JAJSL14D january   1998  – january 2021 CD54HC00 , CD74HC00

PRODUCTION DATA  

  1.   1
  2. 1 特長
  3. 2 アプリケーション
  4. 3 概要
  5.   5
  6.   6
  7. 4 Revision History
  8. 5 Pin Configuration and Functions
    1.     Pin Functions
  9. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Operating Characteristics
    8. 6.8 Typical Characteristics
  10. 7 Parameter Measurement Information
  11. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Balanced CMOS Push-Pull Outputs
    4. 8.4 Standard CMOS Inputs
    5. 8.5 Clamp Diode Structure
    6. 8.6 Device Functional Modes
  12. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
        1. 9.2.1.1 Power Considerations
        2. 9.2.1.2 Input Considerations
        3. 9.2.1.3 Output Considerations
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
  13. 10Power Supply Recommendations
  14. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  15. 12Device and Documentation Support
    1. 12.1 Documentation Support
    2. 12.2 ドキュメントの更新通知を受け取る方法
    3. 12.3 サポート・リソース
    4. 12.4 Trademarks
    5. 12.5 静電気放電に関する注意事項
    6. 12.6 用語集
  16. 13Mechanical, Packaging, and Orderable Information

パッケージ・オプション

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メカニカル・データ（パッケージ｜ピン）
  • D|14
  • N|14
サーマルパッド・メカニカル・データ
発注情報

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
VCC Supply voltage –0.5 7 V
IIK Input clamp current(2) VI < –0.5 V or VI > VCC + 0.5 V ±20 mA
IOK Output clamp current(2) VO < –0.5 V or VO > VCC + 0.5 V ±20 mA
IO Continuous output current VO > –0.5 V or VO < VCC + 0.5 V ±25 mA
Continuous current through VCC or GND ±50 mA
TJ Junction temperature(3) Plastic package 150 °C
Hermetic package or die 175
Lead temperature (soldering 10s) SOIC - lead tips only 300 °C
Tstg Storage temperature –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Rating may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Condition. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
(3) Guaranteed by design.