JAJSPN3D November 1997 – April 2021 CD54HC125 , CD74HC125
PRODUCTION DATA
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THERMAL METRIC(1) | CD74HC125 | UNIT | ||
---|---|---|---|---|
N (PDIP) | D (SOIC) | |||
14 PINS | 14 PINS | |||
RθJA | Junction-to-ambient thermal resistance | 62.7 | 133.6 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 50.5 | 89.0 | °C/W |
RθJB | Junction-to-board thermal resistance | 42.4 | 89.5 | °C/W |
ΨJT | Junction-to-top characterization parameter | 30.1 | 45.5 | °C/W |
ΨJB | Junction-to-board characterization parameter | 42.2 | 89.1 | °C/W |
RθJC(bot) | Junction-to-case (bottom) thermal resistance | N/A | N/A | °C/W |