JAJSGW3E April   2019  – December 2024 CC3235S , CC3235SF

PRODUCTION DATA  

  1.   1
  2. 1 特長
  3. 2 アプリケーション
  4. 3 概要
  5. 4 機能ブロック図
  6. 5 Device Comparison
    1. 5.1 Related Products
  7. 6 Pin Configuration and Functions
    1. 6.1 Pin Diagram
    2. 6.2 Pin Attributes
      1.      11
    3. 6.3 Signal Descriptions
      1.      13
    4. 6.4 Pin Multiplexing
    5. 6.5 Drive Strength and Reset States for Analog and Digital Multiplexed Pins
    6. 6.6 Pad State After Application of Power to Device, Before Reset Release
    7. 6.7 Connections for Unused Pins
  8. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Power-On Hours (POH)
    4. 7.4  Recommended Operating Conditions
    5. 7.5  Current Consumption Summary (CC3235S)
      1.      24
      2.      25
    6. 7.6  Current Consumption Summary (CC3235SF)
      1.      27
      2.      28
    7. 7.7  TX Power Control for 2.4 GHz Band
    8. 7.8  TX Power Control for 5 GHz
    9. 7.9  Brownout and Blackout Conditions
    10. 7.10 Electrical Characteristics for GPIO Pins
      1.      33
      2.      34
    11. 7.11 Electrical Characteristics for Pin Internal Pullup and Pulldown
    12. 7.12 WLAN Receiver Characteristics
      1.      37
      2.      38
    13. 7.13 WLAN Transmitter Characteristics
      1.      40
      2.      41
    14. 7.14 WLAN Transmitter Out-of-Band Emissions
      1.      43
      2.      44
    15. 7.15 BLE/2.4 GHz Radio Coexistence and WLAN Coexistence Requirements
    16. 7.16 Thermal Resistance Characteristics for RGK Package
    17. 7.17 Timing and Switching Characteristics
      1. 7.17.1 Power Supply Sequencing
      2. 7.17.2 Device Reset
      3. 7.17.3 Reset Timing
        1. 7.17.3.1 nRESET (32kHz Crystal)
        2.       52
        3.       53
        4. 7.17.3.2 nRESET (External 32kHz Clock)
          1.        55
      4. 7.17.4 Wakeup From HIBERNATE Mode
      5. 7.17.5 Clock Specifications
        1. 7.17.5.1 Slow Clock Using Internal Oscillator
        2. 7.17.5.2 Slow Clock Using an External Clock
          1.        60
        3. 7.17.5.3 Fast Clock (Fref) Using an External Crystal
          1.        62
        4. 7.17.5.4 Fast Clock (Fref) Using an External Oscillator
          1.        64
      6. 7.17.6 Peripherals Timing
        1. 7.17.6.1  SPI
          1. 7.17.6.1.1 SPI Master
            1.         68
          2. 7.17.6.1.2 SPI Slave
            1.         70
        2. 7.17.6.2  I2S
          1. 7.17.6.2.1 I2S Transmit Mode
            1.         73
          2. 7.17.6.2.2 I2S Receive Mode
            1.         75
        3. 7.17.6.3  GPIOs
          1. 7.17.6.3.1 GPIO Output Transition Time Parameters (Vsupply = 3.3V)
            1.         78
          2. 7.17.6.3.2 GPIO Input Transition Time Parameters
            1.         80
        4. 7.17.6.4  I2C
          1.        82
        5. 7.17.6.5  IEEE 1149.1 JTAG
          1.        84
        6. 7.17.6.6  ADC
          1.        86
        7. 7.17.6.7  Camera Parallel Port
          1.        88
        8. 7.17.6.8  UART
        9. 7.17.6.9  SD Host
        10. 7.17.6.10 Timers
  9. 8 Detailed Description
    1. 8.1  Overview
    2. 8.2  Arm® Cortex®-M4 Processor Core Subsystem
    3. 8.3  Wi-Fi® Network Processor Subsystem
      1. 8.3.1 WLAN
      2. 8.3.2 Network Stack
    4. 8.4  Security
    5. 8.5  FIPS 140-2 Level 1 Certification
    6. 8.6  Power-Management Subsystem
    7. 8.7  Low-Power Operating Mode
    8. 8.8  Memory
      1. 8.8.1 External Memory Requirements
      2. 8.8.2 Internal Memory
        1. 8.8.2.1 SRAM
        2. 8.8.2.2 ROM
        3. 8.8.2.3 Flash Memory
        4. 8.8.2.4 Memory Map
    9. 8.9  Restoring Factory Default Configuration
    10. 8.10 Boot Modes
      1. 8.10.1 Boot Mode List
    11. 8.11 Hostless Mode
  10. 9 Applications, Implementation, and Layout
    1. 9.1 Application Information
      1. 9.1.1 BLE/2.4GHz Radio Coexistence
      2. 9.1.2 Antenna Selection
      3. 9.1.3 Typical Application
    2. 9.2 PCB Layout Guidelines
      1. 9.2.1 General PCB Guidelines
      2. 9.2.2 Power Layout and Routing
        1. 9.2.2.1 Design Considerations
      3. 9.2.3 Clock Interface Guidelines
      4. 9.2.4 Digital Input and Output Guidelines
      5. 9.2.5 RF Interface Guidelines
  11. 10Device and Documentation Support
    1. 10.1  サード・パーティ製品に関する免責事項
    2. 10.2  Tools and Software
    3. 10.3  Firmware Updates
    4. 10.4  Device Nomenclature
    5. 10.5  Documentation Support
    6. 10.6  Related Links
    7. 10.7  サポート・リソース
    8. 10.8  Trademarks
    9. 10.9  静電気放電に関する注意事項
    10. 10.10 Export Control Notice
    11. 10.11 用語集
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Packaging Information
      1. 12.1.1 Packaging Option Addendum

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ

6.2 Pin Attributes

The device makes extensive use of pin multiplexing to accommodate the large number of peripheral functions in the smallest possible package. To achieve this configuration, pin multiplexing is controlled using a combination of hardware configuration (at device reset) and register control.

Note:

TI highly recommends using the Pin Mux Tool to obtain the desired pinout. In addition, refer to the user guide within the SimpleLink™ CC32XX Software Development Kit (SDK)

The board and software designers are responsible for the proper pin multiplexing configuration. Hardware does not ensure that the proper pin multiplexing options are selected for the peripherals or interface mode used.

Table 6-1 and Table 6-2 list the pin descriptions and attributes. Table 6-3 lists the signal descriptions. Table 6-4 presents an overall view of pin multiplexing. All pin multiplexing options are configurable using the pin mux registers.

The following special considerations apply:

  • All I/Os support drive strengths of 2mA, 4mA, and 6mA. The drive strength is individually configurable for each pin.
  • All I/Os support 10µA pullup and pulldown resistors.
  • The VIO and VBAT supply must be tied together at all times.
  • By default, all I/Os float in the Hibernate state. However, the software can change the default state.
  • All digital I/Os are non-fail-safe.
Note:

If an external device drives a positive voltage to the signal pads and the CC3235x device is not powered, DC is drawn from the other device. If the drive strength of the external device is adequate, an unintentional wake-up and boot of the CC3235x device can occur. To prevent current draw, TI recommends any one of the following conditions:

  • All devices interfaced to the CC3235x device must be powered from the same power rail as the chip.
  • Use level shifters between the device and any external devices fed from other independent rails.
  • The nRESET pin of the CC3235x device must be held low until the VBAT supply to the device is driven and stable.
  • All GPIO pins default to high impedance unless programmed by the MCU. The bootloader sets the TDI, TDO, TCK, TMS, and Flash_SPI pins to mode 1. All the other pins are left in the Hi-Z state.

 

The ADC inputs are tolerant up to 1.8V (see Table 7-30 for more details about the usable range of the ADC). On the other hand, the digital pads can tolerate up to 3.6V. Hence, take care to prevent accidental damage to the ADC inputs. TI recommends first disabling the output buffers of the digital I/Os corresponding to the desired ADC channel (that is, converted to Hi-Z state), and thereafter disabling the respective pass switches (S7 [Pin 57], S8 [Pin 58], S9 [Pin 59], and S10 [Pin 60]). For more information, see Section 6.5.