JAJSCF8D August   2016  – July 2019 CC2650MODA

PRODUCTION DATA.  

1. 1 デバイスの概要
   1. 1.1 特長
   2. 1.2 アプリケーション
   3. 1.3 概要
   4. 1.4 機能ブロック図
2. 2 改訂履歴
3. 3 Device Comparison
   1. 3.1 Related Products
4. 4 Terminal Configuration and Functions
   1. 4.1 Module Pin Diagram
   2. 4.2 Pin Functions
5. 5 Specifications
   1. 5.1  Absolute Maximum Ratings
   2. 5.2  ESD Ratings
   3. 5.3  Recommended Operating Conditions
   4. 5.4  Power Consumption Summary
   5. 5.5  General Characteristics
   6. 5.6  Antenna
   7. 5.7  1-Mbps GFSK (Bluetooth low energy) – RX
   8. 5.8  1-Mbps GFSK (Bluetooth low energy) – TX
   9. 5.9  IEEE 802.15.4 (Offset Q-PSK DSSS, 250 kbps) – RX
   10. 5.10 IEEE 802.15.4 (Offset Q-PSK DSSS, 250 kbps) – TX
   11. 5.11 24-MHz Crystal Oscillator (XOSC_HF)
   12. 5.12 32.768-kHz Crystal Oscillator (XOSC_LF)
   13. 5.13 48-MHz RC Oscillator (RCOSC_HF)
   14. 5.14 32-kHz RC Oscillator (RCOSC_LF)
   15. 5.15 ADC Characteristics
   16. 5.16 Temperature Sensor
   17. 5.17 Battery Monitor
   18. 5.18 Continuous Time Comparator
   19. 5.19 Low-Power Clocked Comparator
   20. 5.20 Programmable Current Source
   21. 5.21 DC Characteristics
   22. 5.22 Thermal Resistance Characteristics for MOH Package
   23. 5.23 Timing Requirements
   24. 5.24 Switching Characteristics
   25. 5.25 Typical Characteristics
6. 6 Detailed Description
   1. 6.1  Overview
   2. 6.2  Functional Block Diagram
   3. 6.3  Main CPU
   4. 6.4  RF Core
   5. 6.5  Sensor Controller
   6. 6.6  Memory
   7. 6.7  Debug
   8. 6.8  Power Management
   9. 6.9  Clock Systems
   10. 6.10 General Peripherals and Modules
   11. 6.11 System Architecture
   12. 6.12 Certification
       1. 6.12.1 Regulatory Information Europe
       2. 6.12.2 Federal Communications Commission Statement
       3. 6.12.3 Canada, Industry Canada (IC)
       4. 6.12.4 Japan (JATE ID)
   13. 6.13 End Product Labeling
   14. 6.14 Manual Information to the End User
   15. 6.15 Module Marking
7. 7 Application, Implementation, and Layout
   1. 7.1 Application Information
      1. 7.1.1 Typical Application Circuit
   2. 7.2 Layout
      1. 7.2.1 Layout Guidelines
8. 8 Environmental Requirements and Specifications
   1. 8.1 PCB Bending
   2. 8.2 Handling Environment
      1. 8.2.1 Terminals
      2. 8.2.2 Falling
   3. 8.3 Storage Condition
      1. 8.3.1 Moisture Barrier Bag Before Opened
      2. 8.3.2 Moisture Barrier Bag Open
   4. 8.4 Baking Conditions
   5. 8.5 Soldering and Reflow Condition
9. 9 デバイスおよびドキュメントのサポート
   1. 9.1  デバイスの項目表記
   2. 9.2  ツールとソフトウェア
   3. 9.3  ドキュメントのサポート
   4. 9.4  テキサス・インスツルメンツのローパワーRF Webサイト
   5. 9.5  ローパワーRF eニュースレター
   6. 9.6  コミュニティ・リソース
   7. 9.7  追加情報
   8. 9.8  商標
   9. 9.9  静電気放電に関する注意事項
   10. 9.10 Export Control Notice
   11. 9.11 Glossary
10. 10メカニカル、パッケージ、および注文情報
    1. 10.1 パッケージ情報
    2. 10.2 PACKAGE OPTION ADDENDUM
       1. 10.2.1 PACKAGING INFORMATION
    3. 10.3 PACKAGE MATERIALS INFORMATION
       1. 10.3.1 TAPE AND REEL INFORMATION