All digital I/Os are interrupt and wake-up capable, have a programmable pullup and pulldown function and can generate an interrupt on a negative or positive edge (configurable). When configured as an output, pins can function as either push-pull or open-drain. Five GPIOs have high drive capabilities (marked in bold in Section 4).
The SSIs are synchronous serial interfaces that are compatible with SPI, MICROWIRE, and Texas Instruments synchronous serial interfaces. The SSIs support both SPI master and slave up to 4 MHz.
The UART implements a universal asynchronous receiver/transmitter function. It supports flexible baud-rate generation up to a maximum of 3 Mbps and is compatible with the Bluetooth HCI specifications.
Timer 0 is a general-purpose timer module (GPTM), which provides two 16-bit timers. The GPTM can be configured to operate as a single 32-bit timer, dual 16-bit timers or as a PWM module.
Timer 1, Timer 2, and Timer 3 are also GPTMs. Each of these timers is functionally equivalent to Timer 0.
In addition to these four timers, the RF core has its own timer to handle timing for RF protocols; the RF timer can be synchronized to the RTC.
The I2C interface is used to communicate with devices compatible with the I2C standard. The I2C interface is capable of 100-kHz and 400-kHz operation, and can serve as both I2C master and I2C slave.
The TRNG module provides a true, nondeterministic noise source for the purpose of generating keys, initialization vectors (IVs), and other random number requirements. The TRNG is built on 24 ring oscillators that create unpredictable output to feed a complex nonlinear combinatorial circuit.
The watchdog timer is used to regain control if the system fails due to a software error after an external device fails to respond as expected. The watchdog timer can generate an interrupt or a reset when a predefined time-out value is reached.
The device includes a direct memory access (µDMA) controller. The µDMA controller provides a way to offload data transfer tasks from the CM3 CPU, allowing for more efficient use of the processor and the available bus bandwidth. The µDMA controller can perform transfer between memory and peripherals. The µDMA controller has dedicated channels for each supported on-chip module and can be programmed to automatically perform transfers between peripherals and memory as the peripheral is ready to transfer more data. Some features of the µDMA controller include the following (this is not an exhaustive list):
The AON domain contains circuitry that is always enabled, except for in Shutdown (where the digital supply is off). This circuitry includes the following:
The CC2650 device can interface to two or three different voltage domains depending on the package type. On-chip level converters ensure correct operation as long as the signal voltage on each input/output pin is set with respect to the corresponding supply pin (VDDS, VDDS2 or VDDS3). lists the pin-to-VDDS mapping.
Package | |||
---|---|---|---|
VQFN 7 × 7 (RGZ) | VQFN 5 × 5 (RHB) | VQFN 4 × 4 (RSM) | |
VDDS(1) | DIO 23–30 Reset_N |
DIO 7–14 Reset_N |
DIO 5–9 Reset_N |
VDDS2 | DIO 0–11 | DIO 0–6 JTAG |
DIO 0–4 JTAG |
VDDS3 | DIO 12–22 JTAG |
N/A | N/A |
Depending on the product configuration, CC26xx can function either as a Wireless Network Processor (WNP—an IC running the wireless protocol stack, with the application running on a separate MCU), or as a System-on-Chip (SoC), with the application and protocol stack running on the ARM CM3 core inside the device.
In the first case, the external host MCU communicates with the device using SPI or UART. In the second case, the application must be written according to the application framework supplied with the wireless protocol stack.