JAJSCF8D August   2016  – July 2019 CC2650MODA

PRODUCTION DATA.  

  1. 1 デバイスの概要
    1. 1.1 特長
    2. 1.2 アプリケーション
    3. 1.3 概要
    4. 1.4 機能ブロック図
  2. 2 改訂履歴
  3. 3 Device Comparison
    1. 3.1 Related Products
  4. 4 Terminal Configuration and Functions
    1. 4.1 Module Pin Diagram
    2. 4.2 Pin Functions
  5. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Power Consumption Summary
    5. 5.5  General Characteristics
    6. 5.6  Antenna
    7. 5.7  1-Mbps GFSK (Bluetooth low energy) – RX
    8. 5.8  1-Mbps GFSK (Bluetooth low energy) – TX
    9. 5.9  IEEE 802.15.4 (Offset Q-PSK DSSS, 250 kbps) – RX
    10. 5.10 IEEE 802.15.4 (Offset Q-PSK DSSS, 250 kbps) – TX
    11. 5.11 24-MHz Crystal Oscillator (XOSC_HF)
    12. 5.12 32.768-kHz Crystal Oscillator (XOSC_LF)
    13. 5.13 48-MHz RC Oscillator (RCOSC_HF)
    14. 5.14 32-kHz RC Oscillator (RCOSC_LF)
    15. 5.15 ADC Characteristics
    16. 5.16 Temperature Sensor
    17. 5.17 Battery Monitor
    18. 5.18 Continuous Time Comparator
    19. 5.19 Low-Power Clocked Comparator
    20. 5.20 Programmable Current Source
    21. 5.21 DC Characteristics
    22. 5.22 Thermal Resistance Characteristics for MOH Package
    23. 5.23 Timing Requirements
    24. 5.24 Switching Characteristics
    25. 5.25 Typical Characteristics
  6. 6 Detailed Description
    1. 6.1  Overview
    2. 6.2  Functional Block Diagram
    3. 6.3  Main CPU
    4. 6.4  RF Core
    5. 6.5  Sensor Controller
    6. 6.6  Memory
    7. 6.7  Debug
    8. 6.8  Power Management
    9. 6.9  Clock Systems
    10. 6.10 General Peripherals and Modules
    11. 6.11 System Architecture
    12. 6.12 Certification
      1. 6.12.1 Regulatory Information Europe
      2. 6.12.2 Federal Communications Commission Statement
      3. 6.12.3 Canada, Industry Canada (IC)
      4. 6.12.4 Japan (JATE ID)
    13. 6.13 End Product Labeling
    14. 6.14 Manual Information to the End User
    15. 6.15 Module Marking
  7. 7 Application, Implementation, and Layout
    1. 7.1 Application Information
      1. 7.1.1 Typical Application Circuit
    2. 7.2 Layout
      1. 7.2.1 Layout Guidelines
  8. 8 Environmental Requirements and Specifications
    1. 8.1 PCB Bending
    2. 8.2 Handling Environment
      1. 8.2.1 Terminals
      2. 8.2.2 Falling
    3. 8.3 Storage Condition
      1. 8.3.1 Moisture Barrier Bag Before Opened
      2. 8.3.2 Moisture Barrier Bag Open
    4. 8.4 Baking Conditions
    5. 8.5 Soldering and Reflow Condition
  9. 9 デバイスおよびドキュメントのサポート
    1. 9.1  デバイスの項目表記
    2. 9.2  ツールとソフトウェア
    3. 9.3  ドキュメントのサポート
    4. 9.4  テキサス・インスツルメンツのローパワーRF Webサイト
    5. 9.5  ローパワーRF eニュースレター
    6. 9.6  コミュニティ・リソース
    7. 9.7  追加情報
    8. 9.8  商標
    9. 9.9  静電気放電に関する注意事項
    10. 9.10 Export Control Notice
    11. 9.11 Glossary
  10. 10メカニカル、パッケージ、および注文情報
    1. 10.1 パッケージ情報
    2. 10.2 PACKAGE OPTION ADDENDUM
      1. 10.2.1 PACKAGING INFORMATION
    3. 10.3 PACKAGE MATERIALS INFORMATION
      1. 10.3.1 TAPE AND REEL INFORMATION

パッケージ・オプション

デバイスごとのパッケージ図は、PDF版データシートをご参照ください。

メカニカル・データ（パッケージ｜ピン）
  • MOH|29
サーマルパッド・メカニカル・データ
発注情報

7.2.1 Layout Guidelines

Use the following guidelines to lay out the CC2650MODA device:

  • The module must be placed close to the edge of the PCB.
  • TI recommends leaving copper clearance on all PCB layers underneath the antenna area, as shown in Figure 7-2 and Figure 7-3.
  • TI recommends using a generous amount of ground vias to stitch together the ground planes on different layers. Several ground vias should be placed close to the exposed ground pads of the module.
  • No external decoupling is required.
  • The reset line should have an external pullup resistor unless the line is actively driven. Placement of this component is not critical.
  • TI recommends leaving a clearance in the top-side copper plane underneath the RF test pads.
CC2650MODA top_layer_Layout_CC2650M.gifFigure 7-2 Top Layer
CC2650MODA bottom_layer_Layout_CC2650M.gifFigure 7-3 Bottom Layer